In a method of determining a critical temperature of a semiconductor package, heat is applied to at least one semiconductor package. Temperatures of the semiconductor package are measured during the heating. Heights of the semiconductor package are also measured during the heating. A temperature of the semiconductor package measured at a point at which a height from among the measured heights of the semiconductor package is sharply increased so that swelling of the semiconductor package occurs is determined as the critical temperature of the semiconductor package. Thus, the critical temperature of the semiconductor package may be accurately determined.

A switchboard monitoring system, according to one embodiment of the present specification, comprises: a thermal imaging apparatus for acquiring thermal imaging information of a device disposed in a switchboard panel; and a control apparatus for receiving the thermal imaging information from the thermal imaging apparatus, generating temperature information of the device on the basis of the received thermal imaging information, and detecting the temperature state of the device on the basis of the generated temperature information.

An optically-monitored and/or optically-controlled electronic device is described. The device includes at least one of a semiconductor transistor or a semiconductor diode. An optical detector is configured to detect light emitted by the at least one of the semiconductor transistor or the semiconductor diode during operation. A signal processor is configured to communicate with the optical detector to receive information regarding the light detected. The signal processor is further configured to provide information concerning at least one of an electrical current flowing in, a temperature of, or a condition of the at least one of the semiconductor transistor or the semiconductor diode during operation.

A thermal detection system is provided. The thermal detection system includes a thermal detector, an area indicating unit and a control unit. The thermal detector includes a thermal sensor array. The thermal detector is configured to detect thermal radiation within a detection area around the thermal detector. The detection area is defined by a field of view of the thermal sensor array. The area indicating unit is arranged to indicate a human-perceptible area according to the detection area. The human-perceptible area is located within the detection area and indicates a geometric form of the detection area. The control unit, coupled to the thermal detector and the area indicating unit, is configured to generate a thermal detection result according to the detected thermal radiation. The thermal detection system further includes a notification unit for overheat indication, a communication unit for wireless signal transmission, and a protection unit for overheat protection.

A method and apparatus for monitoring a battery pack of an electric vehicle includes positioning at least a portion of a monitoring apparatus under the electric vehicle. The monitoring apparatus has a camera, such as a thermal imaging camera, and a display that is adapted to display information relative to images, such a thermal images, captured by the camera in real-time via a communication link. The monitoring apparatus has and an elongated arm that is adapted to position the camera under the battery pack. The display is monitored external the vehicle while the user can manipulate the arm to position the camera subjacent the battery pack.

A Real-Time Fault Detection and Infrared Inspection System includes both a fixed imaging system and a mobile imaging system that includes a visual imaging device paired with an infrared imaging device which together can provide both visual and heat-detecting monitoring of anything within its field of view. The fixed imaging system is mounted to the top of a transmission tower and directed to view the transmission lines leading to and from the tower, while the mobile imaging system will allow for a supervision of a power generation or power distribution center. In both cases that imaging system will enable an operator to remotely access the imaging devices to visually inspect and to infrared inspect the system, checking for physical damage as well as excessive heat areas.

The present invention relates to an externally mounted calibration device and a temperature measurement system using the same. The temperature measurement system calibrates the temperature of the thermal camera using an externally mounted temperature calibration device that is mounted on one side of the outside of the thermal camera unit and includes a temperature measurement substrate with a temperature sensor. The temperature measurement substrate of the externally mounted temperature calibration device is captured simultaneously with the subject to be measured on the screen of the thermal camera, and using the temperature of the temperature measurement substrate measured by the temperature sensor and the temperature of the temperature measurement substrate measured by the thermal camera, the temperature of the subject to be measured by the thermal camera is calibrated, thereby ensuring that the thermal camera always maintains a constant temperature measurement result regardless of the environmental temperature when used.

A thermal camera system configured for Red-Green-Blue (RGB) to thermal image mapping and calibration of a thermal camera. The system may comprise a plurality of thermal cameras connected in a daisy-chain formation, and a computing device communicatively coupled to the base thermal camera. The computing device configured to accept a distorted RGB image, convert it into an array image, undistort the array image into an undistorted RGB image through use of a barrel transformation, map each corner element of the plurality of corner elements to a predefined coordinate to generate a thermal angular mapping, and map the thermal angular mapping to a distorted thermal image by a 2nd-degree parabola mapping process.

A live detection system, a thermal infrared (IR) imager and a method for power grid equipment are provided. The system includes an environmental parameter module for acquiring environmental temperature, humidity and wind speed data; a ranging module for measuring a linear distance to the power grid equipment; an equipment type recognition module for acquiring an image of the power grid equipment, and recognizing a type of the power grid equipment; an equipment material determination module for determining a material type of the power grid equipment; an emissivity setting module for setting an emissivity; an temperature measurement module for obtaining a temperature of the power grid equipment by focusing on positions of the power grid equipment which need temperature measurement; and a report generation module for selecting a corresponding diagnostic model, displaying a temperature measurement position and a temperature value, drawing a conclusion, and generating a report.

Systems and methods for monitoring one or more target components of an electrical supply system are disclosed. A metering system includes one or more infrared sensors positioned to detect an amount of thermal energy emitted from the one or more target components of the electrical supply system. The one or more infrared sensors transmit temperature data representative of the amount of thermal energy. The metering system also includes one or more processors and one or more non-transitory memory modules communicatively coupled to the one or more processors and the one or more infrared sensors. The one or more processors store machine-readable instructions that, when executed, cause the one or more processors to receive the temperature data generated by the one or more infrared sensors and control the one or more infrared sensors based on the temperature data.