A heat pipe including a vapor line having a flow path through which a working fluid vapor flows, wherein the vapor line includes walls opposite to each other across the flow path, and a support post disposed in the flow path and spaced apart from the walls, wherein the walls are made of a plurality of metal layers stacked one over another, and the support post is made of a single seamless member having the same thickness as the walls.

The advanced control heat transfer loop apparatus (1) for heat transfer and thermal control applications uses a two-phase fluid as a working media and comprises at least one evaporator (2) to be connected with a heat source and comprising primary capillary pump (4), a thermal stabilization-compensation chamber (3) being attached to the at least one evaporator (2), at least one condenser (24) to be connected with a heat sink, liquid lines (22) and vapor lines (23) connecting the at least one evaporator (2) and the at least one condenser (24), a remote compensation chamber (20), temperature sensors (27) for detecting the temperature of the remote compensation chamber (20) and at the thermal stabilization compensation chamber (3) attached to the at least one evaporator (2), at least one heating element (19) for heating the remote compensation chamber (20), and a controller (28). The controller (28) is configured to monitor the temperatures detected by the sensors (27) and to control the heating element (19) in such a way that the value of the difference ΔT.sub.Control between the temperature of the remote compensation chamber (20) and the temperature of the thermal stabilization-compensation chamber (3) attached to the at least one evaporator (2) is positive.

A loop-type heat pipe includes: an evaporator; a condenser; a liquid pipe; and a vapor pipe. The evaporator is formed by layered metal layers that include: a first outermost metal layer; a second outermost metal layer; and an inner layer. The inner layer includes: a first metal layer adjacent to the first outermost metal layer; and a second metal layer adjacent to the second outermost metal layer. At least one space and a porous member are provided in the inner layer. The first metal layer is formed with a first bottomed groove. The second metal layer is formed with a second bottomed groove. One end of the space corresponds to a portion of the first metal layer where the first bottomed groove is formed. The other end of the space corresponds to a portion of the second metal layer where the second bottomed groove is formed.

If a gas-liquid separation structure is introduced into a phase-change cooling device to prevent the cooling performance from decreasing, manufacturing costs increase; therefore, a refrigerant intermediary device according to an exemplary aspect of the present invention includes a refrigerant container configured to contain refrigerant; a first inlet, provided for an outer periphery of the refrigerant container, through which a vapor-phase refrigerant and a first liquid-phase refrigerant flowing in; a first outlet, provided for the outer periphery of the refrigerant container, through which the vapor-phase refrigerant flowing out; a second inlet, provided for the outer periphery of the refrigerant container, through which a second liquid-phase refrigerant flowing in; and a second outlet, provided for the outer periphery of the refrigerant container, through which the first liquid-phase refrigerant and the second liquid-phase refrigerant flowing.

Fluid to fluid heat exchange processes involve the hot fluid reducing in temperature and the cold fluid increasing in temperature. To transfer heat between the two fluids, a third, separated heat transfer fluid is often used. The present invention allows for passive heat transfer between the two fluids, using a separate heat transfer fluid, while enabling heat absorption and rejection through a continuously variable temperature.

Embedded cooling systems and methods of forming the same are disclosed. An embedded cooling system includes a PCB having a first major surface opposite a second major surface and power device stacks embedded within the PCB between the first major surface and the second major surface. Each power device stack includes a first substrate and a second substrate, and an electrical insulation layer disposed between the first substrate and the second substrate. The embedded cooling system further includes a power device coupled to the first substrate of each power device stack and heat pipes having a first end and a second end spaced a distance apart from the first end. The first end is embedded within the PCB substrate and the second end extends outside of the PCB substrate. The second substrate of the one or more power device stacks is coupled to the one or more heat pipes.

Disclosed is a flat plate pulsating heat pipe (FP-PHP) serving as a power-free high efficiency heat transfer system for small electronic devices such as mobile phones and laptop computers. The FP-PHP is manufactured using MEMS technology and configured to have a single-turn loop or a multi-turn loop, each having a single diameter channel or a dual diameter channel. Further, since a working fluid used in a flat plate pulsating heat pipe exhibits different characteristics according to the main working temperature, provided is a flat plate pulsating heat pipe which includes a working fluid having optimum efficiency in the main working temperature. In addition, the flat plate pulsating heat pipe applicable at various installation angles, of the present invention which is for achieving the above purpose, includes: a silicon lower wafer plate having a rectangular shape; a capillary tube comprising a channel which has a constant depth on the upper surface of the silicon wafer lower plate and is formed in the form of a straight line along the longitudinal direction of the silicon wafer lower plate, wherein the channel forms a closed loop which is bent at both ends of the silicon wafer lower plate and is connected; a wafer upper plate which is coupled on top of the silicon wafer lower plate and seals the capillary tube; and a working fluid filled inside the capillary tube, wherein the capillary tube is made of a combination of a dual-diameter tube including a pair of channels having different widths and a single diameter tube including a pair of channels having the same width.

A heat pipe including a vapor line having a flow path through which a working fluid vapor flows, wherein the vapor line includes walls opposite to each other across the flow path, and a support post disposed in the flow path and spaced apart from the walls, wherein the walls are made of a plurality of metal layers stacked one over another, and the support post is made of a single seamless member having the same thickness as the walls.

An evaporator that changes at least a part of a working fluid from a liquid phase into a gas phase by using heat of a heat-generating element includes: a housing including at least one working fluid inlet and at least one working fluid outlet and defining a working fluid-receiving chamber that receives the working fluid; a heat-absorbing element located at a bottom surface of the housing and thermally connected to the heat-generating element; and a wall structure rising from a boiling surface in the working fluid-receiving chamber and dividing a bottom region of the working fluid-receiving chamber into a plurality of segments to form a plurality of recesses located in the bottom region of the working fluid to trap the working medium.

A cooling device including: a container in which a refrigerant is sealed; a plurality of evaporation structures that evaporate the refrigerant in a liquid phase inside the container by heat reception; a plurality of condensation structures each of which is provided in corresponding one of the plurality of evaporation units and which condenses the refrigerant in a gas phase inside the container by heat radiation; a transport structure that transports the refrigerant in the liquid phase from the condensation units to the evaporation units by surface tension; and a movement portion that communicates the plurality of condensation units such that the refrigerant in the liquid phase is movable between the plurality of condensation structures.