Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

A method of measuring temperature of a part heated during a heating process includes applying a non-reactive coating at a first temperature; heating the part, and thereby the coating thereon, to a second temperature greater than the first temperature; and measuring a temperature distribution of the part by measuring infrared light emitted from the heated coating using a thermal imaging device calibrated to the known emissivity of the coating. The coating is at least partially opaque and having a known emissivity of infrared light and conducts thermal energy from the underlying part.

Embodiments include systems and methods for heating materials, including heating materials for cooking and soldering. A representative system and method for cooking food includes passing electric current through the food, sensing a characteristic of the food, and modulating the electric current in response to the characteristic of the food to achieve a selected internal temperature of the food. The system and method can include searing the food with hot oil or photons directed at the surface of the food. A representative system and method for heating a material includes modulating a plurality of semiconductor light sources to emit photons toward the material, measuring a temperature of the material, and modulating the plurality of semiconductor light sources in response to the temperature of the material. The material can include solder and the method can include heating solder in a reflow soldering process.

A scale composition determination device (10) determines that Fe.sub.2O.sub.3 has been generated in the outermost layer of a scale (SC) in the case where the absolute value of a difference between temperatures of a steel material SM measured by radiation thermometers (20a, 20b) is equal to or more than a predetermined temperature, and determines that Fe.sub.2O.sub.3 has not been generated in the outermost layer of the scale (SC) in the case where the absolute value of the difference between the temperatures of the steel material SM measured by the radiation thermometers (20a, 20b) is not equal to or more than the predetermined temperature.

A method including obtaining calibration data for at least one sub-component in a heat transfer assembly, wherein the calibration data comprises at least one indication of coolant flow rate through the sub-component for a given surface temperature delta of the sub-component and a given heat load into said sub-component, determining a measured heat load into the sub-component, determining a measured surface temperature delta of the sub-component, and determining a coolant flow distribution in a first flow path comprising the sub-component from the calibration data according to the measured heat load and the measured surface temperature delta of the sub-component.

The present invention pertains to a device for measuring a temperature distribution, which can measure a temperature distribution without contacting a minor sample having a three-dimensional structure. More particularly, the device for measuring the temperature distribution can measure a three-dimensional temperature distribution for a sample, wherein the temperature distribution in a depth direction (direction z) of the sample is measured by a thermo-reflectance technique using a chromatic dispersion lens, a diffraction spectrometer and an optical detection array; and the temperature distribution in parallel directions (direction x-y axes) of the sample is measured by the thermo-reflectance technique using a biaxial scanning mirror.

A stress properties measurement method for measuring properties of stresses generated in a structure includes acquiring, from a first imaging device, a plurality of thermal images corresponding to temperatures of a surface of the structure, the plurality of thermal images being different in imaging time from each other, generating a stress distribution image corresponding to each of the plurality of thermal images, acquiring a stress value of a first section that is smaller in stress gradient than a predetermined value and respective stress values of a plurality of second sections where stresses are concentrated for the stress distribution images, and deriving correlation properties of stresses at a section of the structure based on the stress value of the first section acquired and the respective stress values of the plurality of second sections acquired.

An additive manufacturing system includes a work region having a layer of metallic powder distributed across at least a portion of the work region. The system further includes a power source, a scanning and focusing system and a processor. The processor is configured to control the power source to emit a beam of energy at a power level and to manipulate the beam of energy across the work region in a plurality of build tracks to form a part from the fused metallic powder. The processor further determines a cooling rate at a termination of each of the plurality of build tracks and controls the power level of the power source in response to the determined cooling rate.

A technique for automated temperature monitoring relies on subject recognition in combination with contactless measurement of subject temperature at one or more measurement stations, with corresponding use of trend analysis. A multiplicity of advantages flow from the use of subject recognition and corresponding trend analysis, including more reliable detection of anomalous temperatures relative to trendlines determined for individual recognized subjects, with possible compensation for group trends, local environmental factors, variability in measuring equipment, etc.

The present disclosure generally relates to systems comprising devices for effecting epitachophoresis and sample detection and methods of using such systems. Epitachophoresis may be used to effect sample analysis, such as by selective separation, detection, extraction, and/or pre-concentration of target analytes such as, for example, DNA, RNA, and/or other biological molecules. Sample detection may be used to trigger automated target analyte collection. Said target analytes may be used for desired downstream applications and further analysis.