A heating panel includes a lower panel mounted on the floor and an upper panel serving as a cover of the lower panel. The lower panel includes: a plurality of first guides protruding upward from the bottom surface to guide installation of a heating hose; and a first air passage formed as a groove on the bottom surface and the surface of the first guide, and further includes a plurality of second guides protruding upward from the bottom surface, having the first air passage on the surface thereof, and disposed between the plurality of first guides to guide installation of the heating hose. The upper panel is coupled to the lower panel and includes: a second air passage formed on the bottom surface in a groove form; and a second fastening member coupled with the first fastening member.

A radiative heatsink includes a cold plate, a radiator mounted to the cold plate and a thermal compound located between and coupling the heat source to the cold plate. The thermal compound converts a portion of a first phononic thermal energy from the heat source into a first photonic near-field and a first photonic far-field thermal radiation and transfers the first photonic near-field, the first photonic far-field and the remaining of the first phononic thermal energy to the cold plate. The cold plate combines the first photonic near-field, the first photonic far-field and the remaining first phononic thermal energy into a second phononic thermal energy and provides the second phononic thermal energy to the radiator. The radiator converts the second phononic thermal energy into a second photonic near-field and a second photonic far-field and emits the second photonic near-field or the second photonic far-field such that cold plate is regenerated.

A radiative heatsink includes a cold plate, a radiator mounted to the cold plate and a thermal compound located between and coupling the heat source to the cold plate. The thermal compound converts a portion of a first phononic thermal energy from the heat source into a first photonic near-field and a first photonic far-field thermal radiation and transfers the first photonic near-field, the first photonic far-field and the remaining of the first phononic thermal energy to the cold plate. The cold plate combines the first photonic near-field, the first photonic far-field and the remaining first phononic thermal energy into a second phononic thermal energy and provides the second phononic thermal energy to the radiator. The radiator converts the second phononic thermal energy into a second photonic near-field and a second photonic far-field and emits the second photonic near-field or the second photonic far-field such that cold plate is regenerated.

A heat sink includes a base plate; a cover overlapping the base plate; fins, each having a plate-like shape projecting from the base plate in a direction perpendicular to the base plate, located between the base plate and the cover; one or a plurality of first fin groups composed of a plurality of the fins arranged with a gap therebetween in a first direction; and one or a plurality of second fin groups composed of a plurality of the fins arranged with a gap therebetween in the first direction, and adjacent to the first fin group with a gap therebetween in a second direction. Positions in the first direction of the fins belonging to the second fin group are displaced with respect to positions in the first direction of the fins belonging to the first fin group. Each of the fines has an S-shape.

A heat sink includes a base plate; a cover overlapping the base plate; fins, each having a plate-like shape projecting from the base plate in a direction perpendicular to the base plate, located between the base plate and the cover; one or a plurality of first fin groups composed of a plurality of the fins arranged with a gap therebetween in a first direction; and one or a plurality of second fin groups composed of a plurality of the fins arranged with a gap therebetween in the first direction, and adjacent to the first fin group with a gap therebetween in a second direction. Positions in the first direction of the fins belonging to the second fin group are displaced with respect to positions in the first direction of the fins belonging to the first fin group. Each of the fines has an S-shape.

A heat sink device including: a cover module having a liquid inlet; a central flow channel for distributing coolant fluid introduced into the liquid inlet of the cover module; a plurality of inner fins; a plurality of inner radial flow channels; wherein coolant fluid from the central flow channel flows into the inner radial flow channels; a ring segment disposed around an outer perimeter of the plurality of inner fins, wherein the ring segment is configured to at least one of, mix and distribute coolant fluid received from the inner radial flow channels; a plurality of outer fins; a plurality of outer radial flow channels; wherein coolant fluid from the ring segment flows into the outer radial flow channels; and an outer flow channel, wherein coolant fluid flowing out of the radial flow channels outlet drains into the outer flow channel.

A method for forming a heat exchanger plate includes: securing a wave form metallic sheet to a heat exchanger plate substrate, the substrate comprising a first face and a second face opposite the first face, the securing of the wave form metallic sheet being to the first face; and removing peaks of the sheet.

A method for forming a heat exchanger plate includes: securing a wave form metallic sheet to a heat exchanger plate substrate, the substrate comprising a first face and a second face opposite the first face, the securing of the wave form metallic sheet being to the first face; and removing peaks of the sheet.

A heat exchange plate for a plate heat exchanger, and a plate heat exchanger having the heat exchange plate. The heat exchange plate includes: a heat exchange plate body; and a ring-shaped flange projecting obliquely from an edge of the heat exchange plate body. The flange has a protrusion having a reinforcing action. The heat exchange plate and plate heat exchanger according to embodiments of the present invention can, for example, improve the quality of the heat exchange plate of the heat exchanger.

A heat sink includes a heat sink fin (HSF), a first heat sink plate (HSP), and a second HSP that is opposite to the first HSP. The HSF is located on the first HSP. The second HSP is flexible. Further, an elastic component is disposed between the first HSP and the second HSP. The second HSP is in contact with a heat source component (HSC). Thus, when the heat sink is placed on the HSC, the second HSP contacts the HSC, the second HSP is deformed because the heat sink and the HSC are pressed against each other, and the elastic component between the first HSP and the second HSP is compressed such that heat generated by the HSC is transferred to the heat sink.