F28D2021/0028

PASSIVE THERMAL MANAGEMENT SYSTEM WITH PHASE CHANGE MATERIAL
20170303433 · 2017-10-19 ·

Thermal management systems are described herein. A thermal management system includes components of a computing device. The computing device includes a heat generating component and a heat spreader physically connected to the heat generating component. The heat spreader includes a first surface and a second surface. The second surface is closer to the heat generating component than the first surface is to the heat generating component. The computing device also includes a layer of phase change material on at least a portion of the first surface, the second surface, or the first surface and the second surface of the heat spreader.

DOUBLE-SIDED COOLER FOR COOLING BOTH SIDES OF ELECTRONIC COMPONENT
20170336152 · 2017-11-23 ·

A double-sided cooler for cooling both sides of a component where heat is generated includes: a plurality of radiating parts including a plurality of cooling channels through which a coolant flows, the radiating parts being adhered to first and second sides of the component, respectively, and a hollow connection part for mixing the coolant discharged from the cooling channels of one radiating part adhered to the first side of the component to supply the mixed coolant to the cooling channels of another radiating part adhered to the second side of the component, the connection part continuously formed from each radiating part to have the same shape of each radiating part to minimize pressure loss.

THERMAL CONDUCTING STRUCTURE
20170292793 · 2017-10-12 ·

A thermal conducting structure includes a vapor chamber and at least one heat pipe. The vapor chamber has a casing with a through hole formed on a side of the casing, and a chamber defined inside the casing and communicated with the through hole and having a metal mesh covered on an inner wall of the chamber. The heat pipe has a tubular body and an opening formed at an end of the tubular body, and the tubular body is connected to the through hole, and a cavity is defined inside the tubular body. A capillary member is covered onto an inner wall of the cavity. The metal mesh is passed out from the opening to connect the capillary member. The metal mesh is used as a capillary structure, and the vapor chamber and heat pipe are used together to provide a better cooling efficiency.

Heat Pipe

A heat pipe includes a container in which a corrugated portion is formed, the container having a hollow portion formed therein that is sealed, a wick structure provided on an inner peripheral surface of the hollow portion and a working fluid enclosed in the hollow portion. The wick structure has a vapor channel penetrating therethrough in a longitudinal direction of the hollow portion, the wick structure producing a capillary force. The wick structure is a sintered body of a powder metal material and projected into a crest portion of the corrugated portion. The wick structure is provided at a region in the crest portion of the corrugated portion and at a position of a trough portion of the corrugated portion.

EVAPORATOR AND LOOP HEAT PIPE

An evaporator that changes at least a part of a working fluid from a liquid phase into a gas phase by using heat of a heat-generating element includes: a housing including at least one working fluid inlet and at least one working fluid outlet and defining a working fluid-receiving chamber that receives the working fluid; a heat-absorbing element located at a bottom surface of the housing and thermally connected to the heat-generating element; and a wall structure rising from a boiling surface in the working fluid-receiving chamber and dividing a bottom region of the working fluid-receiving chamber into a plurality of segments to form a plurality of recesses located in the bottom region of the working fluid to trap the working medium.

Compact thermal control plate
11428479 · 2022-08-30 · ·

Embodiments are disclosed of a thermal control plate including a cooling layer and a heating layer. The cooling layer includes a thermally conductive base adapted to be thermally coupled to one or more heat-generating electronic components, cooling fins thermally coupled to the base, and a cooling cover plate coupled to the ends of the plurality of cooling fins. The thermally conductive base, the cooling cover plate, and the plurality of cooling fins form a plurality of cooling channels through which a working fluid can flow. The heating layer includes a heater, heating fins thermally coupled to the heater, and a heating cover plate coupled to the ends of the plurality of heating fins. The heater, the heating cover plate, and the heating fins form a plurality of heating channels through which the working fluid can flow. A fluid distribution can distribute the working fluid into the heating channels and cooling channels.

Device for indirectly cooling battery module of eco-friendly vehicle

A device for indirectly cooling a battery module of an eco-friendly vehicle is provided that cools the battery module using an interfacial plate into which a heat pipe is inserted to maximize battery heat emission performance and simultaneously prevent degradation of battery performance. A thermally-conductive interfacial plate in which a heat pipe is embedded by over-molding is disposed between battery cells and a heat sink, which is a condensation unit, integrally connected to an upper end of the heat pipe is disposed in a cooling air flow path to improve contact strength between the interfacial plate and the battery cells. A planar heat emitter is disposed between the battery cells where the interfacial plate is not disposed to heat the battery to a proper-level temperature in a cold-start environment and a low-temperature environment, thereby improving battery performance and preventing degradation in vehicle power.

Onboard electronic device
09728488 · 2017-08-08 · ·

An onboard electronic device includes: an element that generates heat; a member that is provided between the element and a coolant cooling the element, and differs in thermal expansion coefficient from the element; an element temperature sensor that detects the temperature of the element; a coolant temperature sensor that detects the temperature of the coolant; and a controller that controls operation of the element such that the temperature of the element allowed when the temperature of the coolant is a first temperature is lower than the temperature of the element allowed when the temperature of the coolant is a second temperature that is higher than the first temperature.

Liquid cooling device and projection device
20220034591 · 2022-02-03 ·

A liquid cooling device includes a first liquid cooling row having a first inflow end and a first outflow end for liquid to flow in a first direction, a second liquid cooling row having a second inflow end and a second outflow end, and a fan. The second liquid cooling row is disposed opposite to the first liquid cooling row. The second inflow end is connected to the first outflow end for the liquid flowing out from the first outflow end to flows in a second direction opposite to the first direction. Airflow generated by the fan sequentially flows through the second and first liquid cooling rows to cool the liquid. A projection device having the liquid cooling device is also provided.

DEVICE FOR COOLING ONE OR MORE ELECTRICAL POWER STORAGE MODULES

The invention concerns a cooling device and a battery pack comprising a heat exchanger (10), comprising a first plate (1) forming a so-called bottom face of the exchanger and a second plate (2) forming a second so-called top face of the exchanger, the first and second plates comprising, between them, coolant circulation channels (3) formed in a thickness of the exchanger between the first plate and the second plate, in which the first plate comprises at least one tubular socket (4), for receiving a fluid collection end-piece (5), extending from an outer face of the first plate towards the inside of the exchanger, the second plate comprising at least one boss (6) on the top face of the exchanger and producing a recess (7) that locally increases the thickness of the exchanger on the inner face of the second plate, the recess accommodating the socket and forming a fluid passage between one end (4a) of the socket in the recess and at least one channel (3) of the exchanger.