A method of forming an assembly between a panel and a tube includes forming a hole in the panel, where a diameter of the hole is smaller than an outer diameter of the tube, and preforming a first end of the tube to conceal the hole of the panel. A diameter of the preformed portion is greater than the diameter of the hole and the outer diameter of the tube. The method further includes aligning a second end of the tube with the hole of the panel, followed by inserting the tube into the hole by application of axial force on the tube until the preformed first end of the tube abuts a periphery of the hole of the panel. The method also includes achieving an interference fit between the hole of the panel and the tube.

Technologies provide a heat pipe having a controlled torque resistance. The techniques disclosed herein provide a heat pipe that can function as a coupling device and as a thermal interface between two moving components of a device without the need of a mechanical hinge. In some configurations, a heat pipe comprises a housing having an outer surface and having an inner surface defining a cavity. The heat pipe can also comprise one or more components for transferring heat from a first region to a second region. In addition, the heat pipe is configured to provide a predetermined torque resistance about a first axis that is perpendicular to a longitudinal axis of the heat pipe. Components, such as a heat source and a heat sink, that are attached to the heat pipe can be hingeably coupled with a predetermined torque resistance without requiring a hinge and a separate thermal interface device.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A heat-dissipation substrate structure with high adhesive strength is provided. The heat-dissipation substrate structure includes a heat-dissipation base layer, a functional layer, and a matching layer. The functional layer is formed by sputtering, and has a single layer structure or a multi-layer structure. A thickness of each layer of the functional layer is less than 3 μm. The matching layer has a single layer structure or a multi-layer structure, and a thickness of each layer of the multi-layer structure of the matching layer is less than 1 μm. The matching layer is formed by sputtering of one or any two of titanium, titanium alloy, nickel, and nickel alloy. The functional layer and the heat-dissipation base layer are two heterogeneous metal layers, and the matching layer is located between the functional layer and the heat-dissipation base layer.

A method of forming an assembly between a panel and a tube includes forming a hole in the panel, where a diameter of the hole is smaller than an outer diameter of the tube, and preforming a first end of the tube to conceal the hole of the panel. A diameter of the preformed portion is greater than the diameter of the hole and the outer diameter of the tube. The method further includes aligning a second end of the tube with the hole of the panel, followed by inserting the tube into the hole by application of axial force on the tube until the preformed first end of the tube abuts a periphery of the hole of the panel. The method also includes achieving an interference fit between the hole of the panel and the tube.

A modular system for heat exchange between fluids includes a plurality of open elements that, by means of two end plates, are connected together. An open element is constituted of a folded and sealed sheet material that is arranged in a frame.

Disclosed is a titanium or titanium alloy plate rolled in one direction, wherein a lubricating film is coated on the surface and the coefficient of sliding friction of the lubricating film-coated surface is controlled to less than 0.15. The elongation (L-El) of the titanium or titanium alloy plate in the rolling direction and the r value (T-r) in the direction perpendicular to the rolling direction have the following relation (1).
(T-r)/(L-El)≧0.07  (1)

A heat exchanger is provided. The heat exchanger (40) provides a first plurality of tubes (50) and a second plurality of flow passages (52) which furcate near one of the first (42) and second (44) manifolds into two or more furcated flow passages and subsequently converge to exit the heat exchanger. The plurality of furcated flow passages are intertwined, reducing the distance between flow passages (50,52) containing each fluid therebetween to improve thermal transfer. Further, the furcations create changes of direction of the fluid to re-establish new thermal boundary layers within the flow passages to further reduce resistance to thermal transfer.

A heat pipe or a bundle of heat pipes for transporting geothermal heat in a well is provided. As the temperature rises at one end of the heat pipe, the operating fluid turns to a vapor which absorbs the latent heat. The hot vapor within the heat pipe flows to the cooler end of the heat pipe where it then condenses and releases the latent heat. The condensed fluid then flows back to the hot side of the heat pipe and the process repeats itself.

A heat transfer device includes a first and second substrate, and a heat transfer layer. The first substrate includes a first plate and a first adhesive layer that is formed on the first plate. The second substrate includes a second plate and a second adhesive layer that is formed on the second plate. The heat transfer layer is sandwiched between the first adhesive and second adhesive layers, and includes a plurality of carbon flakes that is made from one of graphene or graphite. The carbon flakes lies on the first adhesive layer with partial overlap of the carbon flakes.