Apparatuses are presented. The apparatus includes a sensor configured with an adjustable accuracy setting to measure a physical parameter and a controller configured to adjust the accuracy setting based on a threshold, and to adjust the threshold based on the physical parameter measured by the sensor. Another apparatus includes a sensor configured with a plurality of sensor accuracy settings to measure a physical parameter of a circuit in a plurality of operating regions. The plurality of operating regions is based on ranges of the physical parameter measured by the sensor. Each of the plurality of sensor accuracy settings corresponds to one of the plurality of operating regions. A controller is configured to adjust one of the ranges of the physical parameter for one of the plurality of operating regions, in response to a change of an operating condition of the circuit.

A biological data measurement device in which a living organism having a first thermal resistance Rth1 from a core to a surface is a measuring object, includes a heat insulating layer which is disposed on a body surface of the measuring object and has a second thermal resistance Rth2; a measurement device for measuring a first and a second temperatures, which is segregated by the heat insulating layer; and an adding device for adding a predetermined delay time to the second temperature in order to correct a response delay of the first temperature as compared with the second temperature. The first temperature is a bottom side temperature of a bottom surface of the heat insulating layer, which is in contact with the body surface, and the second temperature is a top side temperature of a top surface of the heat insulating layer.

A semiconductor device includes first and second electrode pads for externally connecting two electrodes of a sensor capacitor that has a capacitance that changes according to an environmental change. The semiconductor device further includes a capacitor having a pair of electrodes, one of the pair of electrodes being connected to the first electrode pad, a capacitance circuit having a reference capacitance, and a determination circuit that includes first and second relay terminals. The determination circuit is configured to send a charging current from the first relay terminal to the other electrode of the capacitor and send a charging current from the second relay terminal to the capacitance circuit, and determine whether or not the size of a potential of the first relay terminal is greater than the size of a potential of the second relay terminal, thereby determining whether a capacitance of the sensor capacitor has changed or not.

A sensorless temperature sensing and control system and method uses electrical voltage and current feedback signals to monitor and control the temperature of heating elements used in a heat sealing process wherein sensors are not physically connected to a heat seal bar during the heat sealing process. After calibration of a heat seal bar using a sensor, voltage and current feedback signals are processed by a programmable logic controller (PLC) to calculate the real-time electrical resistance of each heating element. Data and electrical resistance is used to calculate real-time temperature of the heat seal bar during heating.

A device for local temperature measurement that is suitable for taking temperature measurements of an immediate vicinity of said device. The device comprises: a cell comprising a heat-conductive base and at least one first material having a predetermined fixed state-change temperature and arranged in said base; a heat-energy transfer device thermally connected to said base and said at least one first material; a local temperature measurement probe received in said base and in thermal contact with said at least one first material, the heat-energy transfer device being suitable for causing a change of state of said first material in order to carry out at least one metrological verification of the local temperature measurement probe. An associated cell and method for use are also provided.

A temperature detection system includes a housing, a thermal imaging system at least partially disposed within the housing, and a data correction system communicatively coupled with the thermal imaging system . The thermal imaging system is configured to capture at least one thermal image of a subject. The data correction system is configured to correct at least one error associated with the at least one thermal image of the subject.

A method includes post processing a plurality of temperature sensors grouped into a plurality of sets. For each set of the plurality of sets, a post-processing system coupled to corresponding temperature sensors receives a plurality output signals generated by the corresponding temperature sensors. For each set of the plurality of sets, the post-processing system computes values representing proportional to absolute temperature (PTAT) voltages and values representing internal reference voltages based on output signals generated by the corresponding temperature sensors. For each set of the plurality of sets, the post-processing system computes an average of the values representing the PTAT voltages and relative PTAT voltage variation coefficients. For each set of the plurality of sets, the post-processing system computes values representing corrected PTAT voltages using the relative PTAT voltage variation coefficients.

A temperature measurement system for measuring a temperature of a measured surface includes: 1) a first temperature sensor; and 2) a reference surface including a second temperature sensor integrated therein. The first temperature sensor includes a field of view simultaneously covering both at least a portion of the measured surface and at least a portion of the reference surface, thus is configured for simultaneously taking a first measurement of both the portion of the measured surface and the portion of the reference surface. The first measurement of the reference surface taken by the first temperature sensor is compared to a second measurement taken by the second temperature sensor for use in calibrating the first temperature sensor.

Implementations described herein generally relate to semiconductor manufacturing, and more specifically to a temperature measurement device. In one implementation, the temperature measurement device includes a substrate and a stack of metal layers coupled to the substrate. Each metal layer of the stack of metal layers extends continuously uninterrupted from edge to edge of the substrate. The first metal layer has a lower electrical resistivity than the second metal layers. The electrical resistivity of the stack is based on the electrical resistivity of the first metal layer, which is temperature dependent. Utilizing a known relationship between temperature measurements and resistivity measurements, the temperature measurement device can measure and store temperature information in various substrate processing processes.

An on-chip temperature sensor for generating a digital output signal representing a temperature value includes: a proportional to absolute temperature (PTAT) buffer for alternately generating a first voltage signal representing a first temperature of the PTAT buffer and a second voltage signal representing a second temperature of the PTAT buffer; an analog to digital (A/D) converter, coupled to the PTAT buffer, for converting the first voltage signal to a first digital voltage signal and for converting the second voltage signal to a second digital voltage signal; and a digital output generating block, for receiving the first digital voltage signal and the second digital voltage signal, and comparing a difference between the first digital voltage signal and the second digital voltage signal with a digital voltage reference signal to generate the digital output signal.