An integrated vapor chamber includes an outer shell and a plurality of composite capillary structures. The outer shell includes a flat casing and a plurality of partitions integrally formed. The flat shell includes a chamber, and the partitions are disposed in the chamber to separate the chamber into a plurality of flow channels. Each composite capillary structure is extended along each flow channel and distributed in the chamber. The composite capillary structure includes a metal mesh and a plurality of sintered powder uniformly sintered in the metal mesh. Furthermore, this disclosure also discloses a manufacturing method of the integrated vapor chamber. Therefore, the manufacturing method of the thin vapor chamber is simplified to improve the yield rate.

A heat-transfer device and methods for forming the heat-transfer device are disclosed. The method includes forming a first green structure using digital light processing, the first green structure including a different porosity in at least two sections. The method also includes exposing the first green structure to heat to remove resin used during the digital light processing from the first green structure. The method further includes sintering the first green structure to form at least a portion of the heat-transfer device.

A method for manufacturing a heat exchanger includes: providing a porous material that has a porosity of about 30% to about 80%; forming an oxide layer on a surface of the porous material by heat treating the porous material at a temperature in a range of 600° C. to 900° C. for a time period in a range of 8 hours to 12 hours in air; and integrating the porous material into a cold side flow passage of the heat exchanger.

Various systems and methods are provided for creating a wicking structure. In one example, a method for creating a wicking structure can include creating, using a 3D printing technique, a macro wicking element including a lattice structure formed by a grid of a first material, the lattice structure including pores formed between the grid of first material. The method can also include creating, using the 3D printing technique, a first micro wicking element including powder particles distributed within the pores of the lattice structure, and creating, using the 3D printing technique, a second micro wicking element by removing at least a portion of the lattice structure.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

A heat conduction structure includes a shell, a wick structure, a separating sheet, and a working fluid. The shell includes a chamber. The chamber is divided into an evaporation room, a condensation room and a connection room formed between the evaporation room and the condensation room. The wick structure covers an inner bottom wall of the chamber. The separating sheet is received in the connection room and stacked on the wick structure. An airflow channel is formed between the separating sheet and the inner top wall of the connection room. The working fluid is disposed in the chamber. Therefore, the liquid working fluid and the gaseous working fluid are split by the separating sheet to increase the heat dissipating efficiency of the heat conduction structure.

A vapor chamber includes a working fluid in an internal space formed between a first metal sheet and a second metal sheet, in which the first metal sheet includes a recessed channel, at least one projecting part, and at least one flow channel groove. The recessed channel is provided at an inner surface of the first metal sheet, the projecting part projects from the inner surface of the first metal sheet toward an inner surface of the second metal sheet, and a top face of the projecting part abuts the inner surface of the second metal sheet. The flow channel groove has a bottom groove part, a side face groove part and a top face groove part. The bottom groove part is provided at a bottom face of the recessed channel, the side face groove part is provided at a side face of the projecting part, and is connected to the bottom groove part, and the top face groove part is provided at the top face of the projecting part, and is connected to the side face groove part.

A vapor chamber that includes: a housing with an internal space between a first sheet and a second sheet; a working fluid in the internal space; a plurality of first projecting portions on an inner wall surface of the first sheet and spaced from each other; a plurality of second projecting portions on an inner wall surface of the first sheet and spaced from each other, an area of a section of each of the second projecting portions perpendicular to a height direction being larger than an area of a section of each of the first projecting portions perpendicular to the height direction; a plurality of pillars on an inner wall surface of the second sheet and spaced from each other and at respective positions overlapping the plurality of second projecting portions; and a wick between and joined to the plurality of pillars and the plurality of second projecting portions.

A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.