An apparatus body heat dissipation device includes an apparatus case, at least one plate body and at least one drive member. The apparatus case has at least one first opening and at least one second opening and a receiving space. The plate body is disposed in the receiving space. The drive member serves to drive the plate body to move within the receiving space to produce an air convection effect between the interior of the apparatus case and the ambient surrounding air of the apparatus case so that the air convection in the limited space of the apparatus body can be effectively enhanced to greatly enhance the heat dissipation efficiency.

A device (1, 100) for controlling a flow of a gaseous fluid is disclosed. The device comprises a first electrode (10, 110) and a second electrode (20, 120) offset from the first electrode in a downstream direction of the flow. The electrodes are connectable to a voltage source. A thermally conducting flange (30) is arranged to extend in a plane parallel to a direction of the flow and adapted to dissipate heat from the gaseous fluid. At least a portion of the first electrode has a maximum height (h.sub.1) in a direction parallel to a direction of the flow and a maximum width (w.sub.1) in a direction orthogonal to the direction of the flow, wherein said maximum height is larger than said maximum width so as to improve the pumping efficiency of the device. A method for manufacturing the device, and a method for controlling a fluid flow by means of such device, is also disclosed.

A light source (10) comprises a light engine (16), a base (24), a power conversion circuit (30) and an enclosure (22). The light engine (16) comprises at least one LED (12) disposed on a platform (14). The platform (14) is adapted to directly mate with the base (24) which a standard incandescent bulb light base. Phosphor (44) receives the light generated by the at least one LED (12) and converts it to visible light. The enclosure (22) has a shape of a standard incandescent lamp.

A lamp comprising a light source comprising at least one solid state emitter. The lamp comprises a heat sink body in thermal communication with said light source. At least one air flow nozzle is present in the lamp to direct air flow across at least a portion of the heat sink body. The lamp further comprises an active cooling device, in which the active cooling device is in fluid communication with the at least one air flow nozzle and is configured to provide a flow of air to the at least one air flow nozzle. The lamp further comprises driver electronics configured to provide power to each of the light source and the active cooling device, wherein the driver electronics are remote from the active cooling device.

A rearview assembly for a vehicle includes a rearview device and a processor. A housing supports the rearview device and the processor. The housing defines a recess therein. An air moving device is operably coupled with the housing and is configured to draw air from an area exterior to the housing into the recess, thereby cooling at least one of the rearview device and the processor.

A rearview assembly for a vehicle includes a rearview device and a processor. A housing supports the rearview device and the processor. The housing defines a recess therein. An air moving device is operably coupled with the housing and is configured to draw air from an area exterior to the housing into the recess, thereby cooling at least one of the rearview device and the processor.

Embodiments provide a light-emitting apparatus including a light source, a carrier spaced apart from the light source in an optical-axis direction, a wavelength converter disposed in a first area of the carrier and configured to convert a wavelength of light emitted from the light source, and at least one coil and at least one magnet disposed in a second area of the carrier and configured to generate electromagnetic force so as to vibrate the carrier in at least one vibration direction, the vibration direction being different from the optical-axis direction.

Embodiments provide a light-emitting apparatus including a light source, a carrier spaced apart from the light source in an optical-axis direction, a wavelength converter disposed in a first area of the carrier and configured to convert a wavelength of light emitted from the light source, and at least one coil and at least one magnet disposed in a second area of the carrier and configured to generate electromagnetic force so as to vibrate the carrier in at least one vibration direction, the vibration direction being different from the optical-axis direction.

Solid state lighting devices and methods for heat dissipation with rotary cooling structures are described. An example solid state lighting device includes a solid state light source, a rotating heat transfer structure in thermal contact with the solid state light source, and a mounting assembly having a stationary portion. The mounting assembly may be rotatably coupled to the heat transfer structure such that at least a portion of the mounting assembly remains stationary while the heat transfer structure is rotating. Examples of methods for dissipating heat from electrical devices, such as solid state lighting sources are also described. Heat dissipation methods may include providing electrical power to a solid state light source mounted to and in thermal contact with a heat transfer structure, and rotating the heat transfer structure through a surrounding medium.

Solid state lighting devices and methods for heat dissipation with rotary cooling structures are described. An example solid state lighting device includes a solid state light source, a rotating heat transfer structure in thermal contact with the solid state light source, and a mounting assembly having a stationary portion. The mounting assembly may be rotatably coupled to the heat transfer structure such that at least a portion of the mounting assembly remains stationary while the heat transfer structure is rotating. Examples of methods for dissipating heat from electrical devices, such as solid state lighting sources are also described. Heat dissipation methods may include providing electrical power to a solid state light source mounted to and in thermal contact with a heat transfer structure, and rotating the heat transfer structure through a surrounding medium.