The present invention provides an attachment for a server rack cooling system having at least one heat exchange condenser, the attachment includes: a pipe extension configured to connect to a portion of the server rack cooling system at which air and refrigerant are able to be transferred into the attachment from the at least one heat exchange condenser; a valve on the pipe extension configured to allow exhaust to the outside through the pipe extension at an open position and to block exhaust to the outside at a closed position; and an sensor disposed at a position inside of the pipe extension between the at least one heat exchange condenser and the valve and configured to provide a detection signal determined by a presence of fluid at the position of the sensor; wherein, the valve is opened and closed based on the detection signal from the sensor.

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

A heat pipe heat exchanger is used in combination with a damper assembly to selectively control an amount of heat exchange provided. A divider defines discrete heat pipe plenums and bypass plenums within a duct, and the heat pipe system is configured so that all of the coils of one portion of the heat pipe system are received in the heat pipe plenum(s), while the bypass plenum(s) are free of any coils. The damper assembly includes adjustable heat pipe dampers aligned with the heat pipe plenums and adjustable bypass dampers aligned with the bypass plenums.

A heat pipe heat exchanger is used in combination with a damper assembly to selectively control an amount of heat exchange provided. A divider defines discrete heat pipe plenums and bypass plenums within a duct, and the heat pipe system is configured so that all of the coils of one portion of the heat pipe system are received in the heat pipe plenum(s), while the bypass plenum(s) are free of any coils. The damper assembly includes adjustable heat pipe dampers aligned with the heat pipe plenums and adjustable bypass dampers aligned with the bypass plenums.

A thermal management system includes a slurry generator, an injector pump coupled to the slurry generator, a heat exchanger reactor coupled to the injector pump, wherein the heat exchanger reactor is adapted to subject a thermally expendable heat absorption material to a temperature above 60° C. and a pressure below 3 kPa, and wherein the expendable heat absorption material endothermically decomposes into a gaseous by-product. A vapor cycle system is coupled to the heat exchanger reactor and is operatively connected to a thermal load. A thermal energy storage system may be coupled to the vapor cycle system and the thermal load. The thermal energy storage system may isolate the heat exchanger reactor from thermal load transients of the thermal load.

A thermal management system includes a slurry generator, an injector pump coupled to the slurry generator, a heat exchanger reactor coupled to the injector pump, wherein the heat exchanger reactor is adapted to subject a thermally expendable heat absorption material to a temperature above 60° C. and a pressure below 3 kPa, and wherein the expendable heat absorption material endothermically decomposes into a gaseous by-product. A vapor cycle system is coupled to the heat exchanger reactor and is operatively connected to a thermal load. A thermal energy storage system may be coupled to the vapor cycle system and the thermal load. The thermal energy storage system may isolate the heat exchanger reactor from thermal load transients of the thermal load.

A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid reflux means for refluxing the reflux refrigerant liquid to the heat receiving means through the refrigerant passage; and refrigerant-liquid flow control means for controlling a flow rate of the reflux refrigerant liquid.

In a phase-change cooling apparatus including an indoor unit and an outdoor unit, a configuration to prevent dew condensation in the indoor unit causes the cooling performance to decrease; therefore, a refrigerant circulating apparatus according to an exemplary aspect of the present invention includes refrigerant-liquid thermal equilibrium means for mixing a first refrigerant liquid with a second refrigerant liquid and sending a reflux refrigerant liquid composed of the first refrigerant liquid and the second refrigerant liquid, the first refrigerant liquid being a liquid-phase refrigerant included in a gas-liquid two-phase refrigerant flowing in from heat receiving means, the second refrigerant liquid arising due to the gas-liquid two-phase refrigerant cooled by heat radiating means; a refrigerant passage configured for the gas-liquid two-phase refrigerant and the reflux refrigerant liquid to circulate between the heat receiving means and the refrigerant-liquid thermal equilibrium means; refrigerant-liquid reflux means for refluxing the reflux refrigerant liquid to the heat receiving means through the refrigerant passage; and refrigerant-liquid flow control means for controlling a flow rate of the reflux refrigerant liquid.

A device and method are provided for more efficient thermal management of optoelectronic devices. A microfluidic distribution apparatus embedded with the optoelectronic device uses a working fluid in phase change to passively remove heat from an optoelectronic device. The working fluid undergoes phase change through various conversions between a liquid state and a two-phase liquid-vapor state to facilitate evaporation and condensation processes as the working fluid is distributed through micro-structures in the embedded microfluidic distribution apparatus. Passive two-phase cooling provides high thermal performance due to the use of the latent heat of a fluid in phase change, as well as the presence of favorable two-phase flow regimes at micro-scale dimensions.