A defrosting apparatus comprises a heater case comprising a heat pipe seating part formed to extend from one surface thereof in a recessed shape and a heater receiving part formed to extend to be parallel with the heat pipe seating part. The defrosting apparatus also includes a heater which is mounted in the heater receiving part so as to emit heat when power is applied thereto, a heat pipe which has a flow path through which a working fluid filled therein flows, which has a part seated on the heat pipe seating part, and which is disposed to be adjacent to a cooling pipe of an evaporator such that heat is radiated to the cooling pipe of the evaporator by means of the working fluid at a high temperature which is heated by the heater and then is transferred, and a holder which is detachably coupled to the heater case so as to cover the heat pipe seated on the heat pipe seating part.

A heat pipe includes an extruded profile body, with a hollow body closed at the ends, filled with a predefined volume of diphasic working fluid. A plurality of longitudinal channels are included, with each having a section delimited by a bottom formed by one tubular peripheral wall of the profiled body, and laterally by two longitudinal dividers. A circumferential transfer channel, which is arranged transversely to the local axial direction and provides mutual fluid connection between the longitudinal channels, is provided at a position along the longitudinal path and or at an end, where the longitudinal dividers are interrupted, partially or completely, in the area of the circumferential channel, with optional use of a closure ring.

The vapor chamber includes a casing, a working fluid, a microchannel, and a wick. The casing includes an upper casing sheet and a lower casing sheet that face each other and are joined together at an outer edge so as to define an internal space therebetween. The working fluid is sealed in the internal space. The microchannel is in the lower casing sheet and in communication with the internal space so as to form a flow path for the working fluid. The wick is in the internal space of the casing, and is in contact with the microchannel. An area of the wick is larger than an area of a region corresponding to the microchannel in a plan view of the vapor chamber.

A heat dissipation device is provided. The heat dissipation device includes a container including a first plate, and a second plate spaced apart from the first plate to define an interior space, at least one filler disposed between the first plate and the second plate and configured to support the first plate and the second plate, a wick layer located on an inner wall defined in the interior space by the first plate or the second plate, and a working fluid configured to flow in the interior space in a gaseous state, and flow in the wick layer in a liquefied state, wherein the container further includes a fluoride-based polymer having a predetermined gas permeability.

A heat dissipation device is provided and includes a vapor chamber unit, a heat pipe set provided on an outer surface of the vapor chamber unit, a first fin set provided on the outer surface of the vapor chamber unit and sleeving the heat pipe set, and a second fin set stacked on the first fin set and sleeving the heat pipe set, where the fin arrangement direction of the first fin set is different from the fin arrangement direction of the second fin set.

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

A method includes providing a first metal sheet and a second metal sheet, printing a plurality of channels on the first metal sheet, bonding the first metal sheet and the second metal sheet to each other to obtain a fin body, bending a first portion of the fin body to be transverse to a second portion of the fin body, separating the first metal sheet and the second metal sheet from each other to form the plurality of channels, introducing working fluid in the plurality of channels, and sealing the first metal sheet and the second metal sheet.

A vapor chamber structure includes a thermally conductive shell, a capillary structure layer, and a working fluid. The thermally conductive shell includes a first thermally conductive portion and a second thermally conductive portion. The first thermally conductive portion and the second thermally conductive portion are a thermally conductive plate that is integrally formed, and the thermally conductive shell is formed by folding the thermally conductive plate in half and then sealing the thermally conductive plate. The first thermally conductive portion has at least one first cavity, the second thermally conductive portion has at least one second cavity. At least one sealed chamber is defined between the thermally conductive plate, the first cavity and the second cavity. A pressure in the sealed chamber is lower than a standard atmospheric pressure. The capillary structure layer covers an inner wall of the sealed chamber. The working fluid is filled in the sealed chamber.

The present invention relates to a method of manufacturing a cooling device using a heat pipe in which, using casting, the heat pipe is embedded inside a housing, and the method includes a filling step in which a predetermined support member is filled inside a pipe to prevent deformation of the pipe by a pressure of a melt being injected into a cavity of a mold that is closeable, a pipe seating step in which the pipe filled with the predetermined support member is seated in the cavity, a melt injecting step in which the melt is injected into the cavity to surround the pipe, a cooling and withdrawing step in which the injected melt is cooled and a molded product is withdrawn, an injecting step in which a working fluid is injected into the pipe through an injection end, and a finishing step in which, after the injecting step, the pipe is sealed.

A pulse loop heat exchanger, under vacuum, having a working fluid therein, comprising a heat exchanger body, a first continuity plate, and a second continuity plate is provided. The heat exchanger body, first continuity plate comprises a plurality of channels and grooves on different elevated plane levels, respectfully. The different elevated plane levels result in increased output pressure gain in downward working fluid flow portions of the grooves, boosting thermo-fluidic transport oscillation driving forces throughout the heat exchanger. In addition to providing for fluid transport and boosting oscillation driving forces, the third elevated continuity channel also provides an internal reservoir. The heat exchanger is formed by an aluminum extrusion and stamping process and comprises three main steps, a providing step, a closing and welding step, and an insertion, vacuuming and closing step.