The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.

The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.

The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.

The structure of a micro-electro-mechanical system (MEMS) thermal sensor and a method of fabricating the MEMS thermal sensor are disclosed. A method of fabricating a MEMS thermal sensor includes forming first and second sensing electrodes with first and second electrode fingers, respectively, on a substrate and forming a patterned layer with a rectangular cross-section between a pair of the first electrode fingers. The first and second electrode fingers are formed in an interdigitated configuration and suspended above the substrate. The method further includes modifying the patterned layer to have a curved cross-section between the pair of the first electrode fingers, forming a curved sensing element on the modified patterned layer to couple to the pair of the first electrodes, and removing the modified patterned layer.

The present disclosure relates to a temperature detection circuit, a display panel, and a display device. The temperature detection circuit includes: an odd number of inverters coupled end to end in series to form a loop; and a plurality of switches, two terminals of each of which correspondingly coupled to two terminals of an even number of inverters, which are coupled continuously, among the odd number of inverters.

A temperature detection device includes: a detection processing unit configured to transmit a transmission radio wave, simultaneously receive a response radio wave corresponding to the transmission radio wave, and detect whether a temperature of an object to be measured is normal or abnormal based on the response radio wave; and a temperature sensing unit configured to receive the transmission radio wave and transmit the response radio wave responding to the transmission radio wave. The detection processing unit calculates, from the response radio wave received via a second antenna, an amplitude, a phase, or a quadrature phase amplitude of the response radio wave and compares the temperature of the object to be measured to a temperature determined in advance based on a result of the calculation.

A temperature detection device includes: a detection processing unit configured to transmit a transmission radio wave, simultaneously receive a response radio wave corresponding to the transmission radio wave, and detect whether a temperature of an object to be measured is normal or abnormal based on the response radio wave; and a temperature sensing unit configured to receive the transmission radio wave and transmit the response radio wave responding to the transmission radio wave. The detection processing unit calculates, from the response radio wave received via a second antenna, an amplitude, a phase, or a quadrature phase amplitude of the response radio wave and compares the temperature of the object to be measured to a temperature determined in advance based on a result of the calculation.

The present disclosure discloses a temperature sensor, a display panel, and a display apparatus, in the field of sensors. The temperature sensor includes a ring oscillator consisting of n levels of phase inverters, where n is an odd number greater than or equal to 1. Each level of phase inverter includes a first thin film transistor (TFT) and a second TFT that are connected in series. An on/off state of the second TFT is configured to be in a normally-on state, an on/off state of the first TFT is configured to be determined by a signal input to the phase inverter, and mobility of an active layer material of the first TFT is greater than mobility of an active layer material of the second TFT.

A dual-output microelectromechanical system (MEMS) resonator can be operated selectively and concurrently in an in-plane mode of vibration and an out-of-plane mode of vibration to obtain, respectively, a first electrical signal having a first frequency and a second electrical signal having a second frequency that is less than the first frequency. The first and second electrical signals are mixed to obtain a third electrical signal having a third frequency, where the third frequency is proportional to a temperature of the MEMS resonator. The temperature is determined based on the third frequency. Values of the first and second frequencies can be adjusted based on the determined temperature to compensate for frequency deviations due to temperature deviations. Also described herein are methods and systems for determining the temperature of the dual-output MEMS and for performing frequency compensation, as well as a method of manufacturing the dual-output MEMS.

Determination of one or more operating conditions (leakage current, temperature and/or workload) of a functional transistor in a semiconductor integrated circuit (IC). The functional transistor provides an electrical current, which is provided as an input to a ring oscillator (ROSC). The ROSC is located in the IC proximate to the functional transistor and has an oscillation frequency in operation. The one or more operating conditions of the functional transistor are determined based on the oscillation frequency of the ROSC.