A heat conduction member includes a housing including a space therein, a wick structure located in the space, and a working fluid enclosed in the space. The housing includes one or more metal plates and a joint structure that connects the one or more metal plates. The joint structure includes two stacked metal plate layers and a boundary portion between the two metal plate layers. The boundary portion includes a first region including crystal grains straddling the two metal plate layers.

The disclosure provides a flat heat exchanger. The flat heat exchanger includes a flat pipe part, a first welded part, a second welded part and a capillary structure. The flat pipe part has a fluid channel. The first welded part and the second welded part are respectively located at two opposite ends of the flat pipe part to close two opposite ends of the fluid channel. At least part of the capillary is located within the fluid channel of the flat pipe part.

The present disclosure discloses a lead-supercritical carbon dioxide intermediate heat exchanger, including four modular printed circuit board heat exchangers (modular PCHEs), a cylinder, vertical partition boards, horizontal partition boards and heat exchange fluid channels. S-CO.sub.2 fluid flows upward along microchannels in PCHE cold side heat exchange plates after reaching the bottom of the cylinder along a square central down tube formed by the four PCHEs to absorb heat from hot side heat exchange plates. S-CO.sub.2 leaves the intermediate heat exchanger upward after being collected by a current collector at the other end of each PCHE. Liquid lead enters microchannels in the PCHE hot side heat exchange plates from a duct at the upper end of the cylinder to transfer heat to S-CO.sub.2 on the other side, and then flows out of the intermediate heat exchanger from a duct at the lower end of the cylinder to complete heat exchange.

A stacked type fluid heater includes a first low temperature layer with low temperature side flow passages into which target medium to be heated is introduced, a first high temperature layer with high temperature side flow passages into which heating medium for heating the target medium to be heated is introduced, a second high temperature layer with high temperature side flow passages into which the heating medium is introduced. The target medium has a temperature lower than the freezing point of the heating medium. The first high temperature layer includes the high temperature side flow passages located adjacent each other via a metal material of the first high temperature layer. The high temperature side flow passages of the first high temperature layer and those of the second high temperature layer are adjacent each other via a metal material of the second high temperature layer.

A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

Provided is a method of manufacturing a heat exchanger by diffusion bonding in which deformation of bonding members as stainless steel plates is suppressed, and releasability (detachability of a bonding member from a release member) after diffusion bonding treatment is excellent. Provided is a method of manufacturing a heat exchanger, the method including layering a plurality of bonding members 1 made of stainless steel, and applying heat and pressure to effect diffusion bonding of the bonding members 1, in which release members 3 are arranged on the both surface sides of the bonding members 1, and holding jigs 4 are arranged so as to sandwich the bonding members 1 through the release members 3, and pressing is then performed through the holding jigs 4 with a pressure device, and in which the diffusion bonding is performed using a combination of the release members 3 and the bonding members 1, the release members 3 including a steel material containing 1.5 mass % or more of Si, and a ratio (Fr/Fp) of the high-temperature strength (Fr) of the release members 3 at 1000 C. to the high-temperature strength (Fp) of the bonding members 1 at 1000 C. being 0.9 or more.

A heat pipe structure includes a first plate, a second plate and a plurality of wick structures. The second plate is connected to the first plate to form a chamber. The wick structures are disposed in the chamber, and the distribution shape of the wick structures is approximately the same as the shape of a portion of the chamber. The chamber is formed by at least one coupling portion and three or more extending portions. The coupling portion communicates with the extending portions, and the contour of the connected first and second plates is different from that of the chamber.

A power generation system includes a turbine having an outlet. A high temperature recuperator has an inlet and is connected to the turbine outlet. A low temperature recuperator is connected to the high temperature recuperator. Each of the high and low temperature recuperators include a plurality of matrix panels interconnected together that define hot fluid channels and cold fluid channels arranged adjacent to each other in a counterflow and stair-step configuration. A compressor is connected to the low temperature recuperator and turbine.

The present disclosure discloses a lead-supercritical carbon dioxide intermediate heat exchanger, including four modular printed circuit board heat exchangers (modular PCHEs), a cylinder, vertical partition boards, horizontal partition boards and heat exchange fluid channels. S-CO.sub.2 fluid flows upward along microchannels in PCHE cold side heat exchange plates after reaching the bottom of the cylinder along a square central down tube formed by the four PCHEs to absorb heat from hot side heat exchange plates. S-CO.sub.2 leaves the intermediate heat exchanger upward after being collected by a current collector at the other end of each PCHE. Liquid lead enters microchannels in the PCHE hot side heat exchange plates from a duct at the upper end of the cylinder to transfer heat to S-CO.sub.2 on the other side, and then flows out of the intermediate heat exchanger from a duct at the lower end of the cylinder to complete heat exchange.

A microchannel heat exchanger (MCHX) includes an air-passage layer including a plurality of air-passage microchannels, a working fluid layer including a plurality of working fluid microchannels, and a sealing layer coupled to the working fluid layer to provide a working/sealing layer set. The working/sealing layer set includes an arrangement of raised pedestals. The raised pedestals may extend from the working fluid layer to the sealing layer and contact the sealing layer.