Patent classifications
G01K7/02
Temperature sensor of thermal monitoring system for use in power distribution systems
A temperature sensor of a thermal monitoring system is provided for use in power distribution systems. The temperature sensor comprises ceramic printed circuit board (PCB) and a terminal. The ceramic PCB includes a temperature sensing element disposed on a side of the ceramic PCB. The terminal is configured to be fixed directly in contact with a measured point and is directly in touch with the ceramic PCB such that heat is conducted from the terminal, through the ceramic PCB and then to the temperature sensing element. The temperature sensing element is configured to generate an electrical signal in response to the heat such that the electrical signal is sent through a pair of lead wires to a controller for monitoring a temperature. The temperature sensor further comprises an overmolded plastic material to seal a portion of the terminal, the ceramic PCB in its entirety and a portion of the pair of lead wires to ensure a desired physical strength and a desired dielectric strength.
Temperature sensor of thermal monitoring system for use in power distribution systems
A temperature sensor of a thermal monitoring system is provided for use in power distribution systems. The temperature sensor comprises ceramic printed circuit board (PCB) and a terminal. The ceramic PCB includes a temperature sensing element disposed on a side of the ceramic PCB. The terminal is configured to be fixed directly in contact with a measured point and is directly in touch with the ceramic PCB such that heat is conducted from the terminal, through the ceramic PCB and then to the temperature sensing element. The temperature sensing element is configured to generate an electrical signal in response to the heat such that the electrical signal is sent through a pair of lead wires to a controller for monitoring a temperature. The temperature sensor further comprises an overmolded plastic material to seal a portion of the terminal, the ceramic PCB in its entirety and a portion of the pair of lead wires to ensure a desired physical strength and a desired dielectric strength.
Thermowell with pressure sensing capabilities
A process fluid multivariable measurement system is provided. The multivariable measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. The multivariable measurement system also includes a temperature sensor assembly disposed within the thermowell, the temperature sensor assembly having at least one temperature sensitive element disposed therein. The multivariable measurement system also includes a pressure sensor assembly coupled to the thermowell, the pressure sensor assembly having at least one pressure sensitive element disposed therein. The multivariable measurement system further includes transmitter circuitry, communicatively coupled to the temperature sensor assembly and the pressure sensor assembly, configured to receive a temperature sensor signal from the at least one temperature sensitive element and responsively generate a temperature measurement output based on the temperature sensor signal. The transmitter circuitry is further configured to receive a pressure sensor signal from the at least one pressure sensitive element and responsively generate a pressure measurement output based on the pressure sensor signal.
Thermowell with pressure sensing capabilities
A process fluid multivariable measurement system is provided. The multivariable measurement system includes a thermowell configured to couple to a process fluid conduit and extend through a wall of the process fluid conduit. The multivariable measurement system also includes a temperature sensor assembly disposed within the thermowell, the temperature sensor assembly having at least one temperature sensitive element disposed therein. The multivariable measurement system also includes a pressure sensor assembly coupled to the thermowell, the pressure sensor assembly having at least one pressure sensitive element disposed therein. The multivariable measurement system further includes transmitter circuitry, communicatively coupled to the temperature sensor assembly and the pressure sensor assembly, configured to receive a temperature sensor signal from the at least one temperature sensitive element and responsively generate a temperature measurement output based on the temperature sensor signal. The transmitter circuitry is further configured to receive a pressure sensor signal from the at least one pressure sensitive element and responsively generate a pressure measurement output based on the pressure sensor signal.
IN-SITU TEMPERATURE CONTROLLING SAMPLE STAGE CUSTOMIZED FOR COUPLED INTERCONNECTION BETWEEN IN-SITU HIGH-PRESSURE REACTION CELL AND ULTRAHIGH VACUUM CHARACTERIZATION
The present disclosure relates to an in-situ temperature control platform, including an independent sample holder, a sample holder fixing cartridge, a customized sample stage and an anode contact pin. The independent sample holder includes a sample loading spot and a sample holder grip. The sample holder fixing cartridge includes a fixing cartridge body, the fixing cartridge body is provided with a sample holder slot, the bottom surface of the sample holder slot is provided with a heating element slot, and the sample holder slot is aligned with the sample loading spot. The bottom surface of the heating element slot is provided with a heating element fixing pinhole. The customized sample stage includes a sample stage body, the sample stage body is provided with a heating element support, and the heating element support is provided with a heating element.
Packaging apparatus for film inflation and method thereof
A packaging apparatus with an improved pinch roller apparatus, fluid supply apparatus, and/or a sealing apparatus. The pinch roller apparatus (e.g., comprising one or more guide and/or pinch rollers) is used to deliver film material to the fluid supply apparatus (e.g., nozzle and blower apparatus, or the like) that fills one or more chambers of the film material with fluid (e.g., air, gas, or other like fluid), and the film material is then sealed by a sealing apparatus (e.g., using one or more heating elements with an improved temperature sensor configuration) that seals the fluid within the one or more chambers in order to form the inflated article (e.g., inflated packaging material). In particular, the sealing apparatus provides improved sealing through the improved accuracy of the temperature reading in the heating zone, in part, by locating a sensor between a heating element and a protective member that covers the sensor.
Packaging apparatus for film inflation and method thereof
A packaging apparatus with an improved pinch roller apparatus, fluid supply apparatus, and/or a sealing apparatus. The pinch roller apparatus (e.g., comprising one or more guide and/or pinch rollers) is used to deliver film material to the fluid supply apparatus (e.g., nozzle and blower apparatus, or the like) that fills one or more chambers of the film material with fluid (e.g., air, gas, or other like fluid), and the film material is then sealed by a sealing apparatus (e.g., using one or more heating elements with an improved temperature sensor configuration) that seals the fluid within the one or more chambers in order to form the inflated article (e.g., inflated packaging material). In particular, the sealing apparatus provides improved sealing through the improved accuracy of the temperature reading in the heating zone, in part, by locating a sensor between a heating element and a protective member that covers the sensor.
Method and apparatus for calibration of substrate temperature using pyrometer
A method may include heating a substrate in a first chamber to a platen temperature, the heating comprising heating the substrate on a platen; measuring the platen temperature in the first chamber using a contact temperature measurement; transferring the substrate to a second chamber after the heating; and measuring a voltage decay after transferring the substrate to the second chamber, using an optical pyrometer to measure pyrometer voltage as a function of time.
Modular heater assembly with interchangeable auxiliary sensing junctions
A heater system is provided, which includes a plurality of heaters, a controller for supplying power to the plurality of heaters, a plurality sets of auxiliary wires extending from the plurality of heaters, and a wire harness for connecting the plurality sets of auxiliary wires to the controller. Each set of auxiliary wires includes three wires, two of the three wires being made of different materials and being joined to form a thermocouple junction, such that each of the plurality of heaters is operable to function as both a heater and a temperature sensor.
Modular heater assembly with interchangeable auxiliary sensing junctions
A heater system is provided, which includes a plurality of heaters, a controller for supplying power to the plurality of heaters, a plurality sets of auxiliary wires extending from the plurality of heaters, and a wire harness for connecting the plurality sets of auxiliary wires to the controller. Each set of auxiliary wires includes three wires, two of the three wires being made of different materials and being joined to form a thermocouple junction, such that each of the plurality of heaters is operable to function as both a heater and a temperature sensor.