A heat exchanger for a transmission unit of an aircraft is described that comprises: a first module defining a first feed path for a first fluid to be cooled; a second module defining a second feed path for a second cooling fluid; the first and second feed paths being thermally coupled to each other; each second module comprising: at least one cell formed by an inlet for a second cooling fluid; an outlet for the second cooling fluid, which is arrange on the opposite side to the inlet along a first direction; a first wall thermally coupled to the first path; a pair of second walls; and a plurality of fins projecting in a cantilever fashion from the first wall. The heat exchanger further comprises at least a first row of fins, which lie on a plane orthogonal to the first direction, the fins of the first row extending at progressively increasing distances from one of the second walls along a second direction orthogonal to the first direction.

The disclosure relates to a heat exchange compound module and a manufacturing method for a heat exchange compound module. The heat exchange compound module comprises a metal-ceramic substrate and a heat exchange structure. The metal-ceramic substrate comprises an outer layer of a first metallic material. The heat exchange structure is made of a second metallic material and is connected to the outer layer of the metal-ceramic substrate only by an eutectic bond between the first metallic material and the second metallic material.

A power module apparatus includes a power module having a package configured to seal a perimeter of a semiconductor device, and a heat radiator bonded to one surface of the package; a cooling device having a coolant passage through which coolant water flows, in which the heat radiator is attached to an opening provided on a way of the coolant passage, wherein the heat radiator of the power module is attached to the opening of the cooling device so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.

There is provided a heat sink in which the thermal resistance from a portion where the heat sink directly or indirectly makes contact with a heat-generating device to a portion where the heat sink makes contact with a coolant is set to be a value that is different from the thermal resistance at a different position in the flowing direction of the coolant, so that it is made possible to suppress the temperature difference between the upstream end and the downstream end of the heat-generating device.

A power module apparatus includes a power module having a package configured to seal a perimeter of a semiconductor device, and a heat radiator bonded to one surface of the package; a cooling device comprising a coolant passage through which coolant water flows, in which the heat radiator is attached to an opening provided on a way of the coolant passage, wherein the heat radiator of the power module is attached to the opening of the cooling device so that a height (ha) and a height (hb) are substantially identical to each other. The power module in which the heat radiator is attached to the opening formed at the upper surface portion of the cooling device can also be efficiently cooled, and thereby it becomes possible to reduce degradation due to overheating.

The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.

A method of forming a component for a heat exchanger is disclosed. The method comprises machining a portion of a metal sheet to form a plurality of protrusions, and forming apertures in the portion of the metal sheet so as to form a plurality of ribs defined by adjacent ones of the apertures, wherein at least one protrusion is located on each of said ribs.

A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.

A method of making a heat exchanger with a net shape moldable highly thermally conductive polymer composite includes mixing a polymer and a thermally conductive filler material and molding the polymer composite into heat exchanger components. The heat exchanger can be tailored to varying heating and cooling needs with moldable geometries.

An apparatus is disclosed. The apparatus has a cooling fluid passage, a gaseous fluid blower disposed at an upstream portion or a downstream portion of the cooling fluid passage, and a liquid droplet sprayer disposed at the upstream portion of the cooling fluid passage. A surface portion of the cooling fluid passage is hydrophobic.