A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.

A heat exchanger includes a fluid circuit including a fluid inlet manifold, a fluid outlet manifold, and fluid heat exchange channels fluidly connected between the fluid inlet manifold and the fluid outlet manifold. Each channel has an interior, and walls with an inside surface. A method of repairing the heat exchanger includes pumping an epoxy varnish into the interior of at least one of the heat exchange channels; filling in at least one of a) one or more cracks in the walls of the at least one channel, b) one or more apertures in the walls of the at least one channel, or c) one or more spaces between the at least one channel and another component of the heat exchanger with the epoxy varnish; and heating the at least one channel to a temperature in an approved predetermined epoxy varnish temperature range.

A heat exchanger and a method of making same that includes a central polymer core plate laminated on each side with a composite skin. The composite skin includes an electrically insulating outer layer, a middle metal layer to improve thermal conductivity and reduce diffusivity, and an inner layer that will thermally bond to the polymer core plate. A roll to roll method of making the heat exchanger is provided.

A heat dissipation module adapted to perform heat dissipation on a heat generating component is provided. The heat dissipation module includes a graphite sheet and an insulating and heat conducting layer. The graphite sheet includes a plurality of through holes, an attaching surface and a heat dissipating surface opposite to the attaching surface, wherein the attaching surface is configured to be attached to the heat generating component. Each of the through holes penetrates the graphite sheet, so the attaching surface and the heat dissipating surface are connected via the through holes. The insulating and heat conducting layer covers the graphite sheet. The insulating and heat conducting layer least covers the attaching surface, the heat dissipating surface and inner walls of the through holes.

A method of producing a heat exchanger is provided that includes a connection between two elements of a heat exchanger, the two elements being connectible to each other in at least one respective contact surface. An adhesive film is applied to at least one of the elements in the region of the respective contact surface, two elements being brought in contact with each other by applying pressure and an adhesive bond being produced between the elements by means of the adhesive film. An associated heat exchanger is also provided.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.

A heat-dissipating sheet includes a thermally-conductive resin sheet, an adhesive layer on an upper surface of the thermally-conductive resin sheet, and a thermally-conductive film on an upper surface of the adhesive layer. The thermally-conductive film has a higher thermal conductivity than the thermally-conductive resin sheet. The thermally-conductive resin sheet has a thin portion that is locally thin to form a recess in a lower surface of the thermally-conductive resin sheet. The recess may be an aperture passing through the thermally-conductive resin sheet. The adhesive layer is exposed from the aperture.

A heat spreading and insulating material using densified foam is provided that has a heat spreading layer that is adhered to an insulating layer. The material is designed to be used with mobile devices that generate heat adjacent to heat sensitive components. The insulating layer is formed from a compressed layer of polyimide foam to increase its density. The polyimide foam retains a significant amount of insulating properties through the densification process. In some embodiments, an EMI shielding layer is added to improve electrical properties of the device. The heat spreading layer is commonly a graphite material with anisotropic heat properties that preferentially conduct heat in-plane. The material may also include pressure sensitive layers to permanently apply the material to the mobile device.

A method of producing a composite heat dissipating structure by depositing a slurry of graphene particles upon a copper foil, drying the slurry to form a layer of graphene in contact with the copper foil, and consolidating the layer of graphene under pressure to reduce the thickness of the graphene layer and recovering the composite heat dissipating structure. Heat dissipating copper foils and composite heat dissipating structures and electronic devices incorporating the same are also disclosed herein.

A heat exchanger (10) cooling a fluid and a method for manufacturing, the heat exchanger (10) having an outer pipe section (12) in which a plurality of inner pipe sections (36) with channels for the fluid to be cooled are disposed. At least one cooling fluid channel (56) is disposed in the outer pipe section (12). The at least one cooling fluid channel (56) and the at least one channel for the fluid to be cooled are in heat contact and fluidically separated from each other. A plurality of inner pipe sections (36) open on both ends (38, 46) form of a pipe bundle (34) having ends fixed tightly in a corresponding lead-through opening (40) of an upstream end body (42) and fixed tightly with the other end (46) in a corresponding lead-through opening (48) of a downstream end body (50).