A proximity sensing device includes: a light source, a sensing unit, a light guide unit, and a window. The light source emits light, which is guided by the light guide unit to the window. The emitted light reflected by an object is received by the same window. The light guide unit includes a partial-transmissive-partial-reflective (PTPR) optical element, whereby the light emitted from the light source is reflected by the PTPR optical element, while the light reflected by the object passes through the PTPR optical element. There is only one window required.

An imaging device includes a plurality of electronic components, a phase change material, and a heat transfer structure. The plurality of electronic components is configured to collect data and have a predetermined temperature parameter. The plurality of electronic components is disposed within the phase change material. The phase change material has a first material phase and a second material phase. The phase change material has a first material phase and a second material phase. The phase change material is configured to absorb heat through changing from the first material phase to the second material phase. The heat transfer structure is disposed within the phase change material. The heat transfer structure is configured to conduct heat within the phase change material. The phase change material and the heat transfer structure are further configured to regulate a temperature of the electronic components below the predetermined temperature parameter.

A method for locating a center of a field of view of an optical element using a system having a surface disposed at a first illumination, an image receiver, a blocker disposed at a second illumination, the method including disposing the blocker at, at least one location in the field of view upon the surface in a first direction when the brightness of an image within the field of view of the optical element is disposed at a brightness and recording a first location of the blocker; repeating the disposing step in a second direction and at the brightness, wherein the second direction is opposite the first direction and each of the first direction and the second direction is parallel to the surface; and averaging the first location and the second location to yield the center of the field of view of the optical element in the first direction.

A sensor arrangement including at least one electro-optical sensor which is secured to a receiving structure of a sensor holder. The electro-optical sensor includes a sensor housing with an optically active sensor layer that is arranged thereon. The optically active sensor layer forms a light-sensitive plane. The sensor holder includes a non-adjustable receiving structure which compensates for a previously determined deviation in shape of the electro-optical sensor from a desired shape.

A thermoelectric conversion material includes a base material that is a semiconductor having Si and Ge as constituent elements, a first additive element that is different from the constituent elements, has a vacant orbital in a d or f orbital located inside an outermost shell thereof, and forms a first additional level in a forbidden band of the base material, and oxygen. The oxygen content ratio is 6 at % or less.

A system is capable of detecting substrates and can differentiate between zero, one, or multiple transparent or semi-transparent substrates in a stack. The system can include an optical sensor, an optically anti-reflective element, and a detector. The optical sensor outputs light towards the optically anti-reflective element. The light detector is positioned to detect light from the light source that is reflected by substrates, if any, positioned within a detection zone between the optically anti-reflective element and the detector.

An optoelectronic module including a light emitter to generate light to be emitted from the module, a plurality of spatially distributed light sensitive elements arranged to detect light from the emitter that is reflected by an object outside the module, and one or more dedicated spurious-reflection detection pixels.

A laser analysis device includes a laser analysis unit that a sample is irradiated with laser light, a cover that covers a periphery of the laser analysis unit, so as to prevent the laser light from being emitted to outside, and has a slit in at least a part of the cover, a fastener configured to open and close the slit, and an interlock mechanism including a key provided on the fastener and a detector that detects a state in which the fastener is fully closed, in which in a state where the detector has detected that the fastener is fully closed, laser light having a predetermined intensity or more is introduced into the laser analysis unit.

An electromagnetic wave detector includes: a semiconductor layer in which a step is formed, the semiconductor layer having sensitivity to a detection wavelength; an insulating film disposed on the step and provided with an opening through which a part of the step is exposed; a two-dimensional material layer disposed on the insulating film and the opening, the two-dimensional material layer including a connection region electrically connected to the semiconductor layer in the opening; a first electrode disposed on the insulating film and electrically connected to the two-dimensional material layer; and a second electrode disposed on the semiconductor layer and electrically connected to the first electrode through the connection region of the two-dimensional material layer.

A light detector includes a substrate, a membrane disposed on a surface of the substrate, a first and a second electrode post supporting the membrane. The first electrode post includes a first main body portion having a tubular shape spreading from a first electrode pad toward a side opposite to the substrate, and a first flange portion provided in an end portion at the side opposite to the substrate in the first main body portion. The first flange portion is provided with a first sloped surface inclined so as to approach the substrate as it goes away from the first main body portion. A first wiring layer reaches an inner surface of the first main body portion through the first sloped surface. The second electrode post and the second wiring layer are formed similarly to the first electrode post and the first wiring layer.