A thermal image sensing system including at least one thermal sensor, at least one light sensor, an image identification module, a storage module and a computing module is provided. The thermal sensor senses thermal radiation emitted by an object and generates a thermal radiation image signal correspondingly. The light sensor senses visible light reflected by the object and generates at least one visible light image signal correspondingly. The image identification module receives the visible light image signal generated by the light sensor and determines a material of the object according to the at least one visible light image signal. The storage module stores a radiation coefficient of the material of the object. The computing module calculates a surface temperature of the object according to the radiation coefficient of the material of the object and the thermal radiation emitted by the object. A thermal image sensing method is also provided.

An infra-red imaging device comprising: a cryostat (4), an infra-red detector (6) arranged inside the cryostat (4) to receive an optical signal coming from outside the imaging device, a linear polarizer configured to polarize the optical signal along a variable direction of polarization, before the optical signal reaches the infra-red detector (6), the linear polarizer comprising: a first polarizing element (22) arranged outside the cryostat (4) and movable in rotation with respect to the cryostat (4), and a second polarizing element (24) arranged inside the cryostat (4) between the first polarizing element (22) and the infra-red detector (6) and fixed with respect to the cryostat (4).

An infra-red imaging device comprising: a cryostat (4), an infra-red detector (6) arranged inside the cryostat (4) to receive an optical signal coming from outside the imaging device, a linear polarizer configured to polarize the optical signal along a variable direction of polarization, before the optical signal reaches the infra-red detector (6), the linear polarizer comprising: a first polarizing element (22) arranged outside the cryostat (4) and movable in rotation with respect to the cryostat (4), and a second polarizing element (24) arranged inside the cryostat (4) between the first polarizing element (22) and the infra-red detector (6)and fixed with respect to the cryostat (4).

A method of thermographic inspection is disclosed, including applying a thermal pulse to a surface and capturing an image of a thermal response of the surface. The image is captured with an infrared camera through a polarizer having a first orientation. The method further includes determining, by analysis of the image, whether the thermal response is indicative of a crack on the surface.

A two-wavelength, single-camera imaging thermography system for in-situ temperature measurement of a target, comprising: a target light path inlet conduit for receiving a target light beam reflected from the target; a beam splitter installed in a splitter housing at a distal end of the target light path conduit, wherein the beam splitter divides the target light beam into a first light beam and a second light beam; a first light path conduit emanating from the splitter housing comprising a first aperture iris installed within the first light path conduit for aligning the first light beam; a first band pass filter installed within the first light path conduit for regulating the first light beam to a first wavelength 1 and an optional half waveplate installed within the first light path conduit to modulate a polarization ratio of the first light beam of 1 wavelength; a second light path conduit emanating from the splitter housing comprising a second aperture iris installed within the second light path conduit for aligning the second light beam; a second band pass filter installed within the second light path conduit for regulating the second light beam to a second wavelength 2; a junction housing, wherein distal ends of each of the first and second light path conduits are connected to the junction housing; a polarizing beam splitter installed in the junction housing, wherein the polarizing beam splitter reflects the first light beam of 1 wavelength along the same path or a parallel path of the second light beam of 2 wavelength that passes directly through the polarizing beam splitter unreflected to create a merged light beam comprising light of 1 and 2 wavelengths; and a light path outlet conduit connected to the junction for directing the merged beam to a high-speed camera for imaging.

Generating an accurate and sensitive temperature map over a non-planar surface by capturing a polarimetric thermal image from a non-planar surface. The non-planar surface includes a surface element which emits thermal electromagnetic emission responsive to a temperature of the surface element. Thermal electromagnetic emission is directed to an image element of an image sensor. A polarisation state and intensity are measured of the ray of thermal electromagnetic emission from the surface element. Responsive to the polarization state and the intensity, an angular orientation of the surface element is determined. A temperature of the surface element is determined by estimating the thermal emission normal to the surface element responsive to the angular orientation of the surface element and the intensity of the ray of thermal electromagnetic emission emitting from the surface element.

Kirigami-based optic devices are provided that include a tunable kirigami-based component comprising a plurality of bridge structures and a plurality of openings therebetween to form a grating structure. At least one surface of the kirigami-based component is micropatterned with a plasmonic material so that the grating is configured to induce or modulate rotational polarity of a beam of electromagnetic radiation as it passes through the plurality of openings. In certain aspects, the micropattern may be a gold herringbone pattern. The kirigami-based component has tunable 3D topography, which when stretched, exhibits polarization rotation angles as high as 80 and ellipticity angles as high as 34 due to the topological equivalency of helix. The kirigami-based components are compact electromagnetic modulators and can be used in THz circular dichroism (TCD) spectroscopy, for example, in a stacked configuration as a modulator, as an encryptor/decryptor for secure communication, in biomedical imaging, and LIDAR systems.

The invention relates to an optical detector (110) for an optical detection, in particular, of radiation within the infrared spectral range, specifically, with regard to sensing at least one optically conceivable property of an object (112). More particular, the optical detector (110) may be used for determining transmissivity, absorption, emission, reflectance, and/or a position of at least one object (112). Further, the invention relates to a method for manufacturing the optical detector (110) and to various uses of the optical detector (110). The optical detector (110) comprises an optical filter (114) having at least a first surface (116) and a second surface (118), the second surface (118) being located oppositely with respect to the first surface (116), wherein the optical filter (114) is designed for allowing an incident light beam (120) received by the first surface (116) to pass through the optical filter (114) to the second surface (118), thereby generating a modified light beam (122) by modifying a spectral composition of the incident light beam (120); a sensor layer (128) comprising a photosensitive material (130) being deposited on the second surface (118) of the optical filter (114), wherein the sensor layer (128) is designed to generate at least one sensor signal in a manner dependent on an illumination of the sensor layer (128) by the modified light beam (122); and an evaluation device (140) designed to generate at least one item of information provided by the incident light beam (120) by evaluating the sensor signal. The optical detector (110) constitutes an improved simple, cost-efficient and, still, reliable detector for detecting optical radiation, especially within the infrared spectral range, specifically with regard to sensing at least one of transmissivity, absorption, emission and reflectance. Hereby, the optical detector (110) is capable of effectively removing stray light as far as possible.

Self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers. The wafer carrier system may include a housing configured for transport within the automated material handling system. A support is configured to support a semiconductor wafer within a housing. A metrology system is disposed within the housing. The metrology system is operable to measure at least one characteristic of the wafer. The metrology system may include a sensing unit and a computing unit operably connected to the sensing unit.

The present invention separates radiation from an object by a polarization filter 3 into polarized light beams, causes one of the beams to enter a spectrum analyzer 7 through a first optical path, causes the other to enter the spectrum analyzer 7 through a second optical path, and measures the two-color ratio, while causes radiation of a blackbody 2 placed in a vacuum ultralow temperature thermostatic chamber 1 in a quasi-thermal equilibrium state at an ultralow temperature in vacuo to enter the polarization filter 3 through a third optical path, separates the radiation into polarized light beams, causes the beams to each enter the same optical paths as the respective optical paths for the radiation of the object, causes the beams to enter the spectrum analyzer 7, measures the two-color ratio, and accurately obtains the temperature of the object on the basis of these two two-color ratios.