Apparatus and methods are provided for use with a capsule that contains a smoking material containing one or more active agents. A smoking device vaporizes one or more of the active agents from within the smoking material by heating the smoking material. A control component receives an indication from a user indicating whether they wish to smoke in a first mode or a second mode. In response to receiving an indication that the user wishes to smoke in the first mode, the control component heats the smoking material to a vaporization temperature of the one or more active agents for a predefined period of time, and in response to receiving the indication that the user wishes to smoke in the second mode, the control component heats the smoking material to the vaporization temperature only while receiving an active input from the user. Other applications are also described.

Apparatus and methods are provided for use with a capsule that contains a smoking material containing one or more active agents. A smoking device vaporizes one or more of the active agents from within the smoking material by heating the smoking material. Two or more sensors, each of which is configured to detect a temperature of the capsule at the same location along a length of the capsule as each other. Other applications are also described.

Apparatus and methods are provided for use with a cylindrically-shaped capsule that contains a smoking material containing one or more active agents. A smoking device is configured to vaporize one or more of the active agents from within the smoking material by heating the smoking material. The smoking device includes a cylindrically-shaped insertion port configured to receive the cylindrically-shaped capsule that contains the smoking material, and a non-cylindrical housing configured to house at least part of a portion of the capsule that contains the smoking material, while the smoking device heats the smoking material. Other applications are also described.

A method for measuring a temperature outside a housing unit includes the steps of measuring a first temperature inside the sealed housing of the housing unit, measuring a second temperature inside the sealed housing of the housing unit, and measuring a airflow speed outside the housing of the housing unit and along the front cover of the housing. A multiple of the difference between the first temperature and the second temperature is added to the first temperature, and a multiple of the product of airflow speed v.sub.A and the difference between the first temperature and the second temperature is further added.

Systems and methods for individual phase temperature monitoring and balance control in a multi-phase voltage regulator may include a plurality of smart power stages including a first smart power stage and a second smart power stage and a voltage regulator controller. The voltage regulator controller may send a first control signal to the first smart power stage to enable the first smart power stage to send a first temperature of the first smart power stage to the voltage regulator controller during a first phase of a switching cycle. The voltage regulator controller may also determine that the first temperature received by the voltage regulator controller corresponds to the first smart power stage based on the first control signal. The voltage regulator controller may further send a second control signal to the second smart power stage to enable the second smart power stage to send a second temperature to the voltage regulator controller during a second phase.

A method for measuring temperature of a device includes measuring temperatures for each of a plurality of components or zones of the device and combining the temperatures measured into a device total temperature. A system for measuring temperature of a device includes a processor and a non-transitory memory component operatively coupled with the processor. The non-transitory memory component has, recorded thereto, computer readable instructions configured to cause the processor to measure temperatures for each of a plurality of components or zones of the device and combine the temperatures measured into a device total temperature.

A method for measuring temperature of a device includes measuring temperatures for each of a plurality of components or zones of the device and combining the temperatures measured into a device total temperature. A system for measuring temperature of a device includes a processor and a non-transitory memory component operatively coupled with the processor. The non-transitory memory component has, recorded thereto, computer readable instructions configured to cause the processor to measure temperatures for each of a plurality of components or zones of the device and combine the temperatures measured into a device total temperature.

A peak junction temperature monitoring system for a semiconductor device includes a peak power dissipation sensor for sensing the peak power dissipation in the device. A temperature sensor senses an average temperature of the device, and a peak junction temperature computation circuit generates a signal representative of a peak junction temperature based on input from the peak power dissipation sensor and the temperature sensor.

A peak junction temperature monitoring system for a semiconductor device includes a peak power dissipation sensor for sensing the peak power dissipation in the device. A temperature sensor senses an average temperature of the device, and a peak junction temperature computation circuit generates a signal representative of a peak junction temperature based on input from the peak power dissipation sensor and the temperature sensor.

Provided herewith is a thermometer that calculates an average temperature between a starting point and a target surface. Also provided is a method of calculating an average temperature in an open space, between a starting point and a target surface. In additional embodiments, a method of calculating a two dimensional average temperature gradient in an open space is provided. Further provided is a method of calculating a three dimensional average temperature gradient in an open space.