A heat exchanger comprises a stack of mutually spaced apart plates. The plates are separated by respective spacings therebetween. Alternate spacings respectively provide a flow path for a first fluid and a second fluid. The heat exchanger further comprises a first header for inflow of the first fluid and a second header for outflow of the first fluid. The first and second headers are connected to the plate stack by flexible tubular ducting means.

A liquid cooling apparatus has a chassis, a cover mounted on the chassis, and a dividing structure disposed in an inner chamber defined between the chassis and the cover. The dividing structure divides the inner chamber into a liquid inlet compartment and a liquid outlet compartment. The liquid inlet compartment communicates with the liquid outlet compartment via the recess. The liquid cooling apparatus can be installed on a first panel with the boss of the chassis mounted through a through hole of the first panel and thermally attached to a heat source on a second panel. A working fluid that flows into the liquid inlet compartment is forced to flow into the recess before flowing to the liquid outlet compartment by the dividing structure. Accordingly, heat generated by the heat source can be effectively dissipated.

The heat sink with slotted pin fins includes a thermally conductive base and a plurality of pin fins, which may be substantially cylindrical. Each pin fin has axially opposed upper and lower ends, the lower ends being attached to the base. Each of the pin fins is formed of a thermally conductive material and extends from the base. Each of the pin fins has a slot formed therein extending both diametrically and axially through the pin fin, such that a surrounding fluid medium can flow through the slot formed through pin fin, thus reducing the drag force on the surrounding fluid medium as it impinges upon and flows through the pin fins, increasing the rate of thermal transfer.

A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device. The isotropic thermally conductive section(s) allows heat spreading/removal from hotspots or areas with high-power density and the anisotropic thermally conductive section(s) transfers heat away from the at least one integrated circuit device predominately in a single direction with minimum conduction resistance in areas with uniform power density distribution, while reducing heat transfer in the other directions, thereby reducing thermal cross-talk.

A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets and a metal mesh. According to the method, the two titanium metal sheets and the metal mesh are subjected to a surface treatment, so that surface of any one of the titanium metal sheets and the metal mesh is modified to form a hydrophilic layer. With these arrangements, the titanium metal material can be freely plastically deformed and possess a capillary force, and the titanium metal sheet can therefore be used in place of the conventional copper sheet to serve as a material for making heat dissipation devices. The heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

A radiator is provided having high heat dissipation performance while being compact and lightweight. A radiator 1 is configured from a base portion 4 having a heat receiving surface 2 abutting on a heat generating element, such as a semiconductor device and an electronic component, and a heat transfer surface 3 opposed to the heat receiving surface 2 and a fin 5 extending from the heat transfer surface 3 of the base portion 4. In the radiator 1 thus configured, the fin 5 is configured from a fin base 5a extending from the heat transfer surface 3 and a plurality of heat diffusing projections 8 and 9 formed on a surface of the fin base 5a.

A cold plate, comprises: a housing having a surface providing a thermal interface for cooling an electronic device; a channel within the housing proximate to the surface for a liquid coolant to flow therethough such that heat received by the thermal interface is transferred to the liquid coolant; and a coolant port extending outside the housing, for transferring liquid coolant to and/or from the channel. A cross-sectional area of an outlet from the coolant port to the channel may be no larger than that of the channel at the outlet. Pins and/or fins may be arranged within the channel adjacent to the coolant port. The coolant port may cause liquid coolant to enter and/or exit the channel in a direction perpendicular to the surface. The coolant port may comprise an independent rotating fluid connector thereby allowing adjustment in the direction of a pipe coupled to the coolant port.

A cooling arrangement, for cooling power devices such as semiconductor power devices, comprises a housing having sidewalls around the periphery of a baseplate, and a capping plate opposing the baseplate. The housing forms a cavity through which cooling fluid may flow between an inlet and an outlet disposed in the housing. Within the cavity is provided one or more baffles that are arranged to force the cooling fluid flowing between the inlet and outlet along a labyrinthine path through the cavity. At least one of the baffles comprises at least one through-hole, which permit cooling fluid to pass there through from one side of the baffle to the other.

A heat transfer device includes at least one channel including an upstream zone, a downstream zone, and a mixing zone intermediate the upstream and downstream zones. The upstream zone includes an upstream separating configuration arranged to separate an inflow to the upstream zone into a plurality of upstream sub-flows. The mixing zone includes a converging configuration arranged to converge at least two upstream sub-flows into the mixing zone to form a primary mixed flow.

In a method for the production of a cooling plate from a material having thermal conductivity, a workpiece in the form of a flat material blank with uniform material thickness is placed into a tool. The workpiece is pressed in a first stage by an inner punch of the tool to form in cooperation with pin forming openings of the tool pins upon an effective surface swept by the coolant, as the workpiece is held down by an outer punch of the tool, such that the pins protrude approximately perpendicular over a base area of the workpiece. In a second stage, the workpiece is pressed by the outer punch such as to form an essentially radially extending, flat peripheral edge of reduced material thickness in surrounding relation to the pins, as the workpiece with the formed pins is held down by the inner punch of the tool.