Patent classifications
G01J5/0003
METHOD AND DEVICE FOR CONTACTLESS MEASUREMENT OF A TEMPERATURE
A method and device for contactless measurement of a temperature, in particular pyrometer, preferably 1-point pyrometer. The measuring device (1) has a camera (4) for recording an image (7′) of an environment (7) of a measurement spot (9) and a processor for ascertaining and outputting, in particular displaying, a location of the measurement spot in the image. For the temperature measurement, an environment (7) of a measurement spot (9) is recorded as an image and a location of the measurement spot (9) in the environment (7) is calculated and output in the image (7′).
Circuit breaker opening/closing assistance apparatus
The present disclosure relates to a circuit breaker opening/closing assistance apparatus for correcting a thermal image of a circuit breaker on the basis of a visible image of the circuit breaker, and assisting an opening/closing operation of the relevant circuit breaker on the basis of a temperature identified through the corrected thermal image. Further, the present disclosure relates to a circuit breaker opening/closing assistance apparatus for identifying a temperature of a circuit breaker in which a failure has occurred, on the basis of a thermal image of the circuit breaker, and assisting an opening/closing operation of the relevant circuit breaker on the basis of the identified temperature.
SURFACE TEMPERATURE MEASURING METHOD, SURFACE TEMPERATURE MEASURING APPARATUS, HOT-DIP ZINC PLATED STEEL SHEET MANUFACTURING METHOD, AND HOT-DIP ZINC PLATED STEEL SHEET MANUFACTURING EQUIPMENT
A surface temperature measuring method includes: acquiring a radiation light amount of a surface of a measurement object; irradiating the surface of the measurement object with light under a specular reflection condition to acquire a specular reflection light amount; irradiating the surface of the measurement object with light under a diffuse reflection condition to acquire a diffuse reflection light amount; calculating an emissivity of the surface of the measurement object by using a model indicating a relationship between an emissivity and a specular reflectance, and a relationship between the emissivity and a diffuse reflectance of the surface of the measurement object, the acquired specular reflection light amount, and the acquired diffuse reflection light amount; and calculating a surface temperature of the measurement object using the acquired radiation light amount and the calculated emissivity.
Inspection method, inspection apparatus, production method, and production system for heatsink
A method for inspecting a heatsink in which a heat dissipation layer is formed on a surface of a substrate formed by casting, includes shooting the heat dissipation layer by image pickup means in a state where residual heat transferred from the substrate to the heat dissipation layer remains and thereby acquiring image data representing a temperature distribution on a surface of the heat dissipation layer, the heat dissipation layer being formed by performing a film-forming process on the surface of the substrate where residual heat that is generated when the substrate is cast remains, the image pickup means being configured to receive an emission of light from molecules of the heat dissipation layer.
METHOD FOR MEASURING TEMPERATURE
An edge radiation thermometer performs measurements before a semiconductor wafer is transported into a chamber. The edge radiation thermometer performs the measurements while the semiconductor wafer is supported by lift pins and while the semiconductor wafer is placed on a susceptor, after the semiconductor wafer is transported into the chamber. A controller calculates a reflectivity of the semiconductor wafer based on these measurement values. Then, the controller calculates an intensity of an ambient light receive by the edge radiation thermometer, based on the reflectivity and an intensity of synchrotron radiation radiated from a quartz window. Subsequently, the controller subtracts the intensity of the ambient light from an intensity of light received by of the edge radiation thermometer during heat treatment on the semiconductor wafer to calculate the temperature of the semiconductor wafer.
Monitoring system
A monitoring system is disclosed. The monitoring system comprises: a nozzle steam trap (3) including a supply portion (10) into which water vapor is supplied, and a discharge portion (11) which discharges liquid water contained in the water vapor; a temperature measurer (20) that measures a temperature of the discharge portion; a transmitter (24) that transmits temperature information containing the temperature measured by the temperature measurer; a receiver (7) that receives the temperature information; a determiner (8) that determines whether an abnormality is present in the nozzle steam trap based on the temperature information; and a notifier (9) that issues a notice when the determiner determines that the abnormality is present. A first discharge-side reference temperature lower than the boiling point of the water and a second discharge-side reference temperature higher than the boiling point of the water are set for the discharge portion. The determiner determines that the abnormality is present when the temperature of the discharge portion contained in the temperature information is lower than the first discharge-side reference temperature or higher than the second discharge-side reference temperature.
Device and method for process control for surfaces with a low, unknown, and/or variable emissivity
Devices and corresponding methods can be provided to monitor or measure temperature of a target or to control a process. Targets can have low, unknown, or variable emissivity. Devices and corresponding methods can be used to measure temperatures of thin film, partially transparent, or opaque targets, as well as targets not filling a sensor's field of view. Temperature measurements can be made independent of emissivity of a target surface by, for example, inserting a target between a thermopile sensor and a background surface maintained at substantially the same temperature as the thermopile sensor. In embodiment devices and methods, a sensor temperature can be controlled to match a target temperature by minimizing or zeroing a net heat flux at the sensor, as derived from a sensor output signal. Alternatively, a target temperature can be controlled to minimize the heat flux.
METHOD FOR CHARACTERIZATION OF TEMPERATURE IN WELD ZONE OF FRICTION STIR WELDING BASED ON INFRARED THERMAL IMAGER
The present invention belongs to the field of friction stir welding (FSW) temperature detection, and relates to a temperature characterization method of FSW weld zone based on infrared thermal imager. The invention combines theory with experiment. A temperature field simulation model of FSW is established based on DEFORM. The data sets of temperature of surface feature points, the maximum and minimum temperatures in weld zone are obtained according to the simulation model result. Then, Support Vector Regression (SVR) is used to establish a temperature characterization model, which represents the correlation between the temperature of surface feature points and the maximum and minimum temperatures in weld zone. In the actual welding process, an infrared camera is used to measure the temperature of the surface feature point in real-time. Combined with the built temperature characterization model, the characterization of the maximum and minimum temperatures in weld zone is achieved.
MEASUREMENT OF COATING THERMAL PROPERTIES BY INDUCTION RADIOMETRY
A system and method for determining the condition of a thermal barrier coating on a base metal component, comprising the use of an induction coil to input into the metallic base layer through the coating layer, a temporally varying heat waveform, and measuring the temperature of the coating surface layer resulting from the input of the heat waveform using a temperature sensor disposed close to the surface of the coating layer. A controller correlates a signal from the temporally varying output of the temperature sensor with a signal corresponding to the temporally varying heat waveform, to determine the phase angle between the signals. The controller uses a mathematical relationship between the phase angle and the frequency of the heat waveform to determine the thermal properties of the non-metallic coating. Both the thermal diffusivity and the barrier coating thickness can be accurately obtained by this method and apparatus.
WORK MEASUREMENT SYSTEM, EDUCATION SYSTEM, AND QUALITY CONTROL SYSTEM
A burner work measurement system configured to measure work using a burner is provided. The burner work measurement system includes one or more cameras configured to capture the work and a control unit configured to perform computing processing on images captured by the cameras, the control unit is configured to create work data obtained by calculating, based on the images captured by the cameras, at least one of a positional relation between a work object and the burner or flame, a positional relation between the work object and a brazing filler metal, and a positional relation between the burner or the flame and the brazing filler metal.