A loop heat pipe includes: an evaporator configured to vaporize a working fluid; a condenser configured to liquefy the working fluid; a liquid pipe that connects the evaporator and the condenser to each other; and a vapor pipe that connects the evaporator and the condenser to each other. The condenser includes: a first outer metal layer; a second outer metal layer; and an inner metal layer that is provided between the first outer metal layer and the second outer metal layer, and having a flow channel through which the working fluid flows. The first outer metal layer includes: a first inner face that contacts the inner metal layer; a first outer face opposite to the first inner face in a thickness direction of the first outer metal layer; and a first recess provided in the first outer face so as not to overlap the flow channel in plan view.

A thermal module includes a base seat and multiple heat pipes. The base seat has a heat absorption side and a heat conduction side. Each heat pipe has a heat absorption end and a heat dissipation end. The heat absorption end has a pair of long sides and a pair of short sides. The long sides and the short sides are connected with each other in the form of a loop to form the heat absorption end. The heat pipes are assembled with each other with the long sides attached to each other. The heat pipes are assembled with the base seat with the short sides attached to the heat conduction side of the base seat. By means of the above arrangement, the number of the heat pipes disposed in a limited area or space can be greatly increased to enhance the heat conduction efficiency.

A vapor chamber that includes a housing having a first sheet and a second sheet facing each other, wherein at least a part of an outer edge of the housing has a step shape in which an end portion of the second sheet is positioned inside an end portion of the first sheet, and the housing has a bonded portion inside the end portion of the second sheet where the first sheet and the second sheet are bonded to each other; a protective film covering a boundary between the end portion of the second sheet and the first sheet at the step shape; a working fluid enclosed in the housing, and a wick on an inner wall surface of the first sheet or the second sheet.

A liquid-vapor composite heat dissipation system includes a heat exchange device filled with a working fluid, a number of liquid-vapor composite heat dissipation units that are positioned higher than the heat exchange device, each of the liquid-vapor composite heat sink units having a housing with an internal capillary occupying the interior of the housing and partially separating a spatially disconnected inlet chamber and an outlet chamber. The bottom of the housing is attached to a heat source. A liquid supply tube is connected to the heat exchange device at one end, and at the other end to a liquid inlet of each of the liquid-vapor composite heat sink units through each of the liquid supply pipes. A liquid return tube is connected to the heat exchange device at one end, and to each of the liquid-vapor composite heat sink units at the other end through each of the return pipes.

An integrated vapor chamber includes an outer shell and a plurality of composite capillary structures. The outer shell includes a flat casing and a plurality of partitions integrally formed. The flat shell includes a chamber, and the partitions are disposed in the chamber to separate the chamber into a plurality of flow channels. Each composite capillary structure is extended along each flow channel and distributed in the chamber. The composite capillary structure includes a metal mesh and a plurality of sintered powder uniformly sintered in the metal mesh. Furthermore, this disclosure also discloses a manufacturing method of the integrated vapor chamber. Therefore, the manufacturing method of the thin vapor chamber is simplified to improve the yield rate.

A heat-transfer device and methods for forming the heat-transfer device are disclosed. The method includes forming a first green structure using digital light processing, the first green structure including a different porosity in at least two sections. The method also includes exposing the first green structure to heat to remove resin used during the digital light processing from the first green structure. The method further includes sintering the first green structure to form at least a portion of the heat-transfer device.

A method for manufacturing a heat exchanger includes: providing a porous material that has a porosity of about 30% to about 80%; forming an oxide layer on a surface of the porous material by heat treating the porous material at a temperature in a range of 600° C. to 900° C. for a time period in a range of 8 hours to 12 hours in air; and integrating the porous material into a cold side flow passage of the heat exchanger.

Various systems and methods are provided for creating a wicking structure. In one example, a method for creating a wicking structure can include creating, using a 3D printing technique, a macro wicking element including a lattice structure formed by a grid of a first material, the lattice structure including pores formed between the grid of first material. The method can also include creating, using the 3D printing technique, a first micro wicking element including powder particles distributed within the pores of the lattice structure, and creating, using the 3D printing technique, a second micro wicking element by removing at least a portion of the lattice structure.

A three-dimensional heat dissipating device includes a vapor chamber, a heat pipe, a working fluid and a solder bonding portion. The vapor chamber includes an inner cavity and a first joint. The first joint is formed with a passage being in communication with the inner cavity. The heat pipe is provided with a pipe space and a second joint. The pipe space is in communication with the inner cavity through the passage. The second joint is sleeved to surround the first joint such that one end surface of the second joint is directly contacted with one surface of the vapor chamber. The working fluid is filled within the pipe space and the inner cavity. The solder bonding portion connected to the second joint and the surface of the vapor chamber for integrating the heat pipe and the vapor chamber together.

A three-dimensional heat transfer device includes a first thermally conductive casing, a second thermally conductive casing, a first capillary structure, a second capillary structure and a heat pipe. The second thermally conductive casing has a through hole. The second thermally conductive casing is mounted on the first thermally conductive casing so as to form a liquid-tight chamber. The first capillary structure is disposed on the first thermally conductive casing. The second capillary structure is disposed on the first thermally conductive casing. Projections of the first capillary structure and the second capillary structure on the outer surface and an extension surface of the outer surface are located in an extent of the outer surface, and the second capillary structure is located closer to the second thermally conductive casing than the second capillary structure. The heat pipe is disposed through the through hole and in contact with the second capillary structure.