An internal structure of vapor chamber is provided. A first plate has an inner surface. A periphery of the first plate has a sealing edge extending outwardly; a level difference exists between the first plate and the sealing edge. Multiple supporting protrusions are formed on the inner surface of the first plate. A second plate has an inner surface spaced apart from the inner surface of the first plate. The brazing structure has a sealing portion and connecting portions, the sealing portion is fixed between the second plate and the sealing edges of the first plate, and the connecting portions are respectively disposed between the corresponding supporting portions of the first plate and of the second plate. The sealing portion is disposed around a periphery of the second plate to align and contact with the sealing edge.

A wick sheet for a vapor chamber includes a sheet body having a first body surface and a second body surface, a first vapor flow channel portion, a liquid flow channel portion provided on the second body surface, and the second vapor flow channel portion provided on the first body surface. The sheet body includes a land portion having the longitudinal direction being a first direction, and the first vapor flow channel portion is disposed around the land portion. The second vapor flow channel portion includes a vapor flow channel groove extending from one of side edges of the land portion to the other side edge in a second direction orthogonal to the first direction.

A slim vapor chamber includes a first plate, a second plate and a capillary structure. The periphery of the second plate is connected with that of the first plate to form a chamber. The capillary structure is disposed on an inner wall of the chamber. Both of a side of the first plate facing the second plate and a side of the second plate facing the first plate are formed with a plurality of supporting structures, which include a plurality of supporting pillars and a plurality of supporting plates, by an etching process.

A liquid-cooling heat dissipation device and a liquid-cooling heat dissipation system for improving heat transfer efficiency are disclosed. The liquid-cooling heat dissipation device includes a vapor chamber, a liquid-separating cover, and a housing. The housing has a cold liquid inlet and a hot liquid outlet. An accommodating cavity is formed between the vapor chamber and the housing. By providing the vapor chamber, the heat transfer efficiency of the liquid-cooling heat dissipation device is improved greatly to realize rapid heat dissipation.

A liquid-cooling heat dissipation device and a liquid-cooling heat dissipation system for improving heat transfer efficiency are disclosed. The liquid-cooling heat dissipation device includes a vapor chamber, a liquid-separating cover, and a housing. The housing has a cold liquid inlet and a hot liquid outlet. An accommodating cavity is formed between the vapor chamber and the housing. By providing the vapor chamber, the heat transfer efficiency of the liquid-cooling heat dissipation device is improved greatly to realize rapid heat dissipation.

A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

A plate vapor chamber array assembly with a plurality of plate vapor chambers joined in an array and each chamber having an evaporation area and an evacuated sealed chamber. The plate vapor chambers may be in direct contact with adjacent plate vapor chambers. A vapor chamber clamp surrounding the array has an inner surface engaging an outer edge of at least two of the plate vapor chambers of the array to press a surface of the plate vapor chamber array directly against the heat source.

A plate vapor chamber array assembly with a plurality of plate vapor chambers joined in an array and each chamber having an evaporation area and an evacuated sealed chamber. The plate vapor chambers may be in direct contact with adjacent plate vapor chambers. A vapor chamber clamp surrounding the array has an inner surface engaging an outer edge of at least two of the plate vapor chambers of the array to press a surface of the plate vapor chamber array directly against the heat source.

A vapor chamber that includes a housing having a first sheet and a second sheet facing each other, wherein at least a part of an outer edge of the housing has a step shape in which an end portion of the second sheet is positioned inside an end portion of the first sheet, and the housing has a bonded portion inside the end portion of the second sheet where the first sheet and the second sheet are bonded to each other; a protective film covering a boundary between the end portion of the second sheet and the first sheet at the step shape; a working fluid enclosed in the housing, and a wick on an inner wall surface of the first sheet or the second sheet.

A liquid-vapor composite heat dissipation system includes a heat exchange device filled with a working fluid, a number of liquid-vapor composite heat dissipation units that are positioned higher than the heat exchange device, each of the liquid-vapor composite heat sink units having a housing with an internal capillary occupying the interior of the housing and partially separating a spatially disconnected inlet chamber and an outlet chamber. The bottom of the housing is attached to a heat source. A liquid supply tube is connected to the heat exchange device at one end, and at the other end to a liquid inlet of each of the liquid-vapor composite heat sink units through each of the liquid supply pipes. A liquid return tube is connected to the heat exchange device at one end, and to each of the liquid-vapor composite heat sink units at the other end through each of the return pipes.