A pressure sensor has a stem in which a pressure introduction hole into which a pressure medium is introduced and a diaphragm deformable according to the pressure of the pressure medium are formed, and a strain detecting element which is arranged on the diaphragm via an insulating film and being configured to output a detection signal according to the deformation of the diaphragm. The strain detecting element is configured to have a portion made of polysilicon. A low doping layer having a higher electrical resistivity than polysilicon and a higher crystallinity than the insulating film is arranged between the insulating film and the strain detecting element.

A noise resistance of a pressure sensor is improved while avoiding a hetero metal bonding. A pressure detection device includes a metal case having the diaphragm which is deformed due to a pressure received from a pressure medium, a sensor element which detects a pressure by detecting the deformation of the diaphragm, a lead frame which is electrically connected to the sensor element, and a connection member which holds the lead frame. A first surface of the lead frame, that is, the surface on a side near the metal case in the parallel plate region, and a second surface of the metal case, that is, the upper surface of the base member interpose at least one of the resin of the connection member being an insulator and the insulating adhesive and are disposed to face each other with a predetermined gap therebetween.

A device having both an electronic assembly having an electronic component assembled on a first substrate, and also a body defining a cavity having a first end in fluid flow communication with a fluid, the electronic component extending inside the cavity and the first substrate including a portion in contact with a wall of the cavity. The coefficient of thermal expansion of the material of the first substrate is less than that of the electronic component, and the electronic component is assembled on the first substrate by a brazing type assembly method involving the application of heat. A method of making an electronic assembly. An assembly obtained by the method.

A pressure sensor device includes a semiconductor die having a die surface that includes a pressure sensitive area; and a bond wire bonded to a first peripheral region of the die surface and extends over the die surface to a second peripheral region of the die surface, wherein the pressure sensitive area is interposed between the second peripheral region and the first peripheral region, wherein the bond wire comprises a crossing portion that overlaps an area of the die surface, and wherein the crossing portion extends over the pressure sensitive area that is interposed between the first and the second peripheral regions.

A sensor chip (24) is joined to an inner wall surface (20a) of a base body (21-1), with a lower surface (24a) of a first retaining member (24-2) serving as a joint surface, in such a manner as to allow an enclosing chamber (23) (including a pressure receiving chamber (23-1) and a pressure guiding passage (23-2)) between a pressure receiving diaphragm (22) and the joint surface (24a) of the sensor chip (24) to communicate with a pressure guiding hole (24-2b) in the first retaining member (24-2). In this state, a narrow tube (31) made of stainless steel is passed through the pressure guiding passage (23-2) in the base body (21-1) and inserted and secured in the pressure guiding hole (24-2b) in the first retaining member (24-2). This reduces the pressure receiving area of a pressure guiding passage that guides a pressure (P1) of a measured fluid to a first surface (24-1a) of a sensor diaphragm (24-1), suppresses force applied in the direction of separating the joint between the sensor chip (24) and the base body (21-1), and makes it possible to use a soft adhesive.

A sensor device for a vehicle, in particular a motor vehicle, includes at least one sensor module and at least one connecting line connected to the sensor module for making electrical contact with the sensor module. The connecting line is formed as a conductor film, on which a plurality of different sensor modules are arranged and are housed by respectively one or a common encapsulation encompassing the conductor film, at least in some sections.

A temperature-pressure integrated sensor, includes the following sequentially connected components: an electrical connecting member (1), a pressure sensor element (2), and a basal body assembly (3). A flexible modulation circuit board (4) is provided between the pressure sensor element (2) and the electrical connecting member (1). The pressure sensor element (2) is electrically connected to the flexible modulation circuit board (4). The flexible modulation circuit board (4) is connected to a conductive extension portion (401). A bottom end of the conductive extension portion (401) is provided with a temperature sensor element (5). The flexible modulation circuit board (4) is coupled to the pressure sensor element (2) and the temperature sensor element (5), such that the flexible modulation circuit (4) processes and converts both a pressure signal and a temperature signal, and a temperature-pressure integrated sensor is acquired.

A pressure sensor device includes a semiconductor die of the pressure sensor device and a bond wire of the pressure sensor device. A maximal vertical distance between a part of the bond wire and the semiconductor die is larger than a minimal vertical distance between the semiconductor die and a surface of a gel covering the semiconductor die.

A pressure detection chip and a method for detection pressure are disclosed. The method is executed by a pressure detection apparatus including a cancellation circuit and a coupling circuit in parallel; the coupling circuit includes a variable capacitance component having a first electrode layer and a second electrode layer. The method for detection pressure includes: inputting a first input signal to the cancellation circuit and outputting a first output signal; and inputting a second input signal to the coupling circuit and outputting a second input signal, where the first input signal and the second input signal are 180 degrees out of phase, and the first output signal is configured to cancel the second output signal; and determining whether the first electrode layer is subjected to the touch pressure, according to the first output signal and the second output signal.

A sensing device including a sensitive part and a first sensor. The sensitive part includes a sealed internal space. At least part of the sensitive part is flexible and configured to be flexed, by a load applied on the sensitive part or by vibration of the sensitive part, so as to change an air pressure in the internal space. The first sensor borders the internal space or is at least partly housed in the internal space. The first sensor includes at least one sensing part configured to detect changes in the air pressure in the internal space.