Disclosed is a dual inline memory module with temperature-sensing scenario modes. A plurality of volatile memory components and an EEPROM component are disposed on a module board. A plurality of LED components and a scenario-lighting controller are disposed at a radiant side of the module board. A light bar is located at the radiant side of the module board without direct installing relationship. A plurality of clamping-type heat spreaders are fastened to one another in a manner that the light bar is tightly clamped. Therein, the power of the scenario-lighting controller component is shared and linked with the power supply system of the LED components and the signals of the scenario-lighting controller component are shared and linked with the signal connection system of the EEPROM component. Accordingly, the lighting scenario performances controlled by the scenario-lighting controller accord with the sensing temperatures to adjust memory refreshing frequencies to avoid any incorrect performance caused by sensed temperature differences.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.

The present invention is a lighting fixture device with a frustoconical housing. The frustoconical housing has a housing edge and an inner housing chamber accessible by a housing aperture. This inner housing chamber includes a parabolic reflective surface with multiple symmetrical reflective sections. Each reflective section includes at least one focal point. The device also includes an LED board mounting post forming a vertical axis through the vertex of the parabolic reflective surface. The LED board mounting post includes at least one mounting surface, to which is mounted multiple LED boards. Each LED board includes at least one LED. A central axis of each LED is aligned with at least one of the focal points.

The invention provides a vapor chamber element (1000) comprising a first part (1100), a second part (1200), and a third part (1300), wherein the second part (1200) and third part (1300) are associated to the first part (1100), wherein the second part (1200) and third part (1300) are configured spatially separated with a first distance (d1) along a first length (L1), defining an opening (200) between the second part (1200) and the third part (1300); wherein the vapor chamber element (1000) comprises one or more vapor chambers (100) at least partially comprised by the second part (1200) and third part (1300); wherein the vapor chamber element (1000) further comprises one or more heat fin elements (2000), wherein the one or more heat fin elements (2000) comprise one or more heat fins (2100), wherein the one or more heat fin elements (2000) bridge the first distance (d1) and close a part of the opening (200).

According to the present specification there is provided a rotatable heat sink device which comprises a heat sink configured to enclose a cooling fluid, and the heat sink is rotatable about a rotational axis. The heat sink, in turn, comprises a first portion configured to receive thermal energy from a source external to the heat sink, and a second portion configured to dissipate at least a portion of the thermal energy to surroundings external to the device. The device further comprises an optical wavelength conversion material disposed on an outside surface of the first portion of the heat sink, and an agitator disposed inside the heat sink. The agitator is rotationally independent of the heat sink and is configured to promote circulation of the cooling fluid between the first portion and the second portion.

A light emitting diode-based bulb that includes a bracket and a housing translatably coupled with the bracket. The housing includes at least one light emitting diode (LED) unit disposed on a front face of the housing arranged to generate light in a direction away from the front face of the housing and a rear face of the housing with a heat sink thermally integrated into the housing. The heat sink including at least one heat dissipating member extending outwardly from the rear face of the housing to dissipate heat generated by the at least one light emitting diode (LED) unit. A fan is attached to the rear face of the housing, where the fan generates airflow that removes the heat generated by the least one light emitting diode unit.

The invention discloses a lamp radiator, including a heat conducting plate, wherein the heat conducting plate is fixed together with a fin group for heat dissipation; and a power supply box equipped with a power supply is respectively fixed at the left side and the right side of the heat conducting plate when the lamp radiator is used. The heat conducting plate is an integrated structure which is composed of a base plate and two leg plates; and the cross section of the heat conducting plate is Π-shaped. The length of the fin group for heat dissipation may be changed according to the power of an energy-saving lamp; and the lamp radiator further includes a heat pipe. The invention also discloses an LED energy-saving lamp having the above lamp radiator. When the lamp radiator and the energy-saving lamp according to the invention are used, heat is dissipated upwards through the lamp radiator, so that the service life of the power supply can be prolonged; moreover, the length of the fin group may be changed according to the power of the energy-saving lamp, and fin groups with different lengths may be produced by only using one set of molds, so that cost is reduced; and in addition, through the design of the heat conducting plate, the fin group, the heat pipe and the like, the heat dispersion performances are good, and the lamp radiator and the LED energy-saving lamp can be widely applied to the illumination field.

An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

An LED array is mounted on a base that is thermally coupled to a heat spreader. At least one aperture is provided between the support area and an edge of the heat spreader. The heat spreader may be coupled to a thermal pad which has sufficient thermal conductivity and is sufficiently thin to allow the thermal resistivity between the heat spreader and a corresponding heat sink to be below a predetermined value.

The present application relates to a light emitting diode module comprising: a light source device (11), a cover (10) for said light source device (11), the cover (10) being arranged to connect to an optical device (21); wherein said cover (10) comprises a heat conducting part (24, 34) which has an at least one order of magnitude higher thermal conductivity than the remaining part of the cover (10) and which is arranged to thermally connect said light source device (11) with said optical device (21). The present application further relates to a corresponding cover for a light source device (11) in a light emitting diode module (1).