A semiconductor device includes a semiconductor substrate on which a temperature sensor is formed, a plurality of insulating films formed above the semiconductor substrate, a temperature measurement wiring pattern formed on a first insulating film which is one of the plurality of the insulating films, a detection electrode which is formed on the uppermost insulating film of the plurality of the insulating films to be arranged at a position corresponding to the first temperature measurement wiring pattern and is provided for contact a temperature measurement needle, and one or more via electrodes formed in one or more insulating film between the temperature measurement electrode and the detection electrode to couple between the temperature measurement electrode and is the detection electrode.

A semiconductor device includes a semiconductor substrate on which a temperature sensor is formed, a plurality of insulating films formed above the semiconductor substrate, a temperature measurement wiring pattern formed on a first insulating film which is one of the plurality of the insulating films, a detection electrode which is formed on the uppermost insulating film of the plurality of the insulating films to be arranged at a position corresponding to the first temperature measurement wiring pattern and is provided for contact a temperature measurement needle, and one or more via electrodes formed in one or more insulating film between the temperature measurement electrode and the detection electrode to couple between the temperature measurement electrode and is the detection electrode.

An apparatus for estimating body temperature includes a sensor including a first sensor board; an object contact surface provided below the first sensor board; a thermally conductive material provided on an upper end of the first sensor board; a second sensor board provided on an upper end of the thermally conductive material; at least one first temperature sensor provided on the first sensor board and being configured to measure a surface temperature of the object; and at least one second temperature sensor provided on the second sensor board and being configured to measure a surface temperature of the thermally conductive material; and a processor configured to: measure a heat flux based on the surface temperature of the object and the surface temperature of the thermally conductive material; and estimate core temperature based on the measured heat flux and the surface temperature of the object.

A cooktop appliance includes a top panel with a gas burner disposed on the top panel. The cooktop appliance also includes a grate with a plurality of fingers. The grate is removably positioned above the gas burner. The plurality of fingers includes a sensor finger. The cooktop appliance also includes a hermetically sealed temperature sensor mounted to the sensor finger of the plurality of fingers of the grate. The hermetically sealed temperature sensor includes a base, a sheath extending from the base to a rounded tip, and a contact pad in the base.

A cooktop appliance includes a top panel with a gas burner disposed on the top panel. The cooktop appliance also includes a grate with a plurality of fingers. The grate is removably positioned above the gas burner. The plurality of fingers includes a sensor finger. The cooktop appliance also includes a hermetically sealed temperature sensor mounted to the sensor finger of the plurality of fingers of the grate. The hermetically sealed temperature sensor includes a base, a sheath extending from the base to a rounded tip, and a contact pad in the base.

A temperature measuring device for measuring a temperature of a terminal of an electrical connector includes a printed circuit board, a temperature sensor mounted on the printed circuit board, and a thermally conductive sleeve having a first thermally conductive portion and a second thermally conductive portion. The first thermally conductive portion has a recess receiving a part of the printed circuit board. The first thermally conductive portion is in thermal contact with the temperature sensor. The second thermally conductive portion forms a flexible tab extending from the first thermally conductive portion and contacting the terminal.

An electrical connection device includes at least one contact and a carrier. The carrier includes at least one receptacle and the at least one contact inserted into the at least one receptacle. The carrier includes a printed circuit board and at least one temperature sensor arranged on the printed circuit board in a vicinity of the at least one contact. The printed circuit board includes an electrically insulating layer and an electrically conductive top layer separated from a support plate by the electrically insulating layer. The electrically conductive top layer is arranged in a region of a recess of the electrically insulated layer and includes an outer connection region and an inner contact region. The inner contact region is formed by the at least one contact through a recess of the support plate. The electrically conductive top layer rests against a lateral surface of the at least one contact.

Provided is a heat flow switching element that has a larger change in thermal conductivity, has excellent thermal responsiveness, and is capable of directly detecting a temperature change. The heat flow switching element according to the present invention includes: a heat flow control element part 10 including an N-type semiconductor layer 3, an insulator layer 4 laminated on the N-type semiconductor layer, and a P-type semiconductor layer 5 laminated on the insulator layer; and thermosensitive element parts 11A and 11B joined to the heat flow control element part. In addition, the thermosensitive element parts include: a thin-film thermistor portion made of a thermistor material; and a pair of counter electrodes formed facing each other on an upper side and/or a lower side of the thin-film thermistor portion, and the thin-film thermistor portion is laminated on an upper side and/or a lower side of the heat flow control element part.

Provided is a heat flow switching element that has a larger change in thermal conductivity, has excellent thermal responsiveness, and is capable of directly detecting a temperature change. The heat flow switching element according to the present invention includes: a heat flow control element part 10 including an N-type semiconductor layer 3, an insulator layer 4 laminated on the N-type semiconductor layer, and a P-type semiconductor layer 5 laminated on the insulator layer; and thermosensitive element parts 11A and 11B joined to the heat flow control element part. In addition, the thermosensitive element parts include: a thin-film thermistor portion made of a thermistor material; and a pair of counter electrodes formed facing each other on an upper side and/or a lower side of the thin-film thermistor portion, and the thin-film thermistor portion is laminated on an upper side and/or a lower side of the heat flow control element part.

A power module includes a housing having a carrier plate, housing walls and a housing cover. Semiconductor elements and a temperature sensor unit having a temperature sensor are disposed in the interior of the housing on the carrier plate. Partitions disposed in the interior of the housing separate the temperature sensor unit from the semiconductor elements and enclose the temperature sensor unit in a chamber.