Various aspects as described herein are directed to a radiative cooling device and method for cooling an object. As consistent with one or more embodiments, a radiative cooling device includes a solar spectrum reflecting structure configured and arranged to suppress light modes, and a thermally-emissive structure configured and arranged to facilitate thermally-generated electromagnetic emissions from the object and in mid-infrared (IR) wavelengths.

A cryogenic cooling system is provided comprising: a cooled plate (2) thermally coupled to a cryogenic refrigerator (9), a heat switch assembly and a target assembly (5). The target assembly (5) comprises a target refrigerator (12) configured to obtain a lower base temperature than the cryogenic refrigerator (9). The heat switch assembly (18) comprises one or more gas gap heat switches, the heat switch assembly (18) having a first end thermally coupled to the cooled plate (2) and a second end thermally coupled to the target assembly (5). A sorption pump (22) is provided for controlling the thermal conductivity across the heat switch assembly (18) in accordance with the temperature of the sorption pump (22) The sorption pump (22) is thermally coupled to the cryogenic refrigerator (9), by a thermal link (46) extending from the cooled plate (2) to the heat switch assembly (18). The sorption pump (22) is arranged at a position along the thermal link (46) between the heat switch assembly 18 and the cooled plate (2).

Various embodiments include a thermal storage system for storing energy in a graphite thermal storage structure and a thermal shutter assembly configured to control the transmission of heat from the graphite thermal storage structure to a thermal energy receiver, such as a heat exchanger or material processing crucible. A thermal storage block, which may be made of graphite, may be isolated by insulation except for the thermal shutter assembly. Energy may be stored in the graphite thermal storage block by applying energy to the block to raise its temperature to maximum operation temperature. Stored energy may then be harvested in a controlled manner by a control system actuating the thermal shutter to expose the thermal energy receiver to thermal radiation.

An apparatus includes multiple thermal actuator switches configured to control a transfer of thermal energy. The thermal actuator switches are arranged in a stacked configuration. Each switch includes first and second plates and a piston movable between the plates. Each switch also includes a phase change material configured to (i) expand to move a surface of the piston into a first position and (ii) contract to allow the surface of the piston to move into a second position. The surface of the piston thermally contacts the first plate and increases thermal energy transfer between the plates when in one of the first and second positions. The surface of the piston is spaced apart from the first plate and decreases thermal energy transfer between the plates when in another of the first and second positions. Different ones of the switches include different phase change materials that expand or contract at different temperatures.

Method for controlling heat transfer between a mainly solid base and the ambient medium

This invention belongs to the field of construction of shielding and heat-shielding structures. The technical result is changing the degree of useful effect from the regulation of heat transfer depending on the temperature of the plates of the heat control structure.

In the method for regulating heat transfer between a mainly solid base and ambient medium, one plate (2) or at least two plates (2, 5) stacked in layers and interconnected are installed on base (1) at rest temperature, while at least one (2) of the said plates, when its temperature changes relative to the rest temperature, is capable of deforming so that a cavity is formed between this plate and the base or the plate adjacent in the layer, filled with particles of the ambient medium, and fixation points (3) of plate (2) to base (1) or plate (5) adjacent in the layer are selected so that this plate (2) takes a convex shape during deformation.

12 dependent claims, 10 figures.

A heat conduction device includes a heat source portion, a temperature control surface, and heat transfer portions. The heat source portion is configured to generate at least hot heat or cold heat. The temperature control surface is sectioned into a plurality of temperature control sections, and at least some of the plurality of temperature control sections are disposed away from the heat source portion. The plurality of heat transfer portions connect the heat source portion and the plurality of the temperature control sections to transfer heat between the heat source portion and the plurality of temperature control sections. The plurality of temperature control sections are separated from each other based on a distance from the heat source portion.

The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and/or out of a building.

A cooling apparatus includes first and second wedges, a solid thermal interface material (TIM) and a flexible force-exerting element. The first wedge has a first flat surface and a first diagonal surface. The first flat surface is configured to dissipate heat from an electronic device. The second wedge has a second flat surface and a second diagonal surface. The second diagonal surface faces the first diagonal surface, and the second flat surface is coupled to a heat sink and configured to dissipate heat thereto. The TIM is disposed between the first and second diagonal surfaces, and is configured to transfer heat between the first and second wedges. The force-exerting element is configured to move the first wedge or the second wedge, so as to slide the first diagonal surface or the second diagonal surface on the TIM and push the second flat surface against the heat sink.

An apparatus for heat dissipation is provided comprising a heat source, a heat sink and a heat conducting element, wherein the heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and wherein the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus are disclosed.

Embodiments for a heat pipe heat flux rectifier are provided. One embodiment includes a first curved diode heat pipe that includes an adiabatic section that includes a curved portion, an evaporator section that is coupled to the adiabatic section, and a condenser section that is coupled to the adiabatic section. In some embodiments, the first curved diode heat pipe includes a non-condensable gas reservoir that is coupled to the condenser section for storing non-condensable gas, where the first curved diode heat pipe stores a fluid and a wicking material. In some embodiments, the first curved diode heat pipe operates as a thermal conductor when heat is applied to the evaporator section and as a thermal insulator when heat is applied to the condenser section.