A heat dissipation module being disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, a magnetic field generator and a plurality of magnetic powder. The heat source is heat conducting to the evaporator. The pipe is connected to the evaporator to form a loop therewith, and a working fluid is filled in the loop. The magnetic field generator is disposed outside of the evaporator. The magnetic powder is movably disposed in the evaporator. A magnetic field generated by the magnetic field generator drives the magnetic powder to form a channel in the evaporator where the working fluid passes through. The heat generated by the heat source is transmitted to the evaporator, and the working fluid in liquid phase absorbs the heat and is phase-transited to vapor phase and flows from the evaporator towards the pipe.

A capillary-driven heat transfer device is adapted to extract heat from a heat source and release this heat to a cold source using a two-phase working fluid. The device includes an evaporator having a microporous mass performing capillary pumping of fluid in the liquid phase, a condenser, a reservoir having an inner chamber and an inlet and/or outlet port, a vapor communication circuit, connecting the outlet of the evaporator to the inlet of the condenser, a liquid communication circuit, and a non-return device arranged between the inner chamber of the reservoir and the microporous mass of the evaporator, and arranged to prevent liquid present in the evaporator from moving to the inner chamber of the reservoir.

A liquid system for circulating a liquid through a circulation loop includes a liquid pump, a primary liquid reservoir and an auxiliary liquid reservoir. The liquid pump pressurizes liquid within the circulation loop. The primary liquid reservoir has a primary variable volume expandable to accommodate volumetric expansion of pressurized liquid up to a threshold volume. The auxiliary liquid reservoir has an auxiliary variable volume expandable only after the threshold volume is exceeded up to a maximum volume.

A vapor chamber structure includes a main body having multiple internal independent chambers. A capillary structure is disposed in each of the independent chambers. A working fluid is contained in each of the independent chambers. The working fluids contained in the independent chambers have different physical or chemical properties. The independent chambers are respectively in contact with different heat sources with different properties to conduct the heat. Accordingly, one single vapor chamber structure can provide complex heat conduction effect for different heat sources.

A heat exchanger for cooling a heat-generating component includes first and second plates, each having a core layer of a first metal and an inner clad layer of a lower melting second metal, which is inert to the working fluid contained in a fluid chamber of the heat exchanger. The outer peripheral sealing surfaces of the first and second plates are joined by welding, wherein the weld joint is fluidly isolated from the fluid chamber by a layer of the second metal in an area adjacent to the weld joint. In some embodiments, the heat exchanger includes liquid flow passages and primary and secondary gas flow passages, each secondary passage providing communication between primary gas flow passages. The gas and liquid flow passages may be defined by a wick material having hydrophilic areas and non-wicking areas of reduced thickness. A method of manufacturing is also disclosed.

A loop type heat pipe includes: an evaporator that vaporizes working fluids; a first condenser and a second condenser that liquefy the working fluids respectively; a first liquid pipe that includes a first flow channel and connects the evaporator and the first condenser to each other; a second liquid pipe that includes a second flow channel and connects the evaporator and the second condenser to each other; and a first vapor pipe that connects the evaporator and the first condenser to each other; and a second vapor pipe that connects the evaporator and the second condenser to each other. The evaporator includes: a third flow channel connected to the first liquid pipe and the first vapor pipe; a fourth flow channel connected to the second condenser and the second vapor pipe; and a partition wall that partitions the third flow channel and the fourth flow channel from each other.

A pump-augmented Loop Heat Pipe (LHP) includes a conventional LHP evaporator/reservoir assembly; one or more additional evaporators; a condenser; a condenser bypass; and a pump upstream of the condenser and condenser bypass and configured to pump fluid generally toward the one or more additional evaporators.

A heat dissipation structure mounted in an electronic device includes a base body defining a seal chamber, a heat transfer medium in the seal chamber, and a connecting element. The seal chamber includes interconnected evaporation and condensation portions. The connecting element is coupled to the evaporation portion and a camera module of the electronic device. Heat generated by the camera module is transferred to the evaporation portion via the connecting element, the heat transfer medium turns to gas, and the gas flows into the condensation portion and condenses, dissipating the heat to the outside of the electronic device. The disclosure further provides an electronic device using the heat dissipation structure.

A loop heat pipe includes: an evaporator having an enclosure with a heat receiving side and side walls with openings forming an evaporator chamber, the evaporator chamber including a primary capillary structure adjacent to the heat receiving side of the enclosure and extending to the side walls of the evaporator chamber, a plurality of grooves in the primary capillary structure, each of which extends from an opening in one of the side walls to an opening in an opposite side wall, the plurality of grooves transporting vapor from the primary capillary structure to the openings; and a condenser.

A loop heat pipe includes a metal layer stack of two outermost metal layers and intermediate metal layers stacked between the two outermost metal layers. The metal layer stack includes an evaporator, a condenser, a vapor pipe, a liquid pipe, and an inlet. The metal layer stack forms a flow passage that circulates the working fluid through the evaporator, the vapor pipe, the condenser, and the liquid pipe. At least one of the two outermost metal layers includes a thin wall portion that forms a portion of a wall of the vapor pipe in the flow passage.