A heat exchanger includes at least two plate bodies stacked with each other and at least one connecting sheet. Each of the at least two plate bodies is provided with a plurality of micro-passages. The at least one connecting sheet is arranged between adjacent plate bodies of the at least two plate bodies. A solder is disposed on each of two opposite sides of the at least one connecting sheet, and the solder is configured to weld and fix the at least one connecting sheet with the adjacent plate bodies of the at least two plate bodies.

A preheating device for preheating the fuel of an internal combustion engine with a heating medium has a fuel transport device with a fuel inlet and a fuel outlet, and has a fuel transport channel connecting the fuel inlet and the fuel outlet. The preheating device also has a heating medium transport device with a heating medium inlet and a heating medium outlet, as well as a heating medium transport channel connecting the heating medium inlet and the heating medium outlet and/or at least one heating element. The fuel transport device and the heating medium transport device and/or the at least one heating element are in thermal contact with each other and thus form a heat exchanger via which a fuel transported in the fuel transport device can be heated by a heating medium transported in the heating medium transport device and/or by the at least one heating element.

Provided is a heat sink having a clad structure of Co—Mo composite materials and Cu materials, satisfying high heat-sink properties required of the heat sink for use in a semiconductor package with a frame on which a high-output and small-sized semiconductor is mounted, and preventing, when applied to the semiconductor package with a frame, crack of the frame due to local stress concentration. The heat sink has three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that the Cu layers are outermost layers on both sides thereof, the Cu layers as the outermost layers each having a thickness t.sub.1 of 40 μm or more, the heat sink satisfying 0.06≤t.sub.1/T≤0.27 (where T: heat sink thickness) and t.sub.2/T≤0.36/[(total number of layers−1)/2] (where t.sub.2: Cu—Mo composite layer thickness, the total number of layers: sum of numbers of Cu layers and Cu—Mo composite layers).

A stackable heat pipe assembly and method of making the same comprising first and second conductive metal plates, a conductive metal tube, and a working pipe is provided. The first and second conductive metal plates have first and second contact sides and first and second attachment sides, respectfully. The first conductive metal plate has a through hole therethrough. The first and second attachment sides have first and second planar central portions and first and second walls, first and second top ledges, and first and second expanded walls theresurrounding, respectively. The conductive metal tube has an inner wall having a wick structure thereon. A plurality of brazing rings are used to braze the working pipe to the through hole and the first and second planar central portions to the first and second attachment rim ends, respectively. Either of the first or second contact sides contacts a heat source and is stackable.

A pipe is manufactured through injecting a chloride ion-containing aqueous solution into a copper pipe to fill the copper pipe, thereby forming a copper oxide film on an inner surface of the copper pipe.

A heat transfer body 3 is prepared. The heat transfer body 3 forms an inner space 7 for existence of one of a higher-temperature fluid or a lower-temperature fluid. The heat transfer body 3 constitutes a heat exchanger, and is formed of a copper material as a wall surrounding the inner space 7. In the wall, a flow path through which the other of the higher-temperature fluid and the lower-temperature fluid flows is formed. By LMD treatment, an LMD layer is formed directly on an outer circumferential surface 3a of the heat transfer body 3. In the LMD treatment, a metal material is supplied to a supply position on the outer circumferential surface 3a, and the supply position is irradiated with laser light to form an LMD layer 5. An energy density of the laser light is set to melt both the metal material and the outer circumferential surface 3a.

A heat pipe that employs a metal woodpile capillary wick. The heat pipe includes an outer enclosure defining a chamber therein that contains a working fluid, an evaporator section for converting the fluid to vapor in response to being heated from a heat source, and a condenser section for converting the vapor back into the fluid in response to cooling from a heat sink. The wick is positioned within the chamber in contact with the enclosure and extends between the evaporator section and the condenser section. The wick includes a plurality of layers each having spaced apart parallel thermally conductive bars defining channels therebetween, where the bars in adjacent layers are oriented in different directions and where the condensed fluid flows through the channels in the wick from the condenser section to the evaporator section.

Heatsink has a plurality of cross-connected pathways that create areas of turbulent airflow which is useful for quickly dissipating heat in the heatsink. The cross-connected pathways can include vertically extending pathways that extend from the baseplate to the top surface of the single piece of material with an increasing volume away from the baseplate toward the top surface of the single piece of material and horizontally extending pathways are oriented in a plurality of rows where a diameter of the horizontally extending pathways increases in each row of the plurality of rows from the baseplate.

A highly efficient heat exchanger member is realized by providing, to a metal surface, a characteristic that is not found in the metal itself with a coating film excelling in thermal conductivity.

A heat exchanger member is made of metal, and includes a carbon-containing oxide film (112B) provided on the metal surface and having fine concave-convex portions (112C). An average spacing between apexes of convex portions of the fine concave-convex portions (112C) is greater than or equal to 40 nm and less than or equal to 120 nm, and an average value of differences in height between apexes of adjacent convex portions and bottom points of concave portions is greater than or equal to 30 nm and less than or equal to 250 nm.

A heat conductor includes a housing including a space therein, a working medium in the space, and a wick in the space. The housing includes a first region, a second region located at one side of the first region in one direction perpendicular to a thickness direction of the housing, and a third region located at another side of the first region in the one direction. The first region includes a first end portion connected to the second region, and a second end portion connected to the third region. The wick is only in the second region.