A sensor device including: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip.

A chip package includes a chip, a dam layer, a permanent adhesive layer, a support, a buffer layer, a redistribution layer, a passivation layer, and a conducting structure. A conducting pad and a sensing device of the chip are located on a first surface of a substrate of the chip, and the conducting pad protrudes from the side surface of the substrate. The dam layer surrounds the sensing device. The permanent adhesive layer is between the support and the substrate. The support and the permanent adhesive layer have a trench to expose the conducting pad. The buffer layer is located on the support. The redistribution layer is located on the buffer layer and on the support, the permanent adhesive layer, and the conducting pad facing the trench. The passivation layer covers the redistribution layer, the buffer layer, and the conducting pad.

A sensor device including: a first substrate having a bottom surface and a top surface; a second substrate having a bottom surface and a top surface, a media channel having two vertical sections and a horizontal section, wherein the two vertical sections are through the second substrate, a portion of the bottom surface of the second substrate forms a top surface of the horizontal section, and a portion of the top surface of the first substrate forms a bottom surface of the horizontal section; a sensor chip disposed on one of the two vertical sections of the media channel; and a molding compound covering side surfaces of the first substrate, the second substrate, and the sensor chip.

A pressure sensor device includes a pressure sensor having a housing positioned on a center axis extending vertically, a sensing hole provided in a lower part of the housing, and an electrode unit provided in an upper part of the housing; and a connecting member having a contact spring that is pressed against the electrode unit of the pressure sensor. The electrode unit includes a first frame-shaped electrode having a frame-like shape that is rotationally symmetrical with respect to the center axis; and an annular first-surface portion on which the first frame-shaped electrode is placed.

The invention relates to a pressure measurement device (1) comprising: a pressure sensor (3) for securing to an element having a pressure that is to be measured; and a stationary portion (5) facing a path of the sensor so as to be in resonant high frequency AC electrical relationship with the sensor in order to power the sensor and in order to receive measurements acquired by the sensor.

The invention also relates to a measurement system including such a measurement device.

A sensor for detecting pressure and/or filling level and/or flow rate and/or density and/or mass and/or temperature, wherein a sensor component is coupled to a further sensor component by nanowires, and wherein the sensor components are fixed, sealed or electrically contacted to one another. For example, a sensor component is connected directly to a printed circuit board through nanowires.

A protective cover for an electronic device for instance a measuring cell including a ceramic pressure measuring cell, that includes at least one connecting element that provides a data connection, the protective cover having an electrical circuit for instance an application-specific integrated circuit.

A pressure sensor to measure the pressure of a fluid comprises: a metallic membrane to be in contact with the fluid and on which are stacked an electrical insulator and at least one gauge for measuring the deformation of the membrane, the whole forming a sensitive measuring element a cap comprising: a cover comprising a cavity and holes; conductors located in the holes, the sensitive element exhibiting a face opposite the cap and located in a plane P; wherein the sensor comprises: at least one metallic zone, located in a plane parallel to said plane P, for hermetic sealing of the cap on the sensitive measuring element; continuous metallic tracks comprising parts for picking up contact with the conductors and parts for picking up contact with at least the gauge. A method for manufacturing the pressure sensor is also provided.

A connector includes a resin-made connector body and a pressure sensor. The connector body includes a first main tubular part that is connected to a first pipe, a second main tubular part that is connected to a second pipe, and a sensor mounting part. The first main tubular part and the second main tubular part connect with each other to form an angle. The sensor mounting part includes: a tubular intake part that is formed in line with a line extending from one of the first main tubular part and the second main tubular part and has a bottom face; and a sensor mounting seat that is capable of being mounted with the pressure sensor and communicates with a peripheral-surface opening of the tubular intake part.

A connection device for a pressure sensor includes a supporting unit and a circuit board. The circuit board carries an electronic circuit having at least one of at least one electronic component and at least one electrical component. The supporting unit includes a multi-part main body that is electrically and mechanically connected to the circuit board via at least one soldered connection. The supporting unit further forms an external interface having at least one electrical contact point that enables tapping of at least one electrical output signal of the electronic circuit, and that is electrically connected to a corresponding contact point of the circuit board via an electrical connection. A pressure sensor includes such a connection device, and a method pertains to producing such a connection device.