G01J5/0003

OFFSET PRINT APPARATUS AND METHODS

Offset print apparatus comprises: a blanket to receive print agent; a non-contact temperature sensor to monitor electromagnetic radiation from a measurement location of the blanket and generate a respective output; and a controller to: receive the output from the non-contact temperature sensor; determine coverage information relating to a print agent coverage of the blanket at the measurement location; and calculate a temperature of the blanket at the measurement location taking into account both the output from the non-contact temperature sensor and the determined coverage information.

Top hood and a measurement system
11382186 · 2022-07-05 · ·

A top hood for covering food in a microwave oven is provided. The top hood (H1) includes a microwave transparent wall structure including a side wall (SW) and top part (TP). The side wall (SW) and top part (TP) define the internal area (IA) covered by the top hood (H1). Attached to the wall structure of the top hood (H1), the top hood (H1) includes a temperature sensor (TS) for measuring the temperature within the internal area (IA) covered by the top hood (H1). The top hood further includes a wireless transmitter (WT) for transmitting the measured temperature information to an external display unit (DU).

Device and method for measuring film longitudinal temperature field during nitride epitaxial growth

The present invention designs a measurement scheme for the longitudinal temperature of the film during nitride epitaxial growth, belongs to the field of semiconductor measurement technology. Epitaxial growth technology is one of the most effective methods for preparing nitride materials. The temperature during the growth process restricts the performance of the device. The non-contact temperature measurement method is generally used to measure the temperature of the graphite disk as the base, which can't obtain the longitudinal temperature. The present invention respectively measures the surface temperature of the epitaxial layer and the temperature of the graphite disk by ultraviolet and infrared radiation temperature measurement technologies, and then uses the finite element simulation method to perform thermal field analysis from the bottom surface of the substrate to the surface of the epitaxial layer, so that the longitudinal temperature is obtained, thereby providing a favorable basis for temperature regulation during nitride growth.

Phosphor Thermometry Imaging System and Control System

The following provides a system and method for 2-D thermal imaging of phosphor coated surfaces. The system and method enable increased temperature measurement accuracy and speed of data analysis by implementing a control system that controls simultaneously an illumination system and an image capture device including a high speed camera. More particularly, the control system can control the illumination system and the camera to acquire images when emitted light intensity ranges are in a desired range to improve temperature measurement accuracy, and to increase the speed of data processing.

Thermal image sensing system and thermal image sensing method

A thermal image sensing system including at least one thermal sensor, at least one light sensor, an image identification module, a storage module and a computing module is provided. The thermal sensor senses thermal radiation emitted by an object and generates a thermal radiation image signal correspondingly. The light sensor senses visible light reflected by the object and generates at least one visible light image signal correspondingly. The image identification module receives the visible light image signal generated by the light sensor and determines a material of the object according to the at least one visible light image signal. The storage module stores a radiation coefficient of the material of the object. The computing module calculates a surface temperature of the object according to the radiation coefficient of the material of the object and the thermal radiation emitted by the object. A thermal image sensing method is also provided.

Infrared thermal run-away detection for battery packs
11309596 · 2022-04-19 · ·

Systems and methods for identifying thermal run-away events in a battery pack can include using infrared sensors to measure infrared radiation emitted by and reflected by subsets of the battery cells arrayed in a battery pack. Each infrared sensor can generate temperature data based on the received infrared radiation, which includes reflected infrared radiation for several and potentially many individual battery cells aligned in rows or columns within the battery pack. Each infrared sensor can sense the beginning of a thermal run-away event by sensing when an individual battery cell in the array has a temperature exceeding a threshold, and can generate a signal indicative of a thermal run-away event based on the detected excessive temperature.

MEASUREMENT OF BODY TEMPERATURE OF A SUBJECT
20220067921 · 2022-03-03 · ·

There is provided a computer implemented method of measuring a temperature of a subject, comprising: receiving a sequence of a plurality of thermal images of a subject captured by a thermal sensor, analyzing the sequence of the plurality of thermal images to identify at least one target thermal image depicting an upper region of a tongue of the subject, analyzing the at least one target thermal image to identify an estimated temperature of the upper region of the tongue, and providing the estimated temperature of the upper region of the tongue.

EMISSIVITY INDEPENDENCE TUNING
20230392987 · 2023-12-07 ·

Embodiments disclosed herein include a method of calibrating a processing tool. In an embodiment, the method comprises providing a first substrate with a first emissivity, a second substrate with a second emissivity, and a third substrate with a third emissivity. In an embodiment, the process may include running a recipe on each of the first substrate, the second substrate, and the third substrate, where the recipe includes a set of calibration attributes. In an embodiment, the method may further comprise measuring a layer thickness on each of the first substrate, the second substrate, and the third substrate. In an embodiment, the method further comprises determining if the layer thicknesses are uniform.

Thermal imaging with an integrated photonics chip

An integrated photonics chip for thermal imaging comprises a photonics substrate including a plurality of receiver elements. Each receiver element comprises a first grating coupler optically coupled to a first waveguide filter and configured to receive a first wavelength of light at a given angle, with the first waveguide filter configured to pass the first wavelength of light; and a second grating coupler optically coupled to a second waveguide filter and configured to receive a second wavelength of light at the given angle, with second waveguide filter configured to pass the second wavelength of light. Each receiver element receives the wavelengths of light from an object of interest that emits the light due to blackbody radiation, and receives the wavelengths of light at respectively different angles. Each grating coupler receives a unique wavelength of light with respect to the other wavelengths of light received by the other grating couplers.

Heat detection system
11150040 · 2021-10-19 ·

One embodiment provides a heat conveyance system, including: a top plate having a length dimension, a width dimension, and a depth dimension, wherein the length dimension is greater than the width dimension; at least two side plates, wherein each of the two side plates is mechanically coupled to a bottom face of the top plate in a lengthwise direction and wherein, when mechanically coupled, the at least two side plates are in a perpendicular direction with respect to the top plate and have a space between the at least two side plates; and at least three sealing pieces located between and mechanically coupled to two adjacent side plates.