A LED strip having LED chips and a strip to which the LED chips are fixed and which also functions as a support structure of conductors coupled with the LED chips, and a tube manufactured from an elastic and at least partly light-transmitting material and surrounding the strip with the LED chips. At the outer surface of the tube there is a fixing element which is in essential parts of the same material as the tube. The LED strip includes a thermal conduction part which is of a material different from the tube and which, in the cross-section of the LED strip, is directed outwards from the inner surface of the tube for conducting waste heat generated in the LED chips out from the tube.

A dual-color light string comprising a first insulated electrical wire cord, a second insulated electrical wire, two light-emitting diode devices (LED devices) and transparent glue. The first insulated electrical wire is partially exposed to form a first soldering section. The second insulated electrical wire is partially exposed to form a second soldering section. The two LED devices are respectively electrically connected to the first soldering section and the second soldering section, and the directions of bias of the two LED devices from the first soldering section to the second soldering section are opposite to each other; The transparent glue covers the two LED devices, the first soldering section and the soldering section, extends to partially cover a first insulating layer of the first insulated electrical wire and a second insulating layer of the second insulated electrical wire.

A merchandiser including a case that defines a product display area and a luminaire that is coupled to the case to illuminate at least a portion of the product display area. The luminaire is slidably and rotatably coupled to the case at a single point.

A lighting module (150) and a method (100) of manufacturing a lighting module, wherein the method comprises the steps of providing a heat sink material (120) in a fluid state and providing a light-source assembly (110) comprising a plurality of light sources (111) being electrically connected to a carrier (112), wherein each of the light sources has a light-emitting surface (113). The method further comprises the steps of embedding (130) the light-source assembly into the heat sink material such that the carrier and a part of each of the light sources are covered by the heat sink material while the light-emitting surface of each of the light sources is uncovered by the heat sink material, and solidifying (140) the heat sink material.

Provided are a substrate used for an LED encapsulation, a three-dimensional LED encapsulation comprising the substrate, a bulb comprising the three-dimensional LED encapsulation and a manufacturing method therefor. The substrate is spiral lines in shape, at least one of the ends of the substrate is provided with an electrode lead wire, the electrode lead wire is connected with the substrate by a connective component and/or connective materials, the spiral lines of the substrate comprise gaps between each other, and a smooth curve and/or a plurality of polylines end to end is formed at least partly at the edge of the substrate. The three-dimensional LED encapsulation and the bulb comprising the three-dimensional LED encapsulation comprise the substrate, multiple LED chips in series and/or parallel are arranged on the substrate, the multiple LED chips are let out by the electrode lead wire of one end of the substrate and the other end of the substrate as the other electrode lead wire. All-dimensional and three-dimensional and multilayer light-emitting of the bulb may be realized, moreover, the heat is easy to dissipate, the structure is simple to manufacture, and the cost is low.

An exterior aircraft light includes a mounting board, having an upper side, a lower side and a plurality of side faces; at least one LED, arranged on the upper side of the mounting board; and a mounting board enclosure and lens structure, wherein the mounting board enclosure and lens structure comprises a lens arranged over the at least one LED for shaping an output light intensity distribution of the exterior aircraft light and a covering layer arranged on the upper side, the lower side and the plurality of side faces of the mounting board, wherein the mounting board enclosure and lens structure is an integral silicone structure.

A lighting unit is removably inserted into a pocket to create a light effect through use of a light effect material. The lighting unit has a PCB with a first side to which one or more LEDs and a battery are mounted. A clear potting material encloses the PCB, LEDs, and the battery and creates a transparent space proximate an inner surface of the light effect material which maintains the light effect material at a preselected distance from the LEDs so that light emitted from each light emitting die is dispersed by a plurality of dispersive elements in the light effect materials to create the light material viewing effect.

An encapsulated LED engine having a printed circuit board, a plurality of LED arrays, each of said LED arrays mounted on said printed circuit board, and electrically connected to each other, an encapsulation layer comprising a pre-molded optic positioned over and adhered to the printed circuit board, and a frame positioned over the LED arrays and secured to the printed circuit board. A method of forming an encapsulated LED engine is also provided.

A light emitting device includes a support having an interstice and at least one LED located in the interstice and at least one of a waveguide or an optical launch having a transparent material encapsulating the at least one LED located in the interstice.

A light emitting module having a lens is disclosed. The light emitting module includes: a substrate having recesses; light emitting elements mounted within the recesses of the substrate; and a lens which is coupled with the substrate and diffuses the light emitted from the light emitting elements. The light emitting module can have a slim structure by mounting the light emitting elements within the recesses formed in the substrate.