A manufacturing method for a plate comprising channels in which the method includes a step of superposing the two strips, a step of welding the two strips along the weld seams, a step of blocking the zones between the weld seams on one side of the strips, a pressurization step with a compressed fluid, where the zones between the weld seams open out along another side, to expand the strips, and a step of opening the zones blocked during the blocking step. This manufacturing method enables the titanium strips to be welded together and shaped by pressurization.

A heat exchanger includes a plurality of first and second fluid passages. The first fluid passages are defined by a pair of opposing first fluid passage walls and a plurality of first fluid diverters disposed between the first fluid passages walls. The second fluid passages are defined by a pair of opposing second fluid passage walls and a plurality of second fluid diverters disposed between the second fluid passage walls. The second fluid diverters include a body portion and a leading edge portion. The first fluid passage walls form a first fluid leading edge that extends upstream of the leading edge portion of the second fluid diverters. The second fluid passages extend in a direction perpendicular to the direction of the first fluid passages.

A heat exchanger includes a housing configured to contain a working fluid. The heat exchanger also includes a plurality of chambers disposed within the housing and arranged so as to be surrounded by the working fluid when the working fluid is within the housing, each chamber configured to contain a phase change material (PCM) that expands upon freezing. The walls of each chamber are formed of a high thermal conductivity material that allows transfer of thermal energy between the working fluid and the PCM in each chamber. The walls of each chamber include expandable bellows configured to deform to increase an internal volume of the chamber as the PCM expands upon freezing.

Embodiments herein relate to a heat sink having nano- and/or micro-replication directly embossed in a bulk solidifying amorphous alloy comprising a metal alloy, wherein the heat sink is configured to transfer heat out of the heat sink by natural convection by air or forced convection by air, or by fluid phase change of a fluid and/or liquid cooling by a liquid. Other embodiments relate apparatus having the heat sink. Yet other embodiments relate to methods of manufacturing the heat sink and apparatus having the heat sink.

A multiple layer metallic laminate including a metallic layer of high heat dispersion characteristics and a thermal barrier material interlaid within the metallic layer. The laminate can include multiple metallic layers having either high heat dispersion characteristics or lesser heat dispersion characteristics. The thermal barrier material can separate portions of the high heat dispersion metallic layers from one another to minimize heat dispersion into isolated portions.

A cooling system, an apparatus for producing hyperpolarized samples, where the apparatus includes the cooling system, and a method for assembling and using the cooling system are disclosed. The cooling system includes a cryogenic chamber, a cooling plate, a sample sleeve, a thermal switch, and an interposer. Also, the cryogenic chamber includes a cryogenic fluid and the cooling plate is disposed in the cryogenic chamber, in contact with the cryogenic fluid. Further, the sample sleeve is configured to receive a sample. The sample sleeve is at least partially inserted in the cryogenic chamber. The thermal switch is disposed between the cooling plate and the sample sleeve. Moreover, the interposer is disposed between at least one of (i) the thermal switch and the cooling plate and (ii) the thermal switch and the sample sleeve. The interposer includes a gallium indium tin alloy.

A vapor chamber with a support structure and its manufacturing method are provided. The vapor chamber with the support structure includes a first plate, a second plate spaced apart from the first plate, and multiple support elements fixed between the first and second plates. On an outer surface of any of the first plate or the second plate, laser welding is performed on positions corresponding to the support elements so as to join the support elements to the first and second plates and to form weld ports on the outer surface of any of the plates. The invention solves the problem of fixing the support structure inside the thin vapor chamber, and therefore mass production can be realized.

A heat dissipation device is disclosed. The heat dissipation device includes a main body and a tubular body. The main body has a chamber. A capillary structure is formed on an inner surface of the chamber by means of laser processing. A working fluid is contained in the chamber. One face of the main body is a condensation face, while the other face of the main body is a heat absorption face. The capillary structure is disposed corresponding to the heat absorption face. The heat absorption face of the main body is made of titanium material. The condensation face is made of titanium material or metal material. The tubular body is correspondingly inserted in the main body. The capillary structure is formed by means of laser processing. This not only solves the problem that the titanium material is difficult to process, but also can enhance the production efficiency.

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

A method for manufacturing a heat dissipation device is disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed and manufactured in a more flexible manner.