Floor lamps with arch-shaped support rod are provided. Such floor lamps include a cap and a dome-shaped wall projecting from the top of the cap which is provided with a plurality of through-holes. An LED optical group provides a dissipation plate in contact with the dome-shaped wall. The plate has a plurality of holes or open curvilinear recesses along the peripheral edge, arranged substantially to conceal from the observer the dissipation wall.

Floor lamps with arch-shaped support rod are provided. Such floor lamps include a cap and a dome-shaped wall projecting from the top of the cap which is provided with a plurality of through-holes. An LED optical group provides a dissipation plate in contact with the dome-shaped wall. The plate has a plurality of holes or open curvilinear recesses along the peripheral edge, arranged substantially to conceal from the observer the dissipation wall.

A LED filament bulb apparatus includes a bulb shell, one or more LED strips, a core column, two pluggable sockets, a driver board and a cap. The LED strip is electrically connected to two power lead wires. The core column supports the LED strip. The two power lead wires have bottom ends. The two pluggable sockets respectively receives the two bottom ends. The driver board is used for mounting the two pluggable socket and a driver circuit. The two bottom ends of the two power lead wires are electrically connected to the driver circuit for receiving a driving current generated by the driver circuit from converting an external power source. The cap is fixed to the core column and the bulb shell.

A LED filament bulb apparatus includes a bulb shell, one or more LED strips, a core column, two pluggable sockets, a driver board and a cap. The LED strip is electrically connected to two power lead wires. The core column supports the LED strip. The two power lead wires have bottom ends. The two pluggable sockets respectively receives the two bottom ends. The driver board is used for mounting the two pluggable socket and a driver circuit. The two bottom ends of the two power lead wires are electrically connected to the driver circuit for receiving a driving current generated by the driver circuit from converting an external power source. The cap is fixed to the core column and the bulb shell.

A lamp module according to an embodiment of the present invention comprises: a lamp having electrode terminals at both ends thereof; a bracket portion including first and second brackets coupled to both ends of the lamp so that the electrode terminals of the lamp are supported; and a cover glass having the lamp and the bracket portion inserted and coupled therein, and having a cavity such that one surface of the bracket is externally exposed, wherein the first bracket may be provided with a communication portion for communicating the inside and the outside of the cover glass.

A lamp module according to an embodiment of the present invention comprises: a lamp having electrode terminals at both ends thereof; a bracket portion including first and second brackets coupled to both ends of the lamp so that the electrode terminals of the lamp are supported; and a cover glass having the lamp and the bracket portion inserted and coupled therein, and having a cavity such that one surface of the bracket is externally exposed, wherein the first bracket may be provided with a communication portion for communicating the inside and the outside of the cover glass.

An LED lamp has an LED device and a lamp base. The LED device has multiple LED chips, multiple conductive substrates, a packaging layer and a protective cover. The multiple conductive substrates are arranged at intervals. Each of the LED chips is supported by and electrically connected between two adjacent conductive substrates. The packaging layer covers the LED chips and covers a part of each conductive substrate. The protective cover covers the LED chips and the conductive substrates to form an LED device in a specific shape. As the LED chips are close to the protective cover, thermal energy generated by the LED chips is rapidly dissipated into the air to improve the heat dissipation. The LED device achieves a continuous uniform lighting effect by a proper arrangement of the LED chips.

An LED lamp has an LED device and a lamp base. The LED device has multiple LED chips, multiple conductive substrates, a packaging layer and a protective cover. The multiple conductive substrates are arranged at intervals. Each of the LED chips is supported by and electrically connected between two adjacent conductive substrates. The packaging layer covers the LED chips and covers a part of each conductive substrate. The protective cover covers the LED chips and the conductive substrates to form an LED device in a specific shape. As the LED chips are close to the protective cover, thermal energy generated by the LED chips is rapidly dissipated into the air to improve the heat dissipation. The LED device achieves a continuous uniform lighting effect by a proper arrangement of the LED chips.

Disclosed are improved photoluminescence wavelength conversion components and lamps that incorporate such components. The photoluminescence wavelength conversion component comprises a hollow cylindrical tube having a given bore of diameter and an axial length. The relative dimensions and shape of the component can affect the radial emission pattern of the component and are configured to give a required emission pattern (typically omnidirectional). The photoluminescence material can be homogeneously distributed throughout the volume of the component during manufacture of the component. An extrusion method can be used to form the improved photoluminescence wavelength conversion component. Injection molding or casting can also be used to form the component. Another possible approach is to manufacture the component is by forming a flexible sheet material to include the phosphor and/or quantum dots, and then rolling the sheet material into the desired shape and dimensions for the component. The improved wavelength conversion components and lamps that incorporate these components provide for improved emission characteristic, while allowing for relatively cost-effective manufacturing costs. A further advantage of components is that their light emission resembles a filament of a conventional incandescent light bulb.

Disclosed are improved photoluminescence wavelength conversion components and lamps that incorporate such components. The photoluminescence wavelength conversion component comprises a hollow cylindrical tube having a given bore of diameter and an axial length. The relative dimensions and shape of the component can affect the radial emission pattern of the component and are configured to give a required emission pattern (typically omnidirectional). The photoluminescence material can be homogeneously distributed throughout the volume of the component during manufacture of the component. An extrusion method can be used to form the improved photoluminescence wavelength conversion component. Injection molding or casting can also be used to form the component. Another possible approach is to manufacture the component is by forming a flexible sheet material to include the phosphor and/or quantum dots, and then rolling the sheet material into the desired shape and dimensions for the component. The improved wavelength conversion components and lamps that incorporate these components provide for improved emission characteristic, while allowing for relatively cost-effective manufacturing costs. A further advantage of components is that their light emission resembles a filament of a conventional incandescent light bulb.