Patent classifications
G01L5/0047
Nut, in Particular Wheel or Axle Nut, Washer, Control Device for Wheel or Axle Nuts in Vehicles and Vehicle Provided Therewith
A nut, or a washer for a nut, in particular a wheel nut or axle nut for vehicles, having a body, having a central threaded hole, having a peripheral wall, having an abutment face at a lower side, wherein the nut also has a plurality of wrench faces on the peripheral wall of the nut body for tightening or releasing the nut by means of a tool which cooperates with the wrench faces. In order to be able to detect the loosening of wheel nuts or axle nuts of vehicles, and to indicate such loosening to a vehicle driver to avoid dangerous situations during driving, there is provided in the body at least one recess in which a sensor element is arranged, wherein the sensor element is connected to a wireless interface which is configured to transmit a sensor signal of the sensor element wirelessly to an external reception unit.
System, Method, and Apparatus for Automating Specimen Testing
Described is a test head for a residual seal force (RSF) testing system. The test head includes a housing, an anvil, and a ball roller assembly. The housing defines a first cavity and the anvil is positioned at least partially within the first cavity. The ball roller assembly is configured to provide a point of contact between the housing and the anvil during a RSF test. The test head may further comprise a retaining ring configured to maintain the anvil at least partially within the first cavity.
Measuring deflection to determine a characteristic of a cantilever
Disclosed are methods that, by not physically touching a material being measured, can measure the material's differential response quite accurately. A collimated light shines on the material under test, is reflected off it, and is then captured by a device that records the position where the reflected light is captured. This process is done both before and after the material is processed in some way (e.g., by applying a coat of paint). The change in position where the reflected light is captured is used in calculating the deflection of the material as induced by the process. This measured induced deflection is then used to accurately determinate the stress introduced into the material by the process. Other characteristics of the material under test, such as aspects of the material composition of a bi-metallic strip, for example, may also be determined from a deflection measurement.
ULTRASONIC TEST DEVICE AND TEST METHOD FOR SERVICE STRESS OF A MOVING MECHANICAL COMPONENT
An ultrasonic test device and test method for service stress of a moving mechanical component, where the device comprises an ultrasonic probe, a coupling fluid, a pressure-maintaining cover and universal wheels. The cover is vertically arranged above an inspected position of an inspected component, an interior of the pressure-maintaining cover is filled with coupling fluid, a bottom of the cover is provided with a structure permeable to the coupling fluid to form a coupling fluid film between the inspected position and the bottom of the cover, and a top of the cover is equipped with the ultrasonic probe. A detection part at a lower part of the ultrasonic probe extends into the coupling fluid of the cover and is vertical to the bottom of the cover without contact. The distance between the ultrasonic probe and the inspected component is kept unchanged through the universal wheels.
DEVICE AND METHOD FOR ASCERTAINING A MECHANICAL STRESS COMPONENT BY MEANS OF A HALL SENSOR CIRCUIT
The subject matter described herein relates to a semiconductor circuit arrangement with a semiconductor substrate with an integrated Hall sensor circuit. During a first clock phase PH.sub.spin1 a first electrical voltage signal ±V.sub.Hallout(PH.sub.spin1) or ±V.sub.Hallbias(PH.sub.spin1) can be generated in the Hall effect region that has a first dependency on a mechanical stress of the semiconductor substrate. During a second clock phase PH.sub.spin2 a second electrical voltage signal ±V.sub.Hallout(PH.sub.spin2) or ±V.sub.Hallbias(PH.sub.spin2) can be generated in the Hall effect region that has a second dependency on a mechanical stress of the semiconductor substrate. The semiconductor circuit arrangement is designed to ascertain a specific mechanical stress component based on a combination of the first electrical voltage signal +V.sub.Hallout(PH.sub.spin1) or ±V.sub.Hallbias(PH.sub.spin1) and of the second electrical voltage signal ±V.sub.Hallout(PH.sub.spin2) or ±V.sub.Hallbias(PH.sub.spin2).
METHOD FOR MEASURING RESIDUAL STRESS OF CURVED-SURFACE BULK MATERIAL
A method for measuring a residual stress of a curved-surface bulk material includes steps of: locating a point at which a to-be-detected curved surface of a curved-surface bulk material has a highest curvature as a to-be-detected point; applying an instrument integrating an X-ray light resource and a detector, measuring the to-be-detected point by using an X-ray diffraction theory, and analyzing and calculating, in combination with a cos α method, a strain value measured by using the instrument; and calculating, in combination with material property measurement data of the curved-surface bulk material, a curved-surface residual stress by introducing a curved-surface bulk material residual stress calculation model.
Non-destructive detecting method for weld residual stress and a probe using the same
The present disclosure provides a non-destructive detecting method for weld residual stress and a probe using the same, in the above method, detecting is performed by an ultrasonic detecting probe in contact with a detected portion of a workpiece to be detected, wherein when the weld residual stress of an intersecting curve weld bead of surfaces of cylinders is detected, for the same position of the intersecting curve weld bead, one of the residual stress of an axial direction of the cylinders and the residual stress of a circumferential direction of the cylinders is detected as a principal stress. For the surface of the cylinder at one side of the intersecting curve weld bead, the detecting of the weld residual stress of the surface of the cylinder can be realized only by using an ultrasonic detecting probe having one type of curved surface.
Film tensioning techniques for additive fabrication and related systems and methods
Techniques for film tensioning in additive fabrication are provided. According to some aspects, a film forming part of a container in an additive fabrication device may be tensioned by different forces along different axes. According to some embodiments, an adjustable tensioning system may be provided within an additive fabrication device that may couple to one or more components of a removable container comprising a film. The tension of the film may be adjusted by the additive fabrication device via the adjustable tensioning system and its coupling to the container.
METHOD FOR MEASURING RESIDUAL STRESS
A method measuring a residual stress of a fillet portion, where an angle of incidence of X-rays denoted by Ψ [°], a fillet radius denoted by R [mm], a fillet angle denoted by θ [°], a vertical width of a housing of an X-ray stress measuring apparatus denoted by W [mm], a width of a detection region of a two-dimensional detector denoted by D [mm], a complementary angle of a Bragg angle denoted by η [°], and an interval between a flange portion and an imaginary straight line which passes through a fillet center and is parallel to the flange portion denoted by a [mm], formula 1 is satisfied; when Ψ ≥ 0, an irradiation distance L [mm] of the X-rays, the irradiation distance L satisfies formula 2; and when Ψ < 0, the irradiation distance L satisfies formula 3.
Process-induced distortion prediction and feedforward and feedback correction of overlay errors
Systems and methods for prediction and measurement of overlay errors are disclosed. Process-induced overlay errors may be predicted or measured utilizing film force based computational mechanics models. More specifically, information with respect to the distribution of film force is provided to a finite element (FE) model to provide more accurate point-by-point predictions in cases where complex stress patterns are present. Enhanced prediction and measurement of wafer geometry induced overlay errors are also disclosed.