The invention provides a light generating device (1000) comprising an LED filament (100), wherein the LED filament (100) comprises a support (105), a set (107) of solid state light sources (110), and an encapsulant (160), wherein: (I) the LED filament (100) has a length axis (108) having a first length (L1); (II) the solid state light sources (110) are arranged over the first length (L1) of the LED filament (100) on the support (105), wherein the solid state light sources (110) are configured to generate light source light (111); (III) the encapsulant (160) encloses at least part of each of the solid state light sources (110) of the set (107) of solid state light sources (110), wherein the encapsulant (160) comprises a luminescent material (200) configured to convert at least part of the light source light (111) into luminescent material light (201); (IV) the light generating device (1000) is configured to generate device light (1001) comprising one or more of (i) the light source light (111) and (ii) the luminescent material light (201); (V) for each of the solid state light sources (110) of the set (107) of solid state light sources (110) applies that relative to a first virtual plane (171) parallel to the length axis (108) and intersecting with the solid state light source (110) the encapsulant (160) is asymmetrically configured relative to the first virtual plane (171).

A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

Optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board.

A dual in-line package (DIP) light emitting diode (LED) device includes a molded member, a positive lead passing through and fixed to the molded member, the positive lead comprising an upper end and lower end, a negative lead passing through and fixed to the molded member, the negative lead comprising an upper end and lower end, and at least one LED body connected to the top ends of the positive lead and the negative lead. The lower ends of the positive lead and the negative lead are flush with each other. The top end of the positive lead is higher than the top end of the negative lead. The positive lead and the negative lead are both bent at the top ends thereof.

A blade assembly and a fan display including the same. The blade assembly includes a circuit substrate provided in an elongated shape, a lamination board provided in an elongated shape and bonded to the circuit substrate by a laminating glue, and a plurality of light emitting diode (LED) light emitting units. A mounting hole is defined in the lamination board and passes through a thickness of the lamination board. The circuit substrate has a first side attached to the lamination board, the first side and the mounting hole jointly defining a mounting cavity, in which plurality of LED light emitting units are hermetically disposed in the mounting cavity, and are arranged at intervals along a length of the circuit substrate.

A light source module includes a light-emitting device having an upper surface and a lower surface and including: at least one light-emitting element and a plurality of conductive regions on the upper surface of the light-emitting device; a mounting substrate having an upper surface on which a lower surface side of the light-emitting device is located, the mounting substrate including conductive patterns on the upper surface of the mounting substrate, each conductive pattern including a device-side connecting portion and an external side connecting portion; and a plurality of conductive members each having a first end bonded to a respective one of the device-side connecting portion and a second end opposite to the first end, the second end being in contact with a respective one of the conductive region by elasticity to electrically connect the respective one of the conductive regions and a respective one of the conductive patterns.

A dual-color light string comprising a first insulated electrical wire cord, a second insulated electrical wire, two light-emitting diode devices (LED devices) and transparent glue. The first insulated electrical wire is partially exposed to form a first soldering section. The second insulated electrical wire is partially exposed to form a second soldering section. The two LED devices are respectively electrically connected to the first soldering section and the second soldering section, and the directions of bias of the two LED devices from the first soldering section to the second soldering section are opposite to each other; The transparent glue covers the two LED devices, the first soldering section and the soldering section, extends to partially cover a first insulating layer of the first insulated electrical wire and a second insulating layer of the second insulated electrical wire.

The present invention relates to the field of lighting lamps, in particular to a string light with a plug-in lamp holder structure. According to present invention, an illuminant and the lamp holder, as well as a lamp housing and the lamp holder are all fixed in a plug-in manner, so that the installation is convenient and fast, and the structure is simple, which is beneficial to reduce the production cost. In addition, the lamp holder which is integrally formed by injection molding has better water resistance and is convenient for automatic production and assembly.

A light-emitting diode lighting module, including: a base, provided with a mounting surface; at least one light-emitting diode element, on the mounting surface of the base, each of the at least one light-emitting diode element including a plurality of light-emitting diode dies packaged together; and a lens assembly, disposed on a side of the base provided with the at least one light-emitting diode element, and forming an accommodating space with the base, wherein the at least one light-emitting diode element is located in the accommodating space, and the lens assembly includes a lens supporting portion and at least one lens portion in one-to-one correspondence with the at least one light-emitting diode element, each of the at least one lens portion is disposed on a corresponding light-emitting diode element to achieve light distribution of the corresponding light-emitting diode element, and the lens supporting portion is connected with the at least one lens portion to support the at least one lens portion.

An apparatus and method of use for a comprehensive transcranial low-level light therapy for use with ischemic brain tissue using a multitude of polychromatic Light Emitting Diodes (LEDs) embedded into a flexible head covering that stretches securely around the patient's cranium to bath the entire cranium cavity in a variable frequency, variable power density light spectrum, maximizing all beneficial effects to the cellular tissues whether or not they are specifically deprived of blood from the ischemic stroke event. The bulbs covering the n-p junction of the semiconductor LEDs directly contact the patient's cranial skin to maximize the depth of penetration of the wavelengths into the brain's cortex cells. By using many individual point-source LEDs emitting all around the cranium, greater therapeutic benefit can be achieved as more of the cortex tissues are irradiated.