The LED light bulb comprises an outer case, a heatsink, an LED light module, a power driver and a metallic bulb base. The LED light module includes a circuit board and an LED light source. The outer case includes a plurality of vent apertures. An interior surface of the heatsink defines a heatsinking pathway. The heatsinking pathway and the vent apertures are disposed and configured to provide a convection airflow pathway.

The present disclosure includes an LED lamp assembly comprising a glass envelope, an LED platform supported by a stem arrangement disposed within the envelope, a base hermetically sealed to the envelope, a gas disposed within the envelope providing thermal conductivity between the LED platform and the envelope, and a getter disposed within the envelope for absorbing volatile organic compounds. The lamp may maintain a ratio of helium to oxygen that achieves both an acceptable thermal conductivity and an acceptable lumen output over the life of the LED lamp.

The present disclosure includes an LED lamp assembly comprising a glass envelope, an LED platform supported by a stem arrangement disposed within the envelope, a base hermetically sealed to the envelope, a gas disposed within the envelope providing thermal conductivity between the LED platform and the envelope, and a getter disposed within the envelope for absorbing volatile organic compounds. The lamp may maintain a ratio of helium to oxygen that achieves both an acceptable thermal conductivity and an acceptable lumen output over the life of the LED lamp.

This device includes an electronic board including a front surface; at least one light emitter assembled on the front surface; a protective cover configured to protect the electronic board and the at least one light emitter; a thermally-conductive resin layer having a heat exchange surface meant to be in direct contact with the aquatic environment, the thermally-conductive resin layer being configured to transfer the heat generated by the at least one light emitter to the heat exchange surface, and configured to ensure the sealing of the protective cover with the heat exchange surface.

An LED lighting tube including a heat-dissipating tubular envelope having an LED assembly directly affixed to an inner surface of the heat-dissipating tubular envelope. A method of making an LED lighting tube by providing a heat-dissipating tubular envelope and affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer. A method of providing heat-dissipation without a heat sink in an LED lighting tube by providing a heat-dissipating tubular envelope, affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer, and dissipating heat through the heat-dissipating tubular envelope.

An LED lighting tube including a heat-dissipating tubular envelope having an LED assembly directly affixed to an inner surface of the heat-dissipating tubular envelope. A method of making an LED lighting tube by providing a heat-dissipating tubular envelope, and affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer. A method of providing heat-dissipation without a heat sink in an LED lighting tube by providing a heat-dissipating tubular envelope, affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer, and dissipating heat through the heat-dissipating tubular envelope.

An LED lighting tube including a heat-dissipating tubular envelope having an LED assembly directly affixed to an inner surface of the heat-dissipating tubular envelope. A method of making an LED lighting tube by providing a heat-dissipating tubular envelope, and affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer. A method of providing heat-dissipation without a heat sink in an LED lighting tube by providing a heat-dissipating tubular envelope, affixing an LED assembly directly to an inner surface of the heat-dissipating tubular envelope with an adhesive layer, and dissipating heat through the heat-dissipating tubular envelope.

The LED tube lamp includes a lamp tube, an LED substrate, and a diffusion film. The LED substrate includes a plurality of LED chips disposed on the LED substrate, and a driving circuitry for receiving power to enable the plurality of LED chips. The diffusion film is disposed on a surface of the lamp tube. The diffusion film includes a first region and a second region adjacent to the first region. The first region and the second region of the diffusion film are arranged along a longitudinal axis of the lamp tube. The first region has a first transmittance rate and the second region has a second transmittance rate higher than the first transmission rate.

The LED tube lamp includes a lamp tube, an LED substrate, and a diffusion film. The LED substrate includes a plurality of LED chips disposed on the LED substrate, and a driving circuitry for receiving power to enable the plurality of LED chips. The diffusion film is disposed on a surface of the lamp tube. The diffusion film includes a first region and a second region adjacent to the first region. The first region and the second region of the diffusion film are arranged along a longitudinal axis of the lamp tube. The first region has a first transmittance rate and the second region has a second transmittance rate higher than the first transmission rate.

Solid state lighting components are provided with improved color rendering, improved color uniformity, and improved directional lighting, and that are suitable for use in high output lighting applications and can be used in place of CDMH bulb lighting. Exemplary solid state lighting components include a substrate comprising a light emitter surface and or more light emitters disposed on and/or over the light emitter surface. Exemplary components include a light directing optic and/or a diffusing optic for mixing light. The light directing optic may be disposed at least partially around a perimeter of the light emitter surface. The diffusing optic may be disposed between portions of the light directing optic and spaced apart from the light emitter surface.