An annular LED grow light is disclosed, which comprises a radiator, a light source board, and a power supply box. The light source board is composed of a PCB light board and a plurality of LED lamp beads, wherein the LED lamp beads are arranged on the PCB light board in an annular array about a center. The beneficial effects of the present disclosure are: the photosynthetic photon flux density (PPFD) is distributed more evenly after the LED lamp beads are arranged in an annular array about the center, thus the effective irradiated area is larger, and the cost has been saved.

An annular LED grow light is disclosed, which comprises a radiator, a light source board, and a power supply box. The light source board is composed of a PCB light board and a plurality of LED lamp beads, wherein the LED lamp beads are arranged on the PCB light board in an annular array about a center. The beneficial effects of the present disclosure are: the photosynthetic photon flux density (PPFD) is distributed more evenly after the LED lamp beads are arranged in an annular array about the center, thus the effective irradiated area is larger, and the cost has been saved.

In a vacuum valve, as a heat dissipation structure thereof, a heat dissipation layer is provided to a part of the surface of each of a fixed conductor and a movable conductor which are a heat generation part, and a radiation heat absorption layer is provided to an insulation cylinder so as to be opposed to the heat dissipation layer. The heat dissipation layer and the radiation heat absorption layer are each formed from a ceramic having a high emissivity. Heat generated at the fixed conductor and the movable conductor is radiated by the heat dissipation layer, to be absorbed by the radiation heat absorption layer, and then radiated to the outside of the vacuum valve from the radiation heat absorption layer and a ceramic layer.

In a vacuum valve, as a heat dissipation structure thereof, a heat dissipation layer is provided to a part of the surface of each of a fixed conductor and a movable conductor which are a heat generation part, and a radiation heat absorption layer is provided to an insulation cylinder so as to be opposed to the heat dissipation layer. The heat dissipation layer and the radiation heat absorption layer are each formed from a ceramic having a high emissivity. Heat generated at the fixed conductor and the movable conductor is radiated by the heat dissipation layer, to be absorbed by the radiation heat absorption layer, and then radiated to the outside of the vacuum valve from the radiation heat absorption layer and a ceramic layer.

A light assembly may comprise a heatsink, a plurality of light emitting diodes, and a lens. The heatsink may include a first surface and a second surface opposite the first surface. The second surface may define an airflow path extending from a first end of the heatsink to a second end of the heatsink. The plurality of light emitting diodes may be coupled to the first surface of the heatsink. The lens may be located over the plurality of light emitting diodes and may contact the heatsink.

A light assembly may comprise a heatsink, a plurality of light emitting diodes, and a lens. The heatsink may include a first surface and a second surface opposite the first surface. The second surface may define an airflow path extending from a first end of the heatsink to a second end of the heatsink. The plurality of light emitting diodes may be coupled to the first surface of the heatsink. The lens may be located over the plurality of light emitting diodes and may contact the heatsink.

A light emitting device includes a housing; a light source unit; and a cooling unit provided in the housing to discharge heat to an outside of the housing by means of a gas, the heat being generated by the light source unit. The cooling unit includes an introduction portion, a heat exchange portion, and a circulation portion that guides the gas from the introduction portion to the heat exchange portion. The circulation portion includes a first flow path receiving the gas from the introduction portion, and a second flow path receiving the gas from the first flow path, and being connected to the heat exchange portion. The first flow path includes a portion having a flow path area larger than a flow path area of the introduction portion.

A light emitting device includes a housing; a light source unit; and a cooling unit provided in the housing to discharge heat to an outside of the housing by means of a gas, the heat being generated by the light source unit. The cooling unit includes an introduction portion, a heat exchange portion, and a circulation portion that guides the gas from the introduction portion to the heat exchange portion. The circulation portion includes a first flow path receiving the gas from the introduction portion, and a second flow path receiving the gas from the first flow path, and being connected to the heat exchange portion. The first flow path includes a portion having a flow path area larger than a flow path area of the introduction portion.

The instant invention relates to a sub-miniature high powered light emitting diode and accompanying mounting tab device. The instant invention seeks to provide a solution to light fixture designers by making a readily available and tightly compact light emitting diode mounting device. The instant invention provides for a mounting tab with a heat dissipating element to take advantage of the tiny size of sub-miniature high powered light emitting diodes while adding negligible mounting and heat dissipating elements to set a new lighting device standard in versatility, optimal heat dissipation, and minimal mounting overhead.

The instant invention relates to a sub-miniature high powered light emitting diode and accompanying mounting tab device. The instant invention seeks to provide a solution to light fixture designers by making a readily available and tightly compact light emitting diode mounting device. The instant invention provides for a mounting tab with a heat dissipating element to take advantage of the tiny size of sub-miniature high powered light emitting diodes while adding negligible mounting and heat dissipating elements to set a new lighting device standard in versatility, optimal heat dissipation, and minimal mounting overhead.