A system for sensor thermal management and stabilization comprises a sensor block, one or more sensors mounted on the sensor block, one or more heaters mounted on the sensor block, a chassis coupled to the sensor block, a thermal conductor moveably coupled between the sensor block and the chassis, and a thermal control actuation mechanism operatively connected to the thermal conductor. The thermal control actuation mechanism is operative to cause the thermal conductor to vary a total thermal conductance from the sensor block to the chassis by moving the thermal conductor toward the chassis or away from the chassis. The total thermal conductance is varied to provide an optimized thermal stability and optimized environmental range of applicability for the one or more sensors.

The inventive concept relates to a substrate cooling apparatus for cooling a substrate. The substrate cooling apparatus includes a chuck on which the substrate is placed and a cooling unit that cools the chuck. The cooling unit includes a heat dissipation plate that has the chuck placed on an upper surface thereof and that dissipates heat of the chuck.

A thermal rectifier includes a first panel, a second panel, and a switching mechanism. The switching mechanism includes a first thermally conductive portion thermally connected to the first panel and a second thermally conductive portion thermally connected to the second panel. The switching mechanism switches, as at least one of the first thermally conductive portion or the second thermally conductive portion changes their shape or dimensions, from a heat radiation state to a heat insulation state, or vice versa. The heat radiation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally coupled together. The heat insulation state is a state where the first thermally conductive portion and the second thermally conductive portion are thermally isolated from each other.

A thermal interface is provided. The thermal interface includes a shape memory material and a thermally-conductive material. The thermal interface is configured to be formed as a compressed thermal interface and as an expanded thermal interface. The compressed thermal interface is configured to partially fill a thermal gap between a first component and a second component. The expanded thermal interface is configured to substantially fill the thermal gap between the first and second components.

A socket includes a housing configured to receive a removable Data Storage Device (DSD) and a Thermal Interface Material (TIM). An assembly of the socket is attached to the housing and configured to expand due to heat. In a thermally expanded state, the assembly causes the TIM to come into contact with the removable DSD to draw heat away from the removable DSD. According to another aspect, a retaining strip or assembly is attached to a housing in a configuration such that the retaining strip or assembly expands due to heat to increase a resistance to removal of the removable DSD from the housing when the retaining strip or assembly is in a thermally expanded state.

A wearable heat transfer device provides a user with haptic feedback providing sensations of hot or cold. The wearable heat transfer device comprises a heat source/sink and a programmable interface having heat transfer characteristics that are modified based on a signal received by the programmable interface. For example, a thickness of the programmable interface changes based on the received signal, altering heat transfer by the programmable interface. In another example, an electric field is applied to the programmable interface, changing one or more properties of the programmable interface affecting heat transfer.

A thermal transistor is provided. The thermal transistor includes a metallic thermal conductor, a non-metallic thermal conductor, and a thermal resistance adjusting unit. The metallic thermal conductor and the non-metallic thermal conductor are contact with each other to form a thermal interface. The thermal resistance adjusting unit is configured to generate an bias voltage U.sub.12 between the metallic thermal conductor and the non-metallic thermal conductor.

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

A thermal transistor is provided. The thermal transistor includes a metallic thermal conductor, a non-metallic thermal conductor, and a thermal resistance adjusting unit. The metallic thermal conductor and the non-metallic thermal conductor are contact with each other to form a thermal interface. The thermal resistance adjusting unit is configured to generate an electric field at the thermal interface.

A passive refrigeration box for controlled refrigeration of a product comprising: an outer box including an outer insulation layer; an inner box including an inner insulation layer, and a thermal shield on an outside of the inner insulation layer, the inner box and the outer box defining a vapour channel therebetween; and a thermal link including a thermal layer and a plurality of heat pipes or thermosyphons, the thermal layer and a top section of the inner box defining a coolant chamber, the coolant chamber including a coolant chamber access, and in communication with the vapour channel, and the thermal layer and a bottom section of the inner box defining a load chamber, the load chamber including a load chamber access, each heat pipe or thermosyphon having a condenser section disposed in the coolant chamber and an evaporator section disposed in the load chamber and extending through the thermal layer.