F21V29/508

INTEGRATED CEILING DEVICE WITH MECHANICAL ARRANGEMENT FOR A LIGHT SOURCE
20230035985 · 2023-02-02 · ·

An integrated ceiling device includes a housing retaining an electronic assembly, a heat sink having a central opening, a light source coupled onto the heat sink, the housing is coupled with and disposed at least partly above the heat sink, and a central vertical axis of the housing aligns or is in proximity with the central opening of the heat sink.

INTEGRATED CEILING DEVICE WITH MECHANICAL ARRANGEMENT FOR A LIGHT SOURCE
20230035985 · 2023-02-02 · ·

An integrated ceiling device includes a housing retaining an electronic assembly, a heat sink having a central opening, a light source coupled onto the heat sink, the housing is coupled with and disposed at least partly above the heat sink, and a central vertical axis of the housing aligns or is in proximity with the central opening of the heat sink.

INDUSTRIAL HIGH CEILING LED LUMINAIRE

An LED luminaire including an outer LED support member having a plurality of LED arrays positioned on a lower side thereof, an LED driver housing centrally located within an interior of the outer LED support member, wherein the outer LED support member is secured to the LED driver housing with a plurality of attachment arms that extend from inner surface of the outer LED support member to the LED driver housing, such that are open spaces between the plurality of attachment arms and between the inner surface of outer LED support member and the LED driver housing, and a plurality of heat dissipating fins positioned on an upper surface of the outer LED support member extending towards the LED driver housing.

Combination LED lighting and fan apparatus

A combination axial fan and LED lighting system configured to fit into the footprint of a standard ceiling tile. The system includes a housing container and an axial fan. The fan has a fan cavity including air diversion mechanism to direct air from the fan cavity toward the lighting and fan components. The invention includes an airflow surface to direct air existing the fan cavity along an LED light fixture.

Thermally managed hazardous location LED light fixture, assembly and methods without utilizing heat sinks

An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a glassfiber reinforced plastic material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. The LED driver module and the at least one axially elongated linear LED module are operable within a target peak temperature limit for the hazardous location, without utilizing heat sinks to dissipate heat in order to provide acceptable thermal management.

Thermally managed hazardous location LED light fixture, assembly and methods without utilizing heat sinks

An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a glassfiber reinforced plastic material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. The LED driver module and the at least one axially elongated linear LED module are operable within a target peak temperature limit for the hazardous location, without utilizing heat sinks to dissipate heat in order to provide acceptable thermal management.

ELECTRONIC DEVICE
20230126505 · 2023-04-27 ·

An electronic device includes a back frame, a first heat source, a second heat source, a guiding member and a fan. The first heat source is disposed on a first side of the back frame. The second heat source is disposed on a second side of the back frame. The guiding member is disposed on the second side of the back frame. The fan is disposed corresponding to the guiding member. At least part of an airflow path is formed between the first heat source and the second heat source.

LED luminaire having enhanced thermal management

In one aspect, luminaires are described herein having sensor modules integrated therein. In one aspect, a luminaire described herein comprises a light emitting face including a LED assembly. A sensor module is integrated into the luminaire at a position at least partially overlapping the light emitting face. In another aspect, a luminaire described herein comprises a LED assembly and a driver assembly. A sensor module is integrated into the luminaire along or more convective air current pathways cooling the LED assembly or driver assembly.

LED luminaire having enhanced thermal management

In one aspect, luminaires are described herein having sensor modules integrated therein. In one aspect, a luminaire described herein comprises a light emitting face including a LED assembly. A sensor module is integrated into the luminaire at a position at least partially overlapping the light emitting face. In another aspect, a luminaire described herein comprises a LED assembly and a driver assembly. A sensor module is integrated into the luminaire along or more convective air current pathways cooling the LED assembly or driver assembly.

High lumen high-bay luminaire with heat dissipating upper housing defining cavity for driver

A high-bay luminaire includes an upper housing having an outer wall with an outer wall having a plurality of first heat fins extending therefrom, and an interior surface defining an interior compartment with an angled wall; a base connected to the upper housing; a light emitter connected to the base; a lens connected to the base and positioned below the light emitter; and a driver connected to the angled wall by a driver bracket and positioned adjacent the interior surface.