The present disclosure relates to a method for determining and/or monitoring the temperature of a medium by means of a thermometer having at least one temperature sensor, the method including: determining a measured value for the temperature of the medium by means of a temperature sensor; determining a heat flow, in particular heat dissipation, in the region of the temperature sensor; and determining a measured value deviation for the measured value for the temperature on the basis of a model for heat dissipation in the region of the temperature sensor.

A pellet fueled apparatus having a continuous spark ignition system and swing-away warming rack is disclosed. The apparatus may include a power supply controller configured to cause a spark generator to create a continuous spark in a gap space between two electrodes for a duration greater than 2 seconds and up to 20 minutes uninterrupted. The apparatus, when embodied as a grill may include a warming rack that swings away from an underlying cooking surface when the grill lid is opened.

A pellet fueled apparatus having a continuous spark ignition system and swing-away warming rack is disclosed. The apparatus may include a power supply controller configured to cause a spark generator to create a continuous spark in a gap space between two electrodes for a duration greater than 2 seconds and up to 20 minutes uninterrupted. The apparatus, when embodied as a grill may include a warming rack that swings away from an underlying cooking surface when the grill lid is opened.

Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

Example apparatuses and systems for a combined temperature and pressure sensing device with improved electronic protection are provided. An example apparatus includes a media isolation chamber assembly having a sleeve member and a bellows member, a first circuit board element disposed in the bellows member and encapsulated by insulator media in the bellows member, a pressure sensing element disposed in the bellows member and electrically coupled to the first circuit board element; and a temperature sensing element disposed in the sleeve member and electrically coupled to the first circuit board element.

A method can include, in response to a power supply voltage transition, setting a temperature window to a first temperature range by operation of a temperature circuit formed on a semiconductor device. In response to a temperature of the semiconductor device being determined to be outside of the first temperature range, changing the temperature range of the temperature window until the temperature of the semiconductor device is determined to be within the temperature window.

A method can include, in response to a power supply voltage transition, setting a temperature window to a first temperature range by operation of a temperature circuit formed on a semiconductor device. In response to a temperature of the semiconductor device being determined to be outside of the first temperature range, changing the temperature range of the temperature window until the temperature of the semiconductor device is determined to be within the temperature window.

A heating system includes at least one electric heater disposed within a fluid flow system and a control device that is configured to determine a temperature of the at least one electric heater based on a model, at least one fluid flow system input, and at least one heater input. The at least one heater input includes at least one physical characteristic of the heating system, the at least one physical characteristic includes at least one of a resistance wire diameter, a heater insulation thickness, a heater sheath thickness, a conductivity, a specific heat and density of the material of the heater, an emissivity of the heater and the fluid flow pathway, and combinations thereof. The control device is configured to provide power to the at least one electric heater based on the temperature of the at least one electric heater.

A heating system includes at least one electric heater disposed within a fluid flow system and a control device that is configured to determine a temperature of the at least one electric heater based on a model, at least one fluid flow system input, and at least one heater input. The at least one heater input includes at least one physical characteristic of the heating system, the at least one physical characteristic includes at least one of a resistance wire diameter, a heater insulation thickness, a heater sheath thickness, a conductivity, a specific heat and density of the material of the heater, an emissivity of the heater and the fluid flow pathway, and combinations thereof. The control device is configured to provide power to the at least one electric heater based on the temperature of the at least one electric heater.

Thermal temperature sensors for power amplifiers are provided herein. In certain implementations, a semiconductor die includes a compound semiconductor substrate, and a power amplifier including a plurality of field-effect transistors (FETs) configured to amplify a radio frequency (RF) signal. The plurality of FETs are arranged on the compound semiconductor substrate as a transistor array. The semiconductor die further includes a semiconductor resistor configured to generate a signal indicative of a temperature of the transistor array. The semiconductor resistor is located adjacent to one end of the transistor array.