Methods for tape deposition of a sacrificial coating on a CMC substrate are provided. The method comprises: applying a matrix material onto a surface of a film; drying the matrix material to remove the solvent; and transferring the dried matrix material from the film to the CMC substrate. The matrix material comprises a mixture of a rare earth silicate powder, a sintering aid, and a solvent.

Coating systems are provided for use on a CMC substrate, that can include: a bond coat on a surface of the CMC substrate; a first rare earth silicate coating on the bond coat; a sacrificial coating of a reinforced rare earth silicate matrix on the at least one rare earth silicate layer; a second rare earth silicate coating on the sacrificial coating; and an outer layer on the second rare earth silicate coating. The first rare earth silicate coating comprises at least one rare earth silicate layer, and the second rare earth silicate coating comprises at least one rare earth silicate layer. The sacrificial coating has a thickness of about 4 mils to about 40 mils. Methods are also provided for tape deposition of a sacrificial coating on a CMC substrate.

Coating systems are provided for use on a CMC substrate, that can include: a bond coat on a surface of the CMC substrate; a first rare earth silicate coating on the bond coat; a sacrificial coating of a reinforced rare earth silicate matrix on the at least one rare earth silicate layer; a second rare earth silicate coating on the sacrificial coating; and an outer layer on the second rare earth silicate coating. The first rare earth silicate coating comprises at least one rare earth silicate layer, and the second rare earth silicate coating comprises at least one rare earth silicate layer. The sacrificial coating has a thickness of about 4 mils to about 40 mils. Methods are also provided for tape deposition of a sacrificial coating on a CMC substrate.