A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

An apparatus includes a sensor assembly. The sensor assembly includes a transmission-line assembly having an electrical transmission-line parameter configured to change, at least in part, in response to reception, at least in part, of a vehicular load of a moving vehicle moving relative to a vehicular roadway to the transmission-line assembly positionable, at least in part, relative to the vehicular roadway.

An apparatus includes a sensor assembly. The sensor assembly includes a transmission-line assembly having an electrical transmission-line parameter configured to change, at least in part, in response to reception, at least in part, of a vehicular load of a moving vehicle moving relative to a vehicular roadway to the transmission-line assembly positionable, at least in part, relative to the vehicular roadway.

Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

A semiconductor device includes a strain gauge on a substrate, the strain gauge configured to measure a stress of the substrate; and a temperature sensor disposed within the substrate, the temperature sensor being decoupled from the stress of the substrate.

Systems, apparatus and methods are provided for measuring moving vehicle information. Moving vehicle information may be measured by a sensor configured to respond to one or more wheels of the moving vehicle, where one or more of the wheels change the characteristic impedance of the sensor at the wheel's contact location. An electrical time domain reflectometry signal processing system which is capable of measuring the change in the impedance of the sensor and converting the impedance change to a signal may be connected operatively to the sensor. A data-processing system receives the signal and extracts the moving vehicle information therefrom.

Systems, apparatus and methods are provided for measuring moving vehicle information. Moving vehicle information may be measured by a sensor configured to respond to one or more wheels of the moving vehicle, where one or more of the wheels change the characteristic impedance of the sensor at the wheel's contact location. An electrical time domain reflectometry signal processing system which is capable of measuring the change in the impedance of the sensor and converting the impedance change to a signal may be connected operatively to the sensor. A data-processing system receives the signal and extracts the moving vehicle information therefrom.

In one general aspect, a composite foam comprises a non-layered mixture of a polymeric foam with a plurality of voids; and a plurality of conductive fillers disposed in the polymeric foam. The conductive fillers are disposed in an even manner from outer surface to outer surface. In some implementations, the conductive fillers are up to 25% by weight of the composite foam. In some implementations, the composite foam may be used as padding. In some implementations, the composite foam may be used as a strain gauge.