Evaporator assemblies, vapor chamber assemblies, and methods for fabricating a vapor chamber are disclosed. In one embodiment, an evaporator assembly for a vapor chamber includes an evaporator surface, an array of posts extending from the evaporator surface, and an array of vapor vents within the evaporator surface. Each vapor vent of the array of vapor vents is configured as a depression within the evaporator surface. The evaporator assembly further includes a porous layer disposed on the evaporator surface, the array of posts, and the array of vapor vents.

The multiple panel heat exchanger includes two or more heat exchange panels arranged side-by-side series with their major cross-sectional areas normal to airflow across the heat exchanger. The heat exchange panels are fluidically connected in series and with a first heat exchange panel in the series having a heat exchange fluid inlet into the heat exchanger and a last heat exchange panel in the series having a heat exchange fluid outlet from the heat exchanger. An inlet liquid refrigerant injector and vaporizer has a valve that can control the rate of injection and can close completely. The panels are connected by a pipe assembly containing another valve that can also control the rate of gas refrigerant passage and which can also be closed.

In the present chiller apparatus, a refrigerant flow path is branchably attached to a lower electrode serving as a large sample table, which copes with a case where the surface area of a sample is large in a configuration in which a plasma treatment device connected to a refrigerant cycle equipped with a heating device is applied. A control device transmits a heating adjustment control signal generated based on a result of a PID arithmetic operation including proportion, integration, and differentiation on a lower electrode refrigerant pipe refrigerant detection temperature detected from a temperature sensor provided in the vicinity of a refrigerant flow path of a heat insulating portion relative to the lower electrode of a lower electrode refrigerant pipe connected to be linked to the refrigerant cycle to a heating device and performs feedback control such that the lower electrode refrigerant pipe refrigerant detection temperature becomes a setting temperature.

The application relates to a roll bond evaporator plate with a width and a height, wherein the roll bond evaporator plate comprises at least one cutout which is delimited at least on three side edges by the roll bond evaporator plate. The application further relates to a refrigerant circuit with such roll bond evaporator plate as well as to a laboratory chamber, climate chamber, cold chamber or environment simulation chamber with such roll bond evaporator plate.

A heat exchanger module includes a skin condenser and a skin evaporator. The skin condenser includes an inner condenser plate, an outer condenser plate coupled to the inner condenser plate and a condenser tube channel formed on one of the inner condenser plate and/or the outer condenser plate. The evaporator includes an inner evaporator plate, an outer evaporator plate coupled to the inner evaporator plate, and an evaporator tube channel formed on one of the inner evaporator plate and/or the outer evaporator plate. The heat exchanger also includes an insulation layer extending between the inner condenser plate and the inner evaporator plate. Each of the plates that form the skin condenser and/or evaporator can be formed from different materials and/or have different material thicknesses to reduce heat transfer through the insulation layer from the condenser to the evaporator while also promoting heat transfer through natural convection with surrounding air.

A brazed plate heat exchanger (100) includes a plurality of first and second heat exchanger plates (110, 120) having different patterns of ridges and grooves providing contact points between neighbouring plates under formation of interplate flow channels for fluids to exchange heat, said interplate flow channels being in selective fluid communication with first, second, third and fourth large port openings (O1, O2, O3, O4) and first and second small port openings (SO1, SO2) forming a suction gas heat exchanger together with a dividing surface (DW). The ridges (R1, R2a, R2b) and grooves (G1, G2a, G2b) are formed such that the interplate flow channels between different plate pairs have different volumes. Disclosed is also a refrigeration system and method including such as heat exchanger.