A method for processing a raw image characterized by raw measurements S.sub.p(i,j) that are associated with active bolometers B.sub.pix_(i,j) of an imager, which bolometers are arranged in a matrix array, the imager being at an ambient temperature T.sub.amb and furthermore comprising blind bolometers B.sub.b_(k), the method, which is executed by a computer that is provided with a memory, comprising the following steps: a) a step of calculating the electrical resistances R.sub.Tc(i,j) and R.sub.Tc(k), at the temperature T.sub.amb, of the active and blind bolometers, respectively, from their respective electrical resistances R.sub.Tr(i,j) and R.sub.Tr(k) at a reference temperature T.sub.r, said resistances being stored in the memory; b) a step of determining the temperatures T.sub.sc(i,j) actually measured by each of the active bolometers B.sub.pix_(i,j) from the electrical resistances calculated in step a) and from the raw measurements S.sub.p(i,j).

In a method for noncontact, radiation thermometric temperature measurement, a short-circuit photocurrent that is proportional to a received radiant power is produced in a photodiode radiation detector that is operating photovoltaically without bias voltage. The photocurrent is processed in a current to voltage converter. Subsequently, a temperature signal corresponding to the radiant power is generated. A corrective current, dependent on a temperature of the photodiode radiation detector, is added to the short-circuit photocurrent to compensate a fault current, wherein the fault current is based on an input bias current and an input offset voltage of the current to voltage converter across a temperature-dependent shunt resistance of the photodiode radiation detector. A device with a corrective current source controlled by a microcontroller is provided that can be used to perform the method.

An apparatus for monitoring a switchgear includes: an input unit; a processing unit; and an output unit. The input unit is provides the processing unit with a monitor infra-red image of the switchgear. The processing unit implements a machine learning classifier algorithm to analyse the monitor infra-red image and determine if there is one or more anomalous hot spots in the switchgear. The machine learning classifier algorithm has been trained based on a plurality of different training infra-red images. The plurality of training infra-red images include a plurality of modified infra-red images generated from a corresponding plurality of infra-red images, each of the modified infra-red images having been modified to remove an effect of obscuration in the image. The output unit outputs information relating to the one or more anomalous hot spots.

A method for optically determining the temperature of a molten metal with a measuring device, including calibrating a replacement measuring chain by a measuring chain as a system-internal measuring standard. The measuring device includes an optical waveguide, to guide electromagnetic radiation emitted from the metal or from the tip of the optical waveguide to an optical detector, at least one replacement optical waveguide, an optical detector for determining the temperature of the metal from an analysis of the electromagnetic radiation, a measuring chain, in which the optical waveguide is the measurement recorder, and at least one replacement measuring chain, in which a replacement optical waveguide is the measurement recorder. A reeling device includes a conveying device for successive reeling of the optical waveguide from a stock and of the replacement optical waveguide from a replacement stock, a receiving device for a stock and at least one replacement stock.

FPAs on a wafer can be tested prior to dicing the wafer into individual dies. A focal plane array (FPA) can comprise an array of photodetectors, such as microbolometers, on a semiconductor substrate or die. FPAs can be manufactured on a wafer to make multiple FPAs on a single wafer that can be later diced or divided into individual FPAs. Prior to dicing the wafer, the FPAs can be tested electrically and radiometrically in bulk to characterize individual FPAs, to identify bad pixels, to identify bad chips, to calibrate individual FPAs, and the like. These test results can be used to determine acceptable FPAs and can be used to provide initial settings for imaging systems with the tested and integrated FPA.

The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

An example system includes a thermal camera, a memory, and processing circuitry coupled to the thermal camera and the memory. The processing circuitry is configured to acquire a core temperature of a patient and acquire a first thermal image associated with the patient. The processing circuitry is configured to determine, based on the first thermal image, a first sensed temperature of a location associated with the patient. The processing circuitry is configured to determine a core temperature delta between the core temperature and the first sensed temperature. The processing circuitry is configured to acquire a second thermal image associated with the patient. The processing circuitry is configured to determine, based on the second thermal image, a second sensed temperature. The processing circuitry is configured to determine, based on the second sensed temperature and the core temperature delta, a measure of the core temperature.

A method for measuring furnace temperatures. The method includes obtaining radiance measurements from a plurality of regions of interest (ROIs) using a plurality of thermal imaging cameras, and measuring a surface temperature using a radiance measurement obtained from an ROI selected from the plurality of ROIs. Measuring the surface temperature includes determining an effective background radiance affecting the selected ROI using radiance measurements obtained from ROIs different from the selected ROI, obtaining a compensated radiance by removing the effective background radiance from the radiance measurement obtained from the selected ROI, and converting the compensated radiance to the measured surface temperature.

Devices, systems, and methods are provided for enhanced multispectral sensor calibration. A device may include a first layer having copper, a second layer having solder material, the second layer above the first layer, and a third layer having a white silkscreen material, the third layer above the second layer. Regarding the device, the first layer may be used for calibration of a thermal sensor, the second layer may be used for calibration of an image sensor and calibration of a light detection and ranging (LIDAR) sensor, and the third layer may be used for the calibration of the image sensor and the calibration of the LIDAR sensor.

The embodiments described herein generally relate to methods of noise compensation for proper temperature detection in thermal processing chambers and devices for achieving the same. Methods can include determining noise produced by a lamp zone and extrapolating the noise from the detected photocurrent. Devices can include a processing chamber, a substrate support disposed in the processing chamber, the substrate support having a high thermal mass, a pyrometer below the substrate support and oriented to view radiation emitted by the substrate and a controller configured to subtract a time invariant noise component and a time variant noise component from the pyrometer signal.