A method of detecting the presence of a product sprayed onto an application surface, in which the product to be applied to the application surface is sprayed onto a target zone of the application surface in pulses. Before spraying the product it is heated to a temperature higher than a predetermined temperature value. After spraying the product, a value of a parameter representing the temperature of the target zone is measured remotely, and the value of that parameter is compared to a reference value of that parameter. A detection installation including pulsed spraying by way of forming part of a device shared with the heating element.

Methods, apparatus, systems, and articles of manufacture are disclosed to autonomously detect thermal anomalies. Disclosed examples include an example apparatus to detect engine anomalies comprising: at least one memory; instructions in the apparatus; and processor circuitry to execute the instructions to: control a plurality of infrared cameras to capture a baseline image set, the baseline image set including at least two thermal images; generate emissivity data based on the baseline image set; provide the baseline image set and the emissivity data to an artificial intelligence model, the artificial intelligence model to generate a reconstructed image set; determine a difference between the baseline image set and the reconstructed image set; and in response to the difference exceeding a threshold, generate an alert indicating detection of an engine anomaly.

A vehicle lamp includes a light emitting source, a support substrate configured to support the light emitting source, a heat sink configured to support the support substrate and dissipate heat from the light emitting source, and a light controller configured to control light from the light emitting source. The heat sink includes an opening configured to measure the radiant heat of the support substrate.

Provided is a vanadium oxide film which shows substantially no hysteresis of resistivity changes due to temperature rising/falling, has a low resistivity at room temperature, has a large absolute value of the temperature coefficient of resistance, and shows semiconductor-like resistance changes in a wide temperature range. In the vanadium oxide film, a portion of the vanadium has been replaced by aluminum and copper, and the amount of substance of aluminum is 10 mol % based on the sum total of the amount of substance of vanadium, the amount of substance of aluminum, and the amount of substance of copper. This vanadium oxide film has a low resistivity, has a large absolute value of the temperature coefficient of resistance, and shows substantially no hysteresis of resistivity changes due to temperature rising/falling. This vanadium oxide film is produced by applying a mixture solution containing a vanadium organic compound, an aluminum organic compound, and a copper organic compound to a substrate, calcining the substrate at a temperature lower than the temperature at which the substrate decomposes, and irradiating the surface of the substrate onto which the mixture solution has been applied with ultraviolet light.

In a method for noncontact, radiation thermometric temperature measurement, a short-circuit photocurrent that is proportional to a received radiant power is produced in a photodiode radiation detector that is operating photovoltaically without bias voltage. The photocurrent is processed in a current to voltage converter. Subsequently, a temperature signal corresponding to the radiant power is generated. A corrective current, dependent on a temperature of the photodiode radiation detector, is added to the short-circuit photocurrent to compensate a fault current, wherein the fault current is based on an input bias current and an input offset voltage of the current to voltage converter across a temperature-dependent shunt resistance of the photodiode radiation detector. A device with a corrective current source controlled by a microcontroller is provided that can be used to perform the method.

An apparatus and a method for determining the temperature of a substrate, in particular of a semiconductor substrate during the heating thereof by means of at least one first radiation source are disclosed. A determination of the temperature is based on detecting first and second radiations, each comprising radiation emitted by the substrate due to its own temperature and radiation emitted by the first radiation, which is reflected at the substrate and at least one of a drive power of the first radiation source and the radiation intensity of the first radiation source.

A system and a method capable of identifying a heat source position corresponding to a failure portion are provided. An analysis system according to the present invention is an analysis system that identifies a heat source position inside a semiconductor device, and includes a tester that applies an AC signal to the semiconductor device, an infrared camera that detects light from the semiconductor device according to the AC signal and outputs a detection signal, and a data analysis unit that identifies the heat source position based on the detection signal.

A cooking temperature sensor having a controller including a thermal imaging camera which identifies at least one food item in a cooking environment. A display is in communication with the controller and the controller transmits data representative of the at least one food item for display. A selection is received in connection with the data and associates a temperature with the at least one food item. The controller monitors a thermal value of the at least one food item and generates an alert indicative of when the temperature is reached for the at least one food item.

The present invention includes a temperature probe and use thereof. The temperature probe is configured to obtain a temperature of a blow molding preform, especially a temperature of an inside surface of the blow molding preform. In this manner, effectiveness of heating the preform can be evaluated, the presence of one or more temperature gradients ascertained, and the blow molding process can be optimized for a given preform.

Methods and systems for converting an image contrast evolution of an object to a temperature contrast evolution and vice versa are disclosed, including methods for assessing an emissivity of the object; calculating an afterglow heat flux evolution; calculating a measurement region of interest temperature change; calculating a reference region of interest temperature change; calculating a reflection temperature change; calculating the image contrast evolution or the temperature contrast evolution; and converting the image contrast evolution to the temperature contrast evolution or vice versa, respectively.