F28D15/06

HEAT EXCHANGE SYSTEM

The present disclosure provides a heat exchange system including a heat exchange module, a drive module, a buffer module, and a control module. The heat exchange module includes a first circulation pipe. A part of the first circulation pipe is penetrated into a cabinet. The driving module is connected to the heat exchange module and configured to drive a first fluid in the first circulation pipe to flow along the pipeline. The buffer module is in fluid communication with the first circulation pipe and includes a first control valve and a first storage space. The first control valve is between the first circulation pipe and the first storage space. The control module is electrically connected to the drive module and the buffer module. The control module includes a sensing device. The control module controls the first control valve and the drive module.

HEAT EXCHANGE SYSTEM

The present disclosure provides a heat exchange system including a heat exchange module, a drive module, a buffer module, and a control module. The heat exchange module includes a first circulation pipe. A part of the first circulation pipe is penetrated into a cabinet. The driving module is connected to the heat exchange module and configured to drive a first fluid in the first circulation pipe to flow along the pipeline. The buffer module is in fluid communication with the first circulation pipe and includes a first control valve and a first storage space. The first control valve is between the first circulation pipe and the first storage space. The control module is electrically connected to the drive module and the buffer module. The control module includes a sensing device. The control module controls the first control valve and the drive module.

A TWO-PHASE COOLING SYSTEM WITH FLOW BOILING

A two-phase cooling system with flow boiling, characterized in that a closed hydraulic circuit apparatus of a heat transfer refrigerating fluid is provided, including: a pump for a refrigerating fluid which, at least in some stretches of the circuit, is two-phase liquid-vapor or multi-phase; a heat sink-evaporator configured to transfer heat by conduction from a component to be cooled to the refrigerating fluid; a condenser, capable of condensing the vapor which develops on the evaporator while simultaneously dissipating the heat given by the refrigerating fluid both by conduction, convection and radiation and by condensation into the environment; a tank which also acts as an expansion vessel, or a tank and an expansion vessel which are distinct and connected to each other; and a plurality of sensors, including flow rate, pressure and temperature sensors and an electronic control system of the pump.

Cooling systems and methods
11778783 · 2023-10-03 · ·

The present disclosure provides methods and systems for cooling a heat source. Systems for cooling a heat source may comprise a closed loop fluid flow path under vacuum. The closed loop fluid flow path may comprise one or more channels, coolant, a condenser, and one or more cooling interfaces. The closed loop fluid flow path may comprise a shut-off valve for directing coolant to the at least one cooling interface. During use, a heat source may be cooled by directing a liquid coolant to a cooling interface to form a vapor coolant, directing a vapor coolant from the cooling interface to the condenser, and subjecting the vapor coolant to phase transition to regenerate the liquid coolant.

Cooling systems and methods
11778783 · 2023-10-03 · ·

The present disclosure provides methods and systems for cooling a heat source. Systems for cooling a heat source may comprise a closed loop fluid flow path under vacuum. The closed loop fluid flow path may comprise one or more channels, coolant, a condenser, and one or more cooling interfaces. The closed loop fluid flow path may comprise a shut-off valve for directing coolant to the at least one cooling interface. During use, a heat source may be cooled by directing a liquid coolant to a cooling interface to form a vapor coolant, directing a vapor coolant from the cooling interface to the condenser, and subjecting the vapor coolant to phase transition to regenerate the liquid coolant.

Aeronautical equipment
11772830 · 2023-10-03 · ·

This aeronautical equipment for an aircraft, comprising a part configured to be positioned at the level of a skin of the aircraft and means for reheating this part comprising a closed-circuit thermodynamic loop in which a phase-change heat transfer fluid circulates, is wherein it includes means for monitoring the fluid pressure in the loop in order to detect and report a malfunction of the equipment.

ELECTRONIC DEVICE
20230135191 · 2023-05-04 ·

An electronic device includes a loop type heat pipe including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop type heat pipe, a heat dissipation plate thermally connectable to the loop type heat pipe, a second magnet provided to the heat dissipation plate and provided to face the first magnet, and a support member that supports the heat dissipation plate movably between a position in which the heat dissipation plate is thermally connected to the loop type heat pipe and a position in which the heat dissipation plate is not thermally connected to the loop type heat pipe.

BASIC STRUCTURAL BODY FOR CONSTRUCTING HEAT DISSIPATION DEVICE AND HEAT DISSIPATION DEVICE
20220412666 · 2022-12-29 ·

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

BASIC STRUCTURAL BODY FOR CONSTRUCTING HEAT DISSIPATION DEVICE AND HEAT DISSIPATION DEVICE
20220412666 · 2022-12-29 ·

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

Ammonia filling system

A filling system that has a chamber, at least one heat pipe used for heat transfer and extending along the chamber, at least one ammonia tube that pure ammonia is able to be stored at room temperature as saturated vapour, at least one delivery line that enables to deliver ammonia from the ammonia tube to the heat pipe and the heat pipe is removably engaged, at least one valve is located on the delivery line and allows ammonia flow to controlled, at least one detector located on the delivery line and providing seal control, at least one heater to heat the heat pipe, and at least one cooler to cool the heat pipe.