A clad material for a cooler is provided by executing production of a tensile strain of 3 to 10% or rolling at a finish rolling ratio of 10 to 25%, and optionally performing a heat treatment for 1 to 8 hours at a temperature within a range from 150 to 400° C., on a clad raw material having a three layer structure of a core material, a first brazing filler metal layer that covers one side (the surface on the side of a cooling water passage) of this core material, and a second brazing filler metal layer that covers the other side (the surface on the opposite side from the cooling water passage). Specific ranges are prescribed for certain properties before and after brazing.

Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.

A clad material includes a core material, a first skin material covering one side of the core material, and a second skin material covering the other side of the core material. The clad material is brazed in a state in which the first and second skin materials overlap each other. The core material is made of an Al alloy containing Mn (0.6 to 1.5 mass %), Ti (0.05 to 0.25 mass %), Cu (less than 0.05 mass %), Zn (less than 0.05 mass %), Fe (0.2 mass % or less), and Si (0.45 mass % or less) (balance: Al and unavoidable impurities). The first skin material is made of an Al alloy containing Si (6.8 to 11.0 mass %) and Zn (0.05 mass % or less) (balance: Al and unavoidable impurities). The second skin material is made of an Al alloy containing Si (4.0 to 6.0 mass %) and Cu (0.5 to 1.0 mass %) (balance: Al and unavoidable impurities).

A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.

A heat dissipation substrate for increasing solderability is provided. The heat dissipation substrate for increasing solderability includes a heat dissipation layer serving as a base layer, a plating layer formed on the heat dissipation layer, and a protective layer formed on the plating layer. The protective layer is made of one of tin and tin alloy, and the protective layer is capable of being melted in a subsequent process, such that the protective layer is a meltable protective layer.

A syngas loop boiler includes a casing that surrounds a tube bundle, wherein the tube bundle includes a plurality of tubes. One end of each of the tubes is joined to a tube-sheet provided with corresponding tube-sheet inlet holes for inletting the syngas in the boiler, wherein each tube-sheet inlet hole is internally provided with at least a protective sleeve welded at both ends to corresponding surfaces of the tube-sheet inlet hole. Each tube-sheet inlet hole is provided with a first respective weld overlay placed at the inlet mouth of the tube-sheet inlet hole, so that a first end of each protective sleeve is welded to the first weld overlay. Each tube-sheet inlet hole is internally provided with at least a bore groove that contains a respective in-bore second weld overlay, so that the second end of the protective sleeve is welded to the in-bore second weld overlay. Each protective sleeve is thus welded at both ends to respective weld overlays, with the possibility of removal and re-installation without performing any post weld heat treatment.

The invention relates to a brazable three-layered aluminum composite material having at least three layers with at least two different aluminum alloys, whereby an inner layer of the at least three layers is an aluminum brazing layer made from an aluminum brazing alloy, the other layers are configured as covering layers and include at least one further aluminum alloy, wherein the at least one further aluminum alloy has a higher solidus temperature than the liquidus temperature of the aluminum brazing alloy. The individual covering layers have a thickness which exceeds the thickness of the aluminum brazing layer by at least a factor of 1.5, preferably by a factor of 5. The brazable aluminum composite material is simply structured, has good brazing properties for the production of butt-joint brazing connections, significantly reduces the risk of a ‘burning through’ of brazed-on components and provides sufficient mechanical properties.

The heat conduction member comprises a laminate formed by laminating a resin layer and a metal layer. The resin layer is formed from a thermally conductive resin material. The thickness of the laminate is smaller at the peripheral edge of the laminate than in the center portion of the laminate, and the thickness of the laminate is greater in the intermediate portion of the laminate than in the center portion of the laminate. An inclined surface is formed on the laminate so as to form a falling gradient from the intermediate portion toward the peripheral edge.

A heat dissipation component for a semiconductor element includes: a composite part containing 50-80 vol % diamond powder with the remainder having metal including aluminum, the diamond powder having a particle diameter volume distribution first peak at 5-25 μm and a second peak at 55-195 μm. A ratio between a volume distribution area at particle diameters of 1-35 μm and a volume distribution area at particle diameters of 45-205 μm is 1:9 to 4:6; surface layers on both composite part principal surfaces, each of the surface layers containing 80 vol % or more metal including aluminum and having a film thickness of 0.03-0.2 mm; and a crystalline Ni layer and an Au layer on at least one of the surface layers, the crystalline Ni layer having a film thickness of 0.5-6.5 μm, and the Au layer having a film thickness of 0.05 μm or larger.

An aluminum alloy clad material includes a core material, one side being clad with cladding material 1, the other side being clad with cladding material 2, the core material including an aluminum alloy that includes 0.5 to 1.8% of Mn, and limited to 0.05% or less of Cu, with the balance being Al and unavoidable impurities, the cladding material 1 including an aluminum alloy that includes 3 to 10% of Si, and 1 to 10% of Zn, with the balance being Al and unavoidable impurities, and the cladding material 2 including an aluminum alloy that includes 3 to 13% of Si, and limited to 0.05% or less of Cu, with the balance being Al and unavoidable impurities, wherein the Si content X (%) in the cladding material 1 and the Si content Y (%) in the cladding material 2 satisfy the value (Y−X) is −1.5 to 9%.