F28F21/085

Heat dissipation structure

A heat dissipation structure includes a main body. The main body has an upper plate, a lower plate, an extensible portion and a chamber. The upper plate, the extensible portion and the lower plate together define the chamber. The extensible portion is disposed between the upper and lower plates. A main body capillary structure is disposed in the chamber. The main body capillary structure is disposed on an inner wall of the chamber. A working fluid is filled in the chamber.

HEAT EXCHANGER, METHOD FOR PRODUCING A HEAT EXCHANGER AND POWER PLANT COMPRISING SUCH A HEAT EXCHANGER

A heat exchanger and method for producing such a heat exchanger which during operation in a flow direction is flown through by a medium to be cooled and by two different cooling media. A power plant has a generator cooled by means of a generator cooling gas and a heat exchanger cooling the generator cooling gas.

INTEGRATED HYBRID COMPACT FLUID HEAT EXCHANGER

An Integrated Hybrid Compact Fluid Heat Exchanger is disclosed. An example embodiment includes: a micro-channeled plate for a stream of a working fluid, the micro-channeled plate being diffusion bonded or brazed with a cover plate; and a fin assembly brazed, diffusion bonded, or welded to the micro-channeled plate. Other embodiments include a fan or blower coupled to the Integrated Hybrid Compact Fluid Heat Exchanger via air ducting or close coupling.

Ultra thin heat exchangers for thermal management

A heat exchanger for cooling a heat-generating component includes first and second plates, each having a core layer of a first metal and an inner clad layer of a lower melting second metal, which is inert to the working fluid contained in a fluid chamber of the heat exchanger. The outer peripheral sealing surfaces of the first and second plates are joined by welding, wherein the weld joint is fluidly isolated from the fluid chamber by a layer of the second metal in an area adjacent to the weld joint. In some embodiments, the heat exchanger includes liquid flow passages and primary and secondary gas flow passages, each secondary passage providing communication between primary gas flow passages. The gas and liquid flow passages may be defined by a wick material having hydrophilic areas and non-wicking areas of reduced thickness. A method of manufacturing is also disclosed.

HEAT EXCHANGE APPARATUS AND METHOD
20210389061 · 2021-12-16 ·

A heat exchanger apparatus includes a tube having a wall with an inner surface and an outer surface. The tube is configured to receive heat exchange fluid at one end, and output, when heated through the wall, vapor of the heat exchange fluid at the opposing end. A first layer of thermally conductive porous material is disposed on the inner surface of the tube. Heating equipment, a heat exchanger, and a method of heating are also disclosed.

METHOD OF MANUFACTURING A HEAT DISSIPATION DEVICE
20210381777 · 2021-12-09 ·

A method of manufacturing a heat dissipation device is disclosed. The heat dissipation device manufactured with the method includes two titanium metal sheets and a metal mesh. According to the method, the two titanium metal sheets and the metal mesh are subjected to a surface treatment, so that surface of any one of the titanium metal sheets and the metal mesh is modified to form a hydrophilic layer. With these arrangements, the titanium metal material can be freely plastically deformed and possess a capillary force, and the titanium metal sheet can therefore be used in place of the conventional copper sheet to serve as a material for making heat dissipation devices. The heat dissipation devices so produced can have largely reduced weight and largely improved heat dissipation performance.

COOLING DEVICE AND METHOD FOR PRODUCING IT
20220196349 · 2022-06-23 ·

A cooling device for providing passive radiation cooling includes a base substrate and a coating that is arranged on the base substrate and absorbs light of certain wavelength ranges. The base substrate is a metal substrate.

Plate type heat exchanger
11353268 · 2022-06-07 · ·

A plate type heat exchanger includes a plate package in which a plurality of heat exchange plates is stacked to form a flow path, through which fluid flows, an end plate coupled to an outside of the plate package, and a socket connected to the plate package by passing through the end plate. The end plate includes a base which is in contact with the outside of the plate package, a socket hole which is formed through the base and into which the socket is inserted, and a ridge that protrudes outward from an edge of the socket hole of the base.

THERMAL MANAGEMENT PLANES
20220163268 · 2022-05-26 ·

Some embodiments include a thermal management plane. The thermal management plane may include a top casing comprising a polymer material; a top encapsulation layer disposed on the top casing; a bottom casing comprising a polymer material; a bottom encapsulation layer disposed on the bottom casing; a hermetical seal coupling the bottom casing with the top casing; a wicking layer disposed between the bottom casing and the top casing; and a plurality of spacers disposed between the top casing and the bottom casing within the vacuum core, wherein each of the plurality of spacers have a low thermal conduction. In some embodiments, the thermal management plane has a thickness less than about 200 microns.

Vapor chamber with support structure and manufacturing method therefor

A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.