Various embodiments may relate to an illumination device including at least one semiconductor light source arrangement that is fixed to a carrier. The at least one semiconductor light source arrangement is fixed to the carrier at multiple locations by means of a press fit.

A lighting device may include: a board having a front surface and a back surface, and a board attachment base provided with an attachment surface smaller than the area of the back surface, an opposing surface larger than the area of the attachment surface and which opposes the attachment surface, and a lateral surface which extends out from the periphery of the attachment surface towards the periphery of the attachment surface, the board having a light source mounted in a section of the back surface region which is not abutted by the attachment surface.

An edge-lit backlight module according to this disclosure includes a frame body and a light-emitting unit. The frame body includes a bottom portion, a wall portion and at least one first positioning portion. The wall portion is connected with the bottom portion, and the first positioning portion is located at least one of the bottom portion and the wall portion. The light-emitting unit includes a circuit board and a plurality of light-emitting elements disposed on the circuit board. The circuit board includes at least one second positioning portion. The second positioning portion includes a notch and an extension portion extending from the circuit board. The first positioning portion and the second positioning portion engage with each other to connect the light-emitting unit with the frame body.

A light fixture has a translucent tubular bulb. At least one end cap is located at one end of the translucent tubular bulb. A light engine is disposed in the translucent tubular bulb. The light engine has a leadframe on which a plurality of semiconductor light elements is arranged. The fixture may include an electronic driver. The electronic driver includes a plurality of electronic components. At least one of the plurality of electronic components is arranged inside the transparent tubular bulb.

A multi-level lighting system which utilizes efficient first and second light sources for energy savings and/or ambiance. This invention combines at least two sets of LEDs on a single light engine to provide multi-level lighting while keeping the circuits of the LED sets electrically separate or isolated.

There is presented a lighting device comprising: several light-emitting filaments (15, 15′) with solid-state light sources and a circuit board (10) with first and second electrically conductive tracks (13, 14) following first and second paths, respectively. Each light-emitting filament (15, 15′) comprises a first electrical contact (19, 19′) electrically connected to the first track (13) at a first point on the first path, and a second electrical contact (20, 20′) electrically connected to the second track (14) at a second point on the second path. The first and second points associated with each light-emitting filament (15, 15′) are arranged on an axis (A) which is non-perpendicular to a tangent (T.sub.1) to the first path at the first point and to a tangent (T.sub.2) to the second path at the second point. The lighting device may be adapted to emit light from what appears to be a surface according to an observer.

In accordance with certain embodiments, systems of lighting components feature multiple illumination panels each having a backing support and, secured thereto, multiple illumination elements. The illumination elements have shapes defined by arrangements of illumination unit cells may be assembled to illuminate an arbitrary two-dimensional area.

Lighting devices and methods of manufacturing lighting devices are described. A lighting devices includes at least one thermally conductive element, at least one lighting module thermally coupled to the at least one thermally conductive element, and an overmould at least partially encasing the at least one thermally conductive element, the overmould comprising at least one receiving portion. The at least one circuit board is mounted in the at least one receiving portion and is at least partially exposed from the overmould. The at least one circuit board includes at least one connector and at least two bond pads. The at least one connector includes surface accessible conduction lines.

A method for producing a tube lamp uses at least one leadframe. A leadframe is a flat structure which has two opposing surfaces extending substantially parallel and spaced apart by the sheet thickness. One or more stabilizing sections are applied to the leadframe. The leadframe is fastened with the stabilizing sections in a tubular housing of the tube lamp.

A device includes a carrier and a plurality of semiconductor chips configured to generate radiation. The carrier includes a lead frame. The lead frame includes two connecting parts for external electrical contacting of the device. The semiconductor chips are arranged on the carrier. The carrier is surrounded by a casing at least in places along its entire circumference. The casing forms a side face of the device at least in places. The side face includes traces of material removal.